| A2F200M3F-1CSG288 | System On Chip (SoC) | The A2F200M3F-1CSG288 is a system-on-chip manufactured by Microsemi. Key technical specifications include 256kB Flash memory, 64kB RAM, 100MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 288-TFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-1CSG288 is currently in active production through Microsemi's standard distribution channels. | 288-TFBGA, CSPBGA | 1.676 In Stock | $45.40 | ACTIVE | RFQ |
| A2F200M3F-1CSG288I | System On Chip (SoC) | The A2F200M3F-1CSG288I is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 256kB Flash memory, 64kB RAM, 100MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 288-TFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-1CSG288I is currently in active production through Microsemi's standard distribution channels. | 288-TFBGA, CSPBGA | 1.108 In Stock | RFQ | ACTIVE | RFQ |
| A2F200M3F-1FG256 | System On Chip (SoC) | The A2F200M3F-1FG256 is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 256kB Flash memory, 64kB RAM, 100MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-1FG256 is currently in active production through Microsemi's standard distribution channels. | 256-LBGA | 1.224 In Stock | RFQ | ACTIVE | RFQ |
| A2F200M3F-1FG256I | System On Chip (SoC) | The A2F200M3F-1FG256I is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 256kB Flash memory, 64kB RAM, 100MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 256-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-1FG256I is currently in active production through Microsemi's standard distribution channels. | 256-LBGA | 971 In Stock | RFQ | ACTIVE | RFQ |
| A2F200M3F-1FG484 | System On Chip (SoC) | The A2F200M3F-1FG484 is a system-on-chip manufactured by Microsemi. Key technical specifications include 256kB Flash memory, 64kB RAM, 100MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 484-BGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-1FG484 is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 720 In Stock | $136.50 | ACTIVE | RFQ |
| A2F200M3F-1FG484I | System On Chip (SoC) | The A2F200M3F-1FG484I is a system-on-chip manufactured by Microsemi. Key technical specifications include 256kB Flash memory, 64kB RAM, 100MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 484-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-1FG484I is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 2.713 In Stock | $149.08 | ACTIVE | RFQ |
| A2F200M3F-1FGG256 | System On Chip (SoC) | The A2F200M3F-1FGG256 is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 256kB Flash memory, 64kB RAM, 100MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-1FGG256 is currently in active production through Microsemi's standard distribution channels. | 256-LBGA | 5.557 In Stock | $14.87 | ACTIVE | RFQ |
| A2F200M3F-1FGG256I | System On Chip (SoC) | The A2F200M3F-1FGG256I is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 256kB Flash memory, 64kB RAM, 100MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 256-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-1FGG256I is currently in active production through Microsemi's standard distribution channels. | 256-LBGA | 1.137 In Stock | RFQ | ACTIVE | RFQ |
| A2F200M3F-1FGG484 | System On Chip (SoC) | The A2F200M3F-1FGG484 is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 256kB Flash memory, 64kB RAM, 100MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 484-BGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-1FGG484 is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 37.003 In Stock | $2.28 | ACTIVE | RFQ |
| A2F200M3F-1FGG484I | System On Chip (SoC) | The A2F200M3F-1FGG484I is a system-on-chip manufactured by Microsemi. Key technical specifications include 256kB Flash memory, 64kB RAM, 100MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 484-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-1FGG484I is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 2.526 In Stock | $149.08 | ACTIVE | RFQ |
| A2F200M3F-1PQ208 | System On Chip (SoC) | The A2F200M3F-1PQ208 is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 256kB Flash memory, 64kB RAM, 100MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 208-BFQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-1PQ208 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 208-BFQFP | RFQ for sourcing | $38.27 | OBSOLETE | RFQ |
| A2F200M3F-1PQ208I | System On Chip (SoC) | The A2F200M3F-1PQ208I is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 256kB Flash memory, 64kB RAM, 100MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 208-BFQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-1PQ208I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 208-BFQFP | RFQ for sourcing | $42.28 | OBSOLETE | RFQ |
| A2F200M3F-1PQG208 | System On Chip (SoC) | The A2F200M3F-1PQG208 is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 256kB Flash memory, 64kB RAM, 100MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 208-BFQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-1PQG208 is currently in active production through Microsemi's standard distribution channels. | 208-BFQFP | 1.210 In Stock | RFQ | ACTIVE | RFQ |
| A2F200M3F-1PQG208I | System On Chip (SoC) | The A2F200M3F-1PQG208I is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 256kB Flash memory, 64kB RAM, 100MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 208-BFQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-1PQG208I is currently in active production through Microsemi's standard distribution channels. | 208-BFQFP | 20.000 In Stock | $20.63 | ACTIVE | RFQ |
| A2F200M3F-CS288 | System On Chip (SoC) | The A2F200M3F-CS288 is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 256kB Flash memory, 64kB RAM, 80MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 288-TFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-CS288 is currently in active production through Microsemi's standard distribution channels. | 288-TFBGA, CSPBGA | 31.998 In Stock | $15.79 | ACTIVE | RFQ |
| A2F200M3F-CS288I | System On Chip (SoC) | The A2F200M3F-CS288I is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 256kB Flash memory, 64kB RAM, 80MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 288-TFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-CS288I is currently in active production through Microsemi's standard distribution channels. | 288-TFBGA, CSPBGA | 1.604 In Stock | RFQ | ACTIVE | RFQ |
| A2F200M3F-CSG288 | System On Chip (SoC) | The A2F200M3F-CSG288 is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 256kB Flash memory, 64kB RAM, 80MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 288-TFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-CSG288 is currently in active production through Microsemi's standard distribution channels. | 288-TFBGA, CSPBGA | 1.340 In Stock | RFQ | ACTIVE | RFQ |
| A2F200M3F-CSG288I | System On Chip (SoC) | The A2F200M3F-CSG288I is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 256kB Flash memory, 64kB RAM, 80MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 288-TFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-CSG288I is currently in active production through Microsemi's standard distribution channels. | 288-TFBGA, CSPBGA | 1.903 In Stock | RFQ | ACTIVE | RFQ |
| A2F200M3F-FG256 | System On Chip (SoC) | The A2F200M3F-FG256 is a system-on-chip manufactured by Microsemi, part of the SmartFusion® series. Key technical specifications include 256kB Flash memory, 64kB RAM, 80MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-FG256 is currently in active production through Microsemi's standard distribution channels. | 256-LBGA | 21.476 In Stock | $15.79 | ACTIVE | RFQ |
| A2F200M3F-FG256I | System On Chip (SoC) | The A2F200M3F-FG256I is a system-on-chip manufactured by Microsemi. Key technical specifications include 256kB Flash memory, 64kB RAM, 80MHz clock speed, and EBI/EMI, Ethernet, I²C, SPI, UART/USART connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 256-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the A2F200M3F-FG256I is currently in active production through Microsemi's standard distribution channels. | 256-LBGA | 2.986 In Stock | RFQ | ACTIVE | RFQ |