| XC2VP50-7FFG1517C | FPGAs | The XC2VP50-7FFG1517C is an FPGA manufactured by Xilinx. Key technical specifications include 53136 logic elements, 5904 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1517-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP50-7FFG1517C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1517-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC2VP7-5FF672C | FPGAs | The XC2VP7-5FF672C is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 672-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-5FF672C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 672-BBGA, FCBGA | RFQ for sourcing | $2028.20 | OBSOLETE | RFQ |
| XC2VP7-5FF896C | FPGAs | The XC2VP7-5FF896C is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 896-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-5FF896C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 896-BBGA, FCBGA | RFQ for sourcing | $17.73 | OBSOLETE | RFQ |
| XC2VP7-5FFG672C | FPGAs | The XC2VP7-5FFG672C is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 672-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-5FFG672C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 672-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC2VP7-5FFG672I | FPGAs | The XC2VP7-5FFG672I is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 672-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-5FFG672I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 672-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC2VP7-5FFG896C | FPGAs | The XC2VP7-5FFG896C is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 896-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-5FFG896C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 896-BBGA, FCBGA | RFQ for sourcing | $44.34 | OBSOLETE | RFQ |
| XC2VP7-5FG456C | FPGAs | The XC2VP7-5FG456C is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 456-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-5FG456C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 456-BBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC2VP7-5FG456I | FPGAs | The XC2VP7-5FG456I is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 456-BBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-5FG456I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 456-BBGA | RFQ for sourcing | $32.13 | OBSOLETE | RFQ |
| XC2VP7-5FGG456C | FPGAs | The XC2VP7-5FGG456C is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 456-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-5FGG456C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 456-BBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC2VP7-5FGG456I | FPGAs | The XC2VP7-5FGG456I is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 456-BBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-5FGG456I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 456-BBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC2VP7-6FF672C | FPGAs | The XC2VP7-6FF672C is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 672-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-6FF672C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 672-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC2VP7-6FF672I | FPGAs | The XC2VP7-6FF672I is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 672-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-6FF672I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 672-BBGA, FCBGA | RFQ for sourcing | $89.99 | OBSOLETE | RFQ |
| XC2VP7-6FF896C | FPGAs | The XC2VP7-6FF896C is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 896-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-6FF896C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 896-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC2VP7-6FF896I | FPGAs | The XC2VP7-6FF896I is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 896-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-6FF896I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 896-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC2VP7-6FFG672C | FPGAs | The XC2VP7-6FFG672C is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 672-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-6FFG672C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 672-BBGA, FCBGA | RFQ for sourcing | $27.67 | OBSOLETE | RFQ |
| XC2VP7-6FFG672I | FPGAs | The XC2VP7-6FFG672I is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 672-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-6FFG672I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 672-BBGA, FCBGA | RFQ for sourcing | $173.11 | OBSOLETE | RFQ |
| XC2VP7-6FFG896C | FPGAs | The XC2VP7-6FFG896C is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 896-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-6FFG896C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 896-BBGA, FCBGA | RFQ for sourcing | $2.12 | OBSOLETE | RFQ |
| XC2VP7-6FG456C | FPGAs | The XC2VP7-6FG456C is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 456-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-6FG456C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 456-BBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| XC2VP7-6FG456I | FPGAs | The XC2VP7-6FG456I is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 456-BBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-6FG456I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 456-BBGA | RFQ for sourcing | $53.22 | OBSOLETE | RFQ |
| XC2VP7-6FGG456C | FPGAs | The XC2VP7-6FGG456C is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 456-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-6FGG456C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 456-BBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |