| A2F500M3G-FGG256 | System On Chip (SoC) | The A2F500M3G-FGG256 is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 512KB Flash memory, 64kB RAM, 80MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F500M3G-FGG256 is currently in active production through Microsemi's standard distribution channels. | 256-LBGA | 1.665 In Stock | RFQ | ACTIVE | RFQ |
| A2F500M3G-FGG256I | System On Chip (SoC) | The A2F500M3G-FGG256I is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 512KB Flash memory, 64kB RAM, 80MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 256-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F500M3G-FGG256I is currently in active production through Microsemi's standard distribution channels. | 256-LBGA | 1.027 In Stock | RFQ | ACTIVE | RFQ |
| A2F500M3G-FGG256M | System On Chip (SoC) | The A2F500M3G-FGG256M is a system-on-chip manufactured by Microsemi. Key technical specifications include 512KB Flash memory, 64kB RAM, 80MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 256-LBGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F500M3G-FGG256M is currently in active production through Microsemi's standard distribution channels. | 256-LBGA | 6.600 In Stock | $3.46 | ACTIVE | RFQ |
| A2F500M3G-FGG484 | System On Chip (SoC) | The A2F500M3G-FGG484 is a system-on-chip manufactured by Microsemi. Key technical specifications include 512KB Flash memory, 64kB RAM, 80MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 484-BGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F500M3G-FGG484 is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 5.670 In Stock | $80.23 | ACTIVE | RFQ |
| A2F500M3G-FGG484I | System On Chip (SoC) | The A2F500M3G-FGG484I is a system-on-chip manufactured by Microsemi. Key technical specifications include 512KB Flash memory, 64kB RAM, 80MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 484-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F500M3G-FGG484I is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 5.802 In Stock | $93.88 | ACTIVE | RFQ |
| A2F500M3G-FGG484M | System On Chip (SoC) | The A2F500M3G-FGG484M is a system-on-chip manufactured by Microsemi. Key technical specifications include 512KB Flash memory, 64kB RAM, 80MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 484-BGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F500M3G-FGG484M is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 1.548 In Stock | $350.03 | ACTIVE | RFQ |
| A2F500M3G-PQ208 | System On Chip (SoC) | The A2F500M3G-PQ208 is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 512KB Flash memory, 64kB RAM, 80MHz clock speed, and Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 208-BFQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F500M3G-PQ208 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 208-BFQFP | RFQ for sourcing | $54.93 | OBSOLETE | RFQ |
| A2F500M3G-PQ208I | System On Chip (SoC) | The A2F500M3G-PQ208I is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 512KB Flash memory, 64kB RAM, 80MHz clock speed, and Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 208-BFQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F500M3G-PQ208I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 208-BFQFP | RFQ for sourcing | $53.27 | OBSOLETE | RFQ |
| A2F500M3G-PQG208 | System On Chip (SoC) | The A2F500M3G-PQG208 is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 512KB Flash memory, 64kB RAM, 80MHz clock speed, and Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 208-BFQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F500M3G-PQG208 is currently in active production through Microsemi's standard distribution channels. | 208-BFQFP | 13.658 In Stock | $25.65 | ACTIVE | RFQ |
| A2F500M3G-PQG208I | System On Chip (SoC) | The A2F500M3G-PQG208I is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 512KB Flash memory, 64kB RAM, 80MHz clock speed, and Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 208-BFQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F500M3G-PQG208I is currently in active production through Microsemi's standard distribution channels. | 208-BFQFP | 2.631 In Stock | RFQ | ACTIVE | RFQ |
| A3P015-1QNG68 | FPGAs | The A3P015-1QNG68 is an FPGA manufactured by Microsemi. Key technical specifications include 15000 gates, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 68-VFQFN Exposed Pad package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P015-1QNG68 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 68-VFQFN Exposed Pad | RFQ for sourcing | $8.70 | OBSOLETE | RFQ |
| A3P015-1QNG68I | FPGAs | The A3P015-1QNG68I is an FPGA manufactured by Microsemi. Key technical specifications include 15000 gates, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 68-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P015-1QNG68I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 68-VFQFN Exposed Pad | RFQ for sourcing | $10.02 | OBSOLETE | RFQ |
| A3P015-2QNG68 | FPGAs | The A3P015-2QNG68 is an FPGA manufactured by Microsemi. Key technical specifications include 15000 gates, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 68-VFQFN Exposed Pad package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P015-2QNG68 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 68-VFQFN Exposed Pad | RFQ for sourcing | $9.30 | OBSOLETE | RFQ |
| A3P015-2QNG68I | FPGAs | The A3P015-2QNG68I is an FPGA manufactured by Microsemi. Key technical specifications include 15000 gates, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 68-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P015-2QNG68I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 68-VFQFN Exposed Pad | RFQ for sourcing | $10.71 | OBSOLETE | RFQ |
| A3P015-QNG68 | FPGAs | The A3P015-QNG68 is an FPGA manufactured by Microsemi. Key technical specifications include 15000 gates, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 68-VFQFN Exposed Pad package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P015-QNG68 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 68-VFQFN Exposed Pad | RFQ for sourcing | $7.80 | OBSOLETE | RFQ |
| A3P015-QNG68I | FPGAs | The A3P015-QNG68I is an FPGA manufactured by Microsemi. Key technical specifications include 15000 gates, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 68-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P015-QNG68I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 68-VFQFN Exposed Pad | RFQ for sourcing | $9.12 | OBSOLETE | RFQ |
| A3P030-1QNG132 | FPGAs | The A3P030-1QNG132 is an FPGA manufactured by Microsemi. Key technical specifications include 30000 gates, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 132-WFQFN package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P030-1QNG132 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 132-WFQFN | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| A3P030-1QNG132I | FPGAs | The A3P030-1QNG132I is an FPGA manufactured by Microsemi. Key technical specifications include 30000 gates, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 132-WFQFN package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P030-1QNG132I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 132-WFQFN | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| A3P030-1QNG48 | FPGAs | The A3P030-1QNG48 is an FPGA manufactured by Microsemi. Key technical specifications include 30000 gates, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 48-VFQFN Exposed Pad package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P030-1QNG48 is currently in active production through Microsemi's standard distribution channels. | 48-VFQFN Exposed Pad | 4.524 In Stock | $5.50 | ACTIVE | RFQ |
| A3P030-1QNG48I | FPGAs | The A3P030-1QNG48I is an FPGA manufactured by Microsemi. Key technical specifications include 30000 gates, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 48-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P030-1QNG48I is currently in active production through Microsemi's standard distribution channels. | 48-VFQFN Exposed Pad | 1.046 In Stock | RFQ | ACTIVE | RFQ |