| BSP452 E6327 | Power Distribution Switches | The BSP452 E6327 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP452 E6327 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-261-4, TO-261AA | RFQ for sourcing | $4.72 | OBSOLETE | RFQ |
| BSP742RINT | Power Distribution Switches | The BSP742RINT is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742RINT is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BSP742RIXUMA1 | Power Distribution Switches | The BSP742RIXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742RIXUMA1 is currently in active production through Infineon Technologies's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 36.000 In Stock | $0.9360 | ACTIVE | RFQ |
| BSP742RNUMA1 | Power Distribution Switches | The BSP742RNUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742RNUMA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BSP742RXUMA1 | Power Distribution Switches | The BSP742RXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742RXUMA1 is currently in active production through Infineon Technologies's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 17.439 In Stock | $1.58 | ACTIVE | RFQ |
| BSP742TNT | Power Distribution Switches | The BSP742TNT is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP742TNT is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BSP752RNUMA1 | Power Distribution Switches | The BSP752RNUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP752RNUMA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BSP752RXUMA2 | Power Distribution Switches | The BSP752RXUMA2 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP752RXUMA2 is currently in active production through Infineon Technologies's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 30.893 In Stock | $1.11 | ACTIVE | RFQ |
| BSP752TNUMA1 | Power Distribution Switches | The BSP752TNUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP752TNUMA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BSP752TXUMA1 | Power Distribution Switches | The BSP752TXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP752TXUMA1 is currently in active production through Infineon Technologies's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 15.943 In Stock | $1.84 | ACTIVE | RFQ |
| BSP75NHUMA1 | Power Distribution Switches | The BSP75NHUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP75NHUMA1 is currently in active production through Infineon Technologies's standard distribution channels. | TO-261-4, TO-261AA | 1.540 In Stock | $0.8277 | ACTIVE | RFQ |
| BSP75NNT | Power Distribution Switches | The BSP75NNT is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP75NNT is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-261-4, TO-261AA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BSP76 E6327 | Power Distribution Switches | The BSP76 E6327 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP76 E6327 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-261-4, TO-261AA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BSP762TNT | Power Distribution Switches | The BSP762TNT is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP762TNT is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BSP762TXUMA1 | Power Distribution Switches | The BSP762TXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP762TXUMA1 is currently in active production through Infineon Technologies's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 23.994 In Stock | $1.24 | ACTIVE | RFQ |
| BSP76E6327HUSA1 | Power Distribution Switches | The BSP76E6327HUSA1 is a power distribution IC manufactured by Infineon Technologies, part of the HITFET® series. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP76E6327HUSA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-261-4, TO-261AA | RFQ for sourcing | $0.7744 | OBSOLETE | RFQ |
| BSP76E6433HUMA1 | Power Distribution Switches | The BSP76E6433HUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP76E6433HUMA1 is currently in active production through Infineon Technologies's standard distribution channels. | TO-261-4, TO-261AA | 33.480 In Stock | $1.21 | ACTIVE | RFQ |
| BSP76E6433NT | Power Distribution Switches | The BSP76E6433NT is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP76E6433NT is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-261-4, TO-261AA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BSP77 E6327 | Power Distribution Switches | The BSP77 E6327 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP77 E6327 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-261-4, TO-261AA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| BSP772TNUMA1 | Power Distribution Switches | The BSP772TNUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP772TNUMA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |