| W25Q128FVCJF TR | General Memory ICs | The W25Q128FVCJF TR is a memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVCJF TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TBGA | RFQ for sourcing | $89.99 | OBSOLETE | RFQ |
| W25Q128FVCJQ | General Memory ICs | The W25Q128FVCJQ is a memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVCJQ is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128FVCJQ TR | General Memory ICs | The W25Q128FVCJQ TR is a memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVCJQ TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128FVEAQ | Flash Memory | The W25Q128FVEAQ is a flash memory IC manufactured by Winbond Electronics. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVEAQ is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | — | 2.528 In Stock | RFQ | LASTBUY | RFQ |
| W25Q128FVEBQ | Flash Memory | The W25Q128FVEBQ is a flash memory IC manufactured by Winbond Electronics. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVEBQ is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | — | 863 In Stock | RFQ | LASTBUY | RFQ |
| W25Q128FVEIF | Flash Memory | The W25Q128FVEIF is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVEIF is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128FVEIF TR | Flash Memory | The W25Q128FVEIF TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVEIF TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | $1.60 | OBSOLETE | RFQ |
| W25Q128FVEIG | Flash Memory | The W25Q128FVEIG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVEIG is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | $9.69 | OBSOLETE | RFQ |
| W25Q128FVEIG TR | Flash Memory | The W25Q128FVEIG TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVEIG TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | $1.60 | OBSOLETE | RFQ |
| W25Q128FVEIP | Flash Memory | The W25Q128FVEIP is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVEIP is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | $89.99 | OBSOLETE | RFQ |
| W25Q128FVEIQ | Flash Memory | The W25Q128FVEIQ is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVEIQ is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128FVEIQ TR | Flash Memory | The W25Q128FVEIQ TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVEIQ TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | $1.63 | OBSOLETE | RFQ |
| W25Q128FVEJQ | Flash Memory | The W25Q128FVEJQ is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVEJQ is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128FVEJQ TR | Flash Memory | The W25Q128FVEJQ TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVEJQ TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128FVFAP | Flash Memory | The W25Q128FVFAP is a flash memory IC manufactured by Winbond Electronics. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVFAP is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | — | 1.444 In Stock | RFQ | LASTBUY | RFQ |
| W25Q128FVFAQ | Flash Memory | The W25Q128FVFAQ is a flash memory IC manufactured by Winbond Electronics. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVFAQ is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | — | 2.403 In Stock | RFQ | LASTBUY | RFQ |
| W25Q128FVFBQ | Flash Memory | The W25Q128FVFBQ is a flash memory IC manufactured by Winbond Electronics. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVFBQ is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | — | 10 In Stock | RFQ | LASTBUY | RFQ |
| W25Q128FVFIF | Flash Memory | The W25Q128FVFIF is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVFIF is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128FVFIF TR | Flash Memory | The W25Q128FVFIF TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVFIF TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $89.99 | OBSOLETE | RFQ |
| W25Q128FVFIG | Flash Memory | The W25Q128FVFIG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128FVFIG is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $1.43 | OBSOLETE | RFQ |