| A3P600L-1FGG144 | FPGAs | The A3P600L-1FGG144 is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-1FGG144 is currently in active production through Microsemi's standard distribution channels. | 144-LBGA | 2.519 In Stock | RFQ | ACTIVE | RFQ |
| A3P600L-1FGG144I | FPGAs | The A3P600L-1FGG144I is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-1FGG144I is currently in active production through Microsemi's standard distribution channels. | 144-LBGA | 49.567 In Stock | $1.31 | ACTIVE | RFQ |
| A3P600L-1FGG256 | FPGAs | The A3P600L-1FGG256 is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-1FGG256 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-LBGA | RFQ for sourcing | $100.20 | OBSOLETE | RFQ |
| A3P600L-1FGG256I | FPGAs | The A3P600L-1FGG256I is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-1FGG256I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-LBGA | RFQ for sourcing | $194.40 | OBSOLETE | RFQ |
| A3P600L-1FGG484 | FPGAs | The A3P600L-1FGG484 is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-1FGG484 is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 14.671 In Stock | $1.26 | ACTIVE | RFQ |
| A3P600L-1FGG484I | FPGAs | The A3P600L-1FGG484I is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-1FGG484I is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 2.016 In Stock | RFQ | ACTIVE | RFQ |
| A3P600L-1PQ208 | FPGAs | The A3P600L-1PQ208 is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-1PQ208 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 208-BFQFP | RFQ for sourcing | $101.40 | OBSOLETE | RFQ |
| A3P600L-1PQ208I | FPGAs | The A3P600L-1PQ208I is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-1PQ208I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 208-BFQFP | RFQ for sourcing | $197.10 | OBSOLETE | RFQ |
| A3P600L-1PQG208 | FPGAs | The A3P600L-1PQG208 is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-1PQG208 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 208-BFQFP | RFQ for sourcing | $101.40 | OBSOLETE | RFQ |
| A3P600L-1PQG208I | FPGAs | The A3P600L-1PQG208I is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-1PQG208I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 208-BFQFP | RFQ for sourcing | $197.10 | OBSOLETE | RFQ |
| A3P600L-FG144 | FPGAs | The A3P600L-FG144 is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-FG144 is currently in active production through Microsemi's standard distribution channels. | 144-LBGA | 2.182 In Stock | $136.00 | ACTIVE | RFQ |
| A3P600L-FG144I | FPGAs | The A3P600L-FG144I is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-FG144I is currently in active production through Microsemi's standard distribution channels. | 144-LBGA | 1.503 In Stock | $258.04 | ACTIVE | RFQ |
| A3P600L-FG256 | FPGAs | The A3P600L-FG256 is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-FG256 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-LBGA | RFQ for sourcing | $89.10 | OBSOLETE | RFQ |
| A3P600L-FG256I | FPGAs | The A3P600L-FG256I is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-FG256I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-LBGA | RFQ for sourcing | $166.50 | OBSOLETE | RFQ |
| A3P600L-FG484 | FPGAs | The A3P600L-FG484 is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-FG484 is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 2.854 In Stock | $183.66 | ACTIVE | RFQ |
| A3P600L-FG484I | FPGAs | The A3P600L-FG484I is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-FG484I is currently in active production through Microsemi's standard distribution channels. | 484-BGA | 37.952 In Stock | $6.30 | ACTIVE | RFQ |
| A3P600L-FGG144 | FPGAs | The A3P600L-FGG144 is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-FGG144 is currently in active production through Microsemi's standard distribution channels. | 144-LBGA | 1.765 In Stock | RFQ | ACTIVE | RFQ |
| A3P600L-FGG144I | FPGAs | The A3P600L-FGG144I is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-FGG144I is currently in active production through Microsemi's standard distribution channels. | 144-LBGA | 584 In Stock | RFQ | ACTIVE | RFQ |
| A3P600L-FGG256 | FPGAs | The A3P600L-FGG256 is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-FGG256 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-LBGA | RFQ for sourcing | $89.10 | OBSOLETE | RFQ |
| A3P600L-FGG256I | FPGAs | The A3P600L-FGG256I is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-FGG256I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-LBGA | RFQ for sourcing | $166.50 | OBSOLETE | RFQ |