| W25Q128BVBAG | Flash Memory | The W25Q128BVBAG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 63-VFBGA package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVBAG is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 63-VFBGA | 1.710 In Stock | $89.99 | LASTBUY | RFQ |
| W25Q128BVBAP | Flash Memory | The W25Q128BVBAP is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 63-VFBGA package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVBAP is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 63-VFBGA | 2.113 In Stock | RFQ | LASTBUY | RFQ |
| W25Q128BVBBG | Flash Memory | The W25Q128BVBBG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 63-VFBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVBBG is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 63-VFBGA | 1.107 In Stock | RFQ | LASTBUY | RFQ |
| W25Q128BVBJG | General Memory ICs | The W25Q128BVBJG is a memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVBJG is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TBGA | RFQ for sourcing | $89.99 | OBSOLETE | RFQ |
| W25Q128BVBJG TR | General Memory ICs | The W25Q128BVBJG TR is a memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVBJG TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128BVBJP | General Memory ICs | The W25Q128BVBJP is a memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVBJP is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128BVBJP TR | General Memory ICs | The W25Q128BVBJP TR is a memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVBJP TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TBGA | RFQ for sourcing | $89.99 | OBSOLETE | RFQ |
| W25Q128BVBSG | Flash Memory | The W25Q128BVBSG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 24-TBGA package and is rated for operation across -40°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVBSG is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 24-TBGA | 1.460 In Stock | RFQ | LASTBUY | RFQ |
| W25Q128BVEAG | Flash Memory | The W25Q128BVEAG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVEAG is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 8-WDFN Exposed Pad | 2.375 In Stock | RFQ | LASTBUY | RFQ |
| W25Q128BVEBG | Flash Memory | The W25Q128BVEBG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVEBG is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 8-WDFN Exposed Pad | 1.940 In Stock | $89.99 | LASTBUY | RFQ |
| W25Q128BVEIG | Flash Memory | The W25Q128BVEIG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVEIG is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | $0.6593 | OBSOLETE | RFQ |
| W25Q128BVEJG | Flash Memory | The W25Q128BVEJG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVEJG is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128BVEJG TR | Flash Memory | The W25Q128BVEJG TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVEJG TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | $89.99 | OBSOLETE | RFQ |
| W25Q128BVEJP | Flash Memory | The W25Q128BVEJP is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVEJP is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128BVEJP TR | Flash Memory | The W25Q128BVEJP TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVEJP TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128BVESG | Flash Memory | The W25Q128BVESG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVESG is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 8-WDFN Exposed Pad | 1.306 In Stock | RFQ | LASTBUY | RFQ |
| W25Q128BVFAG | Flash Memory | The W25Q128BVFAG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVFAG is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 16-SOIC (0.295", 7.50mm Width) | 2.658 In Stock | RFQ | LASTBUY | RFQ |
| W25Q128BVFBG | Flash Memory | The W25Q128BVFBG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVFBG is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders. | 16-SOIC (0.295", 7.50mm Width) | 2.628 In Stock | RFQ | LASTBUY | RFQ |
| W25Q128BVFJG | Flash Memory | The W25Q128BVFJG is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVFJG is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| W25Q128BVFJG TR | Flash Memory | The W25Q128BVFJG TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 128Mb (16M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 105°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q128BVFJG TR is no longer produced by Winbond Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |