| APA600-BG456 | FPGAs | The APA600-BG456 is an FPGA manufactured by Microsemi, part of the ProASICPLUS series. Technical highlights include 0°C ~ 70°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 456-BBGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-BG456 is currently in active production through Microsemi's standard distribution channels. | 456-BBGA | 2.496 In Stock | $1571.39 | ACTIVE | RFQ |
| APA600-BG456I | FPGAs | The APA600-BG456I is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.3V ~ 2.7V supply voltage, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 456-BBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-BG456I is currently in active production through Microsemi's standard distribution channels. | 456-BBGA | 1.523 In Stock | $848.54 | ACTIVE | RFQ |
| APA600-BG456M | FPGAs | The APA600-BG456M is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.3V ~ 2.7V supply voltage, and -55°C ~ 125°C (TC) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 456-BBGA package and is rated for operation across -55°C ~ 125°C (TC). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-BG456M is currently in active production through Microsemi's standard distribution channels. | 456-BBGA | 1.609 In Stock | $1172.74 | ACTIVE | RFQ |
| APA600-BGG456 | FPGAs | The APA600-BGG456 is an FPGA manufactured by Microsemi, part of the ProASICPLUS series. Technical highlights include 0°C ~ 70°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 456-BBGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-BGG456 is currently in active production through Microsemi's standard distribution channels. | 456-BBGA | 3.276 In Stock | $707.12 | ACTIVE | RFQ |
| APA600-BGG456I | FPGAs | The APA600-BGG456I is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.3V ~ 2.7V supply voltage, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 456-BBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-BGG456I is currently in active production through Microsemi's standard distribution channels. | 456-BBGA | 2.834 In Stock | $1885.64 | ACTIVE | RFQ |
| APA600-BGG456M | FPGAs | The APA600-BGG456M is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.3V ~ 2.7V supply voltage, and -55°C ~ 125°C (TC) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 456-BBGA package and is rated for operation across -55°C ~ 125°C (TC). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-BGG456M is currently in active production through Microsemi's standard distribution channels. | 456-BBGA | 731 In Stock | $2606.11 | ACTIVE | RFQ |
| APA600-CGS624B | FPGAs | The APA600-CGS624B is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.3V ~ 2.7V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Through Hole component is supplied in a 624-BCCGA package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-CGS624B is currently in active production through Microsemi's standard distribution channels. | 624-BCCGA | 1.250 In Stock | $34717.52 | ACTIVE | RFQ |
| APA600-CGS624M | FPGAs | The APA600-CGS624M is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.3V ~ 2.7V supply voltage, and -55°C ~ 125°C (TC) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Through Hole component is supplied in a 624-BCCGA package and is rated for operation across -55°C ~ 125°C (TC). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-CGS624M is currently in active production through Microsemi's standard distribution channels. | 624-BCCGA | 2.747 In Stock | $17498.10 | ACTIVE | RFQ |
| APA600-CQ208B | FPGAs | The APA600-CQ208B is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.3V ~ 2.7V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFCQFP with Tie Bar package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-CQ208B is currently in active production through Microsemi's standard distribution channels. | 208-BFCQFP with Tie Bar | 1.541 In Stock | $11811.18 | ACTIVE | RFQ |
| APA600-CQ208M | FPGAs | The APA600-CQ208M is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.3V ~ 2.7V supply voltage, and -55°C ~ 125°C (TC) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFCQFP with Tie Bar package and is rated for operation across -55°C ~ 125°C (TC). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-CQ208M is currently in active production through Microsemi's standard distribution channels. | 208-BFCQFP with Tie Bar | 1.506 In Stock | $13216.60 | ACTIVE | RFQ |
| APA600-CQ352B | FPGAs | The APA600-CQ352B is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.3V ~ 2.7V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 352-BFCQFP with Tie Bar package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-CQ352B is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 352-BFCQFP with Tie Bar | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| APA600-CQ352M | FPGAs | The APA600-CQ352M is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.3V ~ 2.7V supply voltage, and -55°C ~ 125°C (TC) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 352-BFCQFP with Tie Bar package and is rated for operation across -55°C ~ 125°C (TC). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-CQ352M is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 352-BFCQFP with Tie Bar | RFQ for sourcing | $8198.56 | OBSOLETE | RFQ |
| APA600-FG256 | FPGAs | The APA600-FG256 is an FPGA manufactured by Microsemi, part of the ProASICPLUS series. Key technical specifications include 600000 gates, 2.3V ~ 2.7V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-FG256 is currently in active production through Microsemi's standard distribution channels. | 256-LBGA | 947 In Stock | $1567.36 | ACTIVE | RFQ |
| APA600-FG256A | FPGAs | The APA600-FG256A is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.375V ~ 2.625V supply voltage, and -40°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across -40°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-FG256A is currently in active production through Microsemi's standard distribution channels. | 256-LBGA | 2.599 In Stock | $4137.12 | ACTIVE | RFQ |
| APA600-FG256I | FPGAs | The APA600-FG256I is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.3V ~ 2.7V supply voltage, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-FG256I is currently in active production through Microsemi's standard distribution channels. | 256-LBGA | 1.553 In Stock | $846.75 | ACTIVE | RFQ |
| APA600-FG256M | FPGAs | The APA600-FG256M is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.3V ~ 2.7V supply voltage, and -55°C ~ 125°C (TC) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across -55°C ~ 125°C (TC). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-FG256M is currently in active production through Microsemi's standard distribution channels. | 256-LBGA | 1.618 In Stock | $2544.90 | ACTIVE | RFQ |
| APA600-FG484 | FPGAs | The APA600-FG484 is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.3V ~ 2.7V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-FG484 is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 1.177 In Stock | $1667.26 | ACTIVE | RFQ |
| APA600-FG484A | FPGAs | The APA600-FG484A is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.375V ~ 2.625V supply voltage, and -40°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BGA package and is rated for operation across -40°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-FG484A is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 2.820 In Stock | $2586.61 | ACTIVE | RFQ |
| APA600-FG484I | FPGAs | The APA600-FG484I is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.3V ~ 2.7V supply voltage, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-FG484I is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 1.807 In Stock | $901.13 | ACTIVE | RFQ |
| APA600-FG676 | FPGAs | The APA600-FG676 is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 2.3V ~ 2.7V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA600-FG676 is currently in active production through Microsemi's standard distribution channels. | 676-BGA | 1.551 In Stock | $842.78 | ACTIVE | RFQ |