| BSC9131NSN7KHKB | System On Chip (SoC) | The BSC9131NSN7KHKB is a system-on-chip manufactured by NXP Semiconductors. Technical highlights include 800MHz clock speed; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This standard mount component is supplied in a 520-FBGA, FCBGA package and is rated for operation across 0°C ~ 105°C. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BSC9131NSN7KHKB is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 520-FBGA, FCBGA | RFQ for sourcing | $43.08 | OBSOLETE | RFQ |
| BSC9131NXE7KHKB | System On Chip (SoC) | The BSC9131NXE7KHKB is a system-on-chip manufactured by NXP Semiconductors. Technical highlights include 800MHz clock speed; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This standard mount component is supplied in a 520-FBGA, FCBGA package and is rated for operation across -40°C ~ 105°C. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BSC9131NXE7KHKB is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 520-FBGA, FCBGA | RFQ for sourcing | $124.80 | OBSOLETE | RFQ |
| BSC9131NXN1KHKB | Microprocessors (MPU) | The BSC9131NXN1KHKB is a microprocessor manufactured by NXP Semiconductors. Technical highlights include 800MHz clock speed; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This standard mount component is supplied in a 520-FBGA, FCBGA package and is rated for operation across -40°C ~ 105°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BSC9131NXN1KHKB is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 520-FBGA, FCBGA | RFQ for sourcing | $117.02 | OBSOLETE | RFQ |
| BSC9131NXN7KHKB | System On Chip (SoC) | The BSC9131NXN7KHKB is a system-on-chip manufactured by NXP Semiconductors. Technical highlights include 800MHz clock speed; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This standard mount component is supplied in a 520-FBGA, FCBGA package and is rated for operation across -40°C ~ 105°C. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BSC9131NXN7KHKB is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 520-FBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BSC9132NXE7MNMB | Microprocessors (MPU) | The BSC9132NXE7MNMB is a microprocessor manufactured by NXP Semiconductors. Technical highlights include 1.333GHz clock speed; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This standard mount component is supplied in a 780-BFBGA, FCBGA package and is rated for operation across -40°C ~ 105°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BSC9132NXE7MNMB is currently in active production through NXP Semiconductors's standard distribution channels. | 780-BFBGA, FCBGA | 31.392 In Stock | $35.03 | ACTIVE | RFQ |
| BSC9132NXN7MNMB | Microprocessors (MPU) | The BSC9132NXN7MNMB is a microprocessor manufactured by NXP Semiconductors. Technical highlights include 1.333GHz clock speed; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This standard mount component is supplied in a 780-BFBGA, FCBGA package and is rated for operation across -40°C ~ 105°C (TA). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BSC9132NXN7MNMB is currently in active production through NXP Semiconductors's standard distribution channels. | 780-BFBGA, FCBGA | 5.424 In Stock | $99.90 | ACTIVE | RFQ |
| BUK100-50GL,127 | Power Distribution Switches | The BUK100-50GL,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-3 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK100-50GL,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-3 | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK101-50GL,127 | Power Distribution Switches | The BUK101-50GL,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-3 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK101-50GL,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-3 | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK101-50GS,127 | Power Distribution Switches | The BUK101-50GS,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-3 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK101-50GS,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-3 | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK107-50DL,115 | Power Distribution Switches | The BUK107-50DL,115 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK107-50DL,115 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-261-4, TO-261AA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK108-50DL,118 | Power Distribution Switches | The BUK108-50DL,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-3, D²Pak (2 Leads + Tab), TO-263AB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK108-50DL,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | RFQ for sourcing | $4.32 | OBSOLETE | RFQ |
| BUK109-50DL,118 | Power Distribution Switches | The BUK109-50DL,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-3, D²Pak (2 Leads + Tab), TO-263AB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK109-50DL,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | RFQ for sourcing | $3.95 | OBSOLETE | RFQ |
| BUK110-50GL,118 | Power Distribution Switches | The BUK110-50GL,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-3, D²Pak (2 Leads + Tab), TO-263AB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK110-50GL,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | RFQ for sourcing | $3.76 | OBSOLETE | RFQ |
| BUK114-50L,118 | Power Distribution Switches | The BUK114-50L,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK114-50L,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | $5.85 | OBSOLETE | RFQ |
| BUK116-50L,118 | Power Distribution Switches | The BUK116-50L,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK116-50L,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | $4.32 | OBSOLETE | RFQ |
| BUK117-50DL,127 | Power Distribution Switches | The BUK117-50DL,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-3 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK117-50DL,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-3 | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK118-50DL,127 | Power Distribution Switches | The BUK118-50DL,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-3 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK118-50DL,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-3 | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK119-50DL,127 | Power Distribution Switches | The BUK119-50DL,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-3 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK119-50DL,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-3 | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK124-50L,127 | Power Distribution Switches | The BUK124-50L,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK124-50L,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BUK125-50L,127 | Power Distribution Switches | The BUK125-50L,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK125-50L,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | RFQ | OBSOLETE | RFQ |