| BUK209-50Y,127 | Power Distribution Switches | The BUK209-50Y,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK209-50Y,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | $0.1950 | OBSOLETE | RFQ |
| BUK210-50Y,127 | Power Distribution Switches | The BUK210-50Y,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK210-50Y,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK2114-50SYTS,118 | Power Distribution Switches | The BUK2114-50SYTS,118 is a power distribution IC manufactured by NXP Semiconductors. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK2114-50SYTS,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK212-50Y,127 | Power Distribution Switches | The BUK212-50Y,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK212-50Y,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK213-50Y,118 | Power Distribution Switches | The BUK213-50Y,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK213-50Y,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | $6.53 | OBSOLETE | RFQ |
| BUK214-50Y,118 | Power Distribution Switches | The BUK214-50Y,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK214-50Y,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK215-50Y,118 | Power Distribution Switches | The BUK215-50Y,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK215-50Y,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | $6.32 | OBSOLETE | RFQ |
| BUK217-50Y,118 | Power Distribution Switches | The BUK217-50Y,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK217-50Y,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK217-50YT,118 | Power Distribution Switches | The BUK217-50YT,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK217-50YT,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | $11.34 | OBSOLETE | RFQ |
| BUK218-50DY,118 | Gate Drivers | The BUK218-50DY,118 is a combinational logic IC manufactured by NXP Semiconductors. Technical highlights include 5.5V ~ 35V supply voltage and -40°C ~ 150°C (TJ) operating temperature; design review should confirm logic family, I/O voltage, propagation delay, package fit, and operating temperature limits. This Surface Mount component is supplied in a TO-263-7, D²Pak (6 Leads + Tab) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for motor control, LED lighting, and display backlight applications, the BUK218-50DY,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-7, D²Pak (6 Leads + Tab) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK219-50Y,127 | Power Distribution Switches | The BUK219-50Y,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK219-50Y,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK220-50Y,118 | Power Distribution Switches | The BUK220-50Y,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK220-50Y,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | $5.04 | OBSOLETE | RFQ |
| BUK221-50DY,118 | Power Distribution Switches | The BUK221-50DY,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-7, D²Pak (6 Leads + Tab) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK221-50DY,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-7, D²Pak (6 Leads + Tab) | RFQ for sourcing | $5.40 | OBSOLETE | RFQ |
| BUK223-50Y,127 | Power Distribution Switches | The BUK223-50Y,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK223-50Y,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK224-50Y,118 | Power Distribution Switches | The BUK224-50Y,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK224-50Y,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK2914-50SYTS,127 | Power Distribution Switches | The BUK2914-50SYTS,127 is a power distribution IC manufactured by NXP Semiconductors. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Through Hole component is supplied in a TO-220-5 Formed Leads package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK2914-50SYTS,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | $9.19 | OBSOLETE | RFQ |
| C291NSE7FHA | System On Chip (SoC) | The C291NSE7FHA is a system-on-chip manufactured by NXP Semiconductors. Technical highlights include 667MHz clock speed; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This standard mount component is supplied in a 780-BBGA, FCBGA package and is rated for operation across 0°C ~ 105°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the C291NSE7FHA is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 780-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| C292NSE7KLA | System On Chip (SoC) | The C292NSE7KLA is a system-on-chip manufactured by NXP Semiconductors. Technical highlights include 1.0GHz clock speed; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This standard mount component is supplied in a 780-BBGA, FCBGA package and is rated for operation across 0°C ~ 105°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the C292NSE7KLA is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 780-BBGA, FCBGA | RFQ for sourcing | $223.13 | OBSOLETE | RFQ |
| C293NSE7MMA | System On Chip (SoC) | The C293NSE7MMA is a system-on-chip manufactured by NXP Semiconductors. Technical highlights include 1.2GHz clock speed; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This standard mount component is supplied in a 780-BBGA, FCBGA package and is rated for operation across 0°C ~ 105°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the C293NSE7MMA is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 780-BBGA, FCBGA | RFQ for sourcing | $2231.51 | OBSOLETE | RFQ |
| CA/8113/NONBIO/COZ | Microcontrollers (MCU) | The CA/8113/NONBIO/COZ is a microcontroller manufactured by NXP Semiconductors. Design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the CA/8113/NONBIO/COZ is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | RFQ | OBSOLETE | RFQ |