| EP1S20F672I7N | FPGAs | The EP1S20F672I7N is an FPGA manufactured by Flip Electronics. Key technical specifications include 18460 logic elements, 1846 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 672-BBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EP1S20F672I7N is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 672-BBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| EP1S20F780C5 | FPGAs | The EP1S20F780C5 is an FPGA manufactured by Flip Electronics. Key technical specifications include 18460 logic elements, 1846 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 780-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EP1S20F780C5 is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 780-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| EP1S20F780C5N | FPGAs | The EP1S20F780C5N is an FPGA manufactured by Flip Electronics. Key technical specifications include 18460 logic elements, 1846 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 780-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EP1S20F780C5N is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 780-BBGA, FCBGA | RFQ for sourcing | $840.00 | OBSOLETE | RFQ |
| EP1S25F1020C6 | FPGAs | The EP1S25F1020C6 is an FPGA manufactured by Flip Electronics. Key technical specifications include 25660 logic elements, 2566 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1020-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EP1S25F1020C6 is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1020-BBGA | RFQ for sourcing | $1458.82 | OBSOLETE | RFQ |
| EP1S40F780C5N | FPGAs | The EP1S40F780C5N is an FPGA manufactured by Flip Electronics. Key technical specifications include 41250 logic elements, 4125 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 780-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EP1S40F780C5N is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 780-BBGA, FCBGA | RFQ for sourcing | $386.68 | OBSOLETE | RFQ |
| EP1S80F1508C6N | FPGAs | The EP1S80F1508C6N is an FPGA manufactured by Flip Electronics. Key technical specifications include 79040 logic elements, 7904 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1508-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EP1S80F1508C6N is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1508-BBGA, FCBGA | RFQ for sourcing | $288.00 | OBSOLETE | RFQ |
| EP1S80F1508C7 | FPGAs | The EP1S80F1508C7 is an FPGA manufactured by Flip Electronics. Key technical specifications include 79040 logic elements, 7904 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1508-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EP1S80F1508C7 is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1508-BBGA, FCBGA | RFQ for sourcing | $335.34 | OBSOLETE | RFQ |
| EP2AGX190EF29C5N | FPGAs | The EP2AGX190EF29C5N is an FPGA manufactured by Flip Electronics. Key technical specifications include 181165 logic elements, 7612 LABs/CLBs, 0.87V ~ 0.93V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 780-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EP2AGX190EF29C5N is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 780-BBGA, FCBGA | RFQ for sourcing | $896.00 | OBSOLETE | RFQ |
| EP2AGX260EF29C6N | FPGAs | The EP2AGX260EF29C6N is an FPGA manufactured by Flip Electronics. Key technical specifications include 244188 logic elements, 10260 LABs/CLBs, 0.87V ~ 0.93V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 780-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EP2AGX260EF29C6N is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 780-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| EP2AGX95DF25I5N | FPGAs | The EP2AGX95DF25I5N is an FPGA manufactured by Flip Electronics. Key technical specifications include 89178 logic elements, 3747 LABs/CLBs, 0.87V ~ 0.93V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 572-BGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EP2AGX95DF25I5N is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 572-BGA, FCBGA | RFQ for sourcing | $275.70 | OBSOLETE | RFQ |
| EP3SL50F780C4N | FPGAs | The EP3SL50F780C4N is an FPGA manufactured by Flip Electronics. Key technical specifications include 47500 logic elements, 1900 LABs/CLBs, 0.86V ~ 1.15V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 780-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EP3SL50F780C4N is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 780-BBGA, FCBGA | RFQ for sourcing | $29.91 | OBSOLETE | RFQ |
| EP3SL70F780C4N | FPGAs | The EP3SL70F780C4N is an FPGA manufactured by Flip Electronics. Key technical specifications include 67500 logic elements, 2700 LABs/CLBs, 0.86V ~ 1.15V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 780-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EP3SL70F780C4N is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 780-BBGA, FCBGA | RFQ for sourcing | $3874.68 | OBSOLETE | RFQ |
| EP4SGX110HF35C3N | FPGAs | The EP4SGX110HF35C3N is an FPGA manufactured by Flip Electronics. Key technical specifications include 105600 logic elements, 4224 LABs/CLBs, 0.87V ~ 0.93V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1152-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EP4SGX110HF35C3N is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1152-BBGA, FCBGA | RFQ for sourcing | $1306.68 | OBSOLETE | RFQ |
| EPF6024ATC144-3N | FPGAs | The EPF6024ATC144-3N is an FPGA manufactured by Flip Electronics. Key technical specifications include 1960 logic elements, 24000 gates, 196 LABs/CLBs, 3V ~ 3.6V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EPF6024ATC144-3N is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-LQFP | RFQ for sourcing | $174.38 | OBSOLETE | RFQ |
| EPM3064ALC44-10 | CPLDs | The EPM3064ALC44-10 is a CPLD manufactured by Flip Electronics. Key technical specifications include 64 macrocells, 1250 gates, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm macrocell utilization, I/O planning, and logic timing. This Surface Mount component is supplied in a 44-LCC (J-Lead) package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EPM3064ALC44-10 is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 44-LCC (J-Lead) | RFQ for sourcing | $79.18 | OBSOLETE | RFQ |
| EPM3064ALI44-10N | CPLDs | The EPM3064ALI44-10N is a CPLD manufactured by Flip Electronics. Key technical specifications include 64 macrocells, 1250 gates, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm macrocell utilization, I/O planning, and logic timing. This Surface Mount component is supplied in a 44-LCC (J-Lead) package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EPM3064ALI44-10N is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 44-LCC (J-Lead) | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| EPM3064ATC44-10 | CPLDs | The EPM3064ATC44-10 is a CPLD manufactured by Flip Electronics. Key technical specifications include 64 macrocells, 1250 gates, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm macrocell utilization, I/O planning, and logic timing. This Surface Mount component is supplied in a 44-TQFP package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EPM3064ATC44-10 is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 44-TQFP | RFQ for sourcing | $11.12 | OBSOLETE | RFQ |
| EPM3064ATI100-10 | CPLDs | The EPM3064ATI100-10 is a CPLD manufactured by Flip Electronics. Key technical specifications include 64 macrocells, 1250 gates, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm macrocell utilization, I/O planning, and logic timing. This Surface Mount component is supplied in a 100-TQFP package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EPM3064ATI100-10 is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 100-TQFP | RFQ for sourcing | $52.64 | OBSOLETE | RFQ |
| EPM3128ATI100-10 | CPLDs | The EPM3128ATI100-10 is a CPLD manufactured by Flip Electronics. Key technical specifications include 128 macrocells, 2500 gates, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm macrocell utilization, I/O planning, and logic timing. This Surface Mount component is supplied in a 100-TQFP package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EPM3128ATI100-10 is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 100-TQFP | RFQ for sourcing | $28.29 | OBSOLETE | RFQ |
| EPM3256AFC256-7 | CPLDs | The EPM3256AFC256-7 is a CPLD manufactured by Flip Electronics. Key technical specifications include 256 macrocells, 5000 gates, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm macrocell utilization, I/O planning, and logic timing. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EPM3256AFC256-7 is no longer produced by Flip Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | $151.44 | OBSOLETE | RFQ |