Component detail

S29GL512P12FFIV10

Name: S29GL512P12FFIV10
Brand: Waldom Electronics
SKU: S29GL512P12FFIV10
Availability: LimitedAvailability

Obsolete

Waldom Electronics

RFQ for sourcing

StockRFQ for sourcing

PriceRFQ

Package64-LBGA

Lead TimeConfirm

MOQ1

Lifecycleobsolete

Need a firm quote?Confirm price, date code, batch, lead time, and alternates before purchase.

Verify Stock & Date Code

Technical Specifications

Category	Integrated Circuits (ICs)/Memory Integrated Circuit
Product Status	Obsolete
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	64-LBGA
Technology	FLASH - NOR
Supplier Device Package	64-FBGA (13x11)
Memory Size	512Mb (32M x 16)
Memory Type	Non-Volatile
Voltage - Supply	1.65V ~ 3.6V
Clock Frequency	-
Access Time	120 ns
Memory Format	Flash
Memory Interface	Parallel
Write Cycle Time - Word, Page	120ns
E U Ro H S Status	ROHS3 Compliant
M S L Rating	3 (168 Hours,30°C/60%RH)
R E A C H Status	REACH Unaffected
U S E C C N	3A991B1A
H T S U S	8542.32.0071
China Ro H S Status	Orange Symbol: Safe for use during the environmental protection period

Product Overview

The S29GL512P12FFIV10 is a flash memory in the Non-Volatile Memory family manufactured by Waldom Electronics. This part has been marked as obsolete by Waldom Electronics; FPGACenter can quote verified sourcing options through qualified specialty channels.

Key specifications include Category: Integrated Circuits (ICs)/Memory Integrated Circuit, Product Status: Obsolete, Operating Temperature: -40°C ~ 85°C (TA), Mounting Type: Surface Mount, Package / Case: 64-LBGA.

This device comes in a 64-LBGA package with surface mount mounting.

Submit an RFQ for S29GL512P12FFIV10; FPGACenter will verify availability, provenance, lead time, and pricing before confirming supply.

Application Areas

Data Center & CloudConsumer ElectronicsAutomotive ElectronicsNetworking EquipmentIndustrial Computing

Frequently Asked Questions

Can FPGACenter source the S29GL512P12FFIV10?

Yes. FPGACenter can quote S29GL512P12FFIV10 through qualified specialty sourcing channels. Availability, lead time, provenance, and pricing are verified before an order is confirmed.

What package type is the S29GL512P12FFIV10 available in?

The S29GL512P12FFIV10 by Waldom Electronics is available in a 64-LBGA package with surface mount mounting configuration. All parts are original and shipped in manufacturer-standard packaging.

The S29GL512P12FFIV10 is marked as obsolete. Are the parts genuine?

All S29GL512P12FFIV10 units sourced by FPGACenter are reviewed for originality, lot condition, and documentation before shipment. We use IDEA-STD-1010-aligned inspection practices for specialty-channel supply. We specialize in obsolete part sourcing and verify availability before confirming supply.

Related Products

View All Flash Memory →

Part Number	Manufacturer	Description	Stock	Price	Status
W25X10CLSNIG TR	Winbond Electronics	The W25X10CLSNIG TR is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 1Mb (128K x 8) memory size, 2.3V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25X10CLSNIG TR is currently in active production through Winbond Electronics's standard distribution channels.	59.999 In Stock	$0.2079	Active
W29N01HVSINA	Winbond Electronics	The W29N01HVSINA is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 1Gb (128M x 8) memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 48-TFSOP (0.724", 18.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W29N01HVSINA is currently in active production through Winbond Electronics's standard distribution channels.	59.612 In Stock	$1.36	Active
SST39VF1601C-70-4I-EKE	Microchip	The SST39VF1601C-70-4I-EKE is a flash memory IC manufactured by Microchip, part of the SST39 MPF™ series. Key technical specifications include 16Mbit memory size, 2.7V ~ 3.6V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 48-TFSOP (0.724", 18.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the SST39VF1601C-70-4I-EKE is currently in active production through Microchip's standard distribution channels.	59.006 In Stock	$2.22	Active
CG8392AA	Rochester Electronics	The CG8392AA is a flash memory IC manufactured by Rochester Electronics. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for data center storage, consumer electronics, and automotive infotainment applications, the CG8392AA is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.	RFQ for sourcing	$0.9000	Obsolete
W25Q16JWZPIQ	Winbond Electronics	The W25Q16JWZPIQ is a flash memory IC manufactured by Winbond Electronics. Key technical specifications include 16Mb (2M x 8) memory size, 1.65V ~ 1.95V supply voltage, and Non-Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the W25Q16JWZPIQ is currently in active production through Winbond Electronics's standard distribution channels.	57.814 In Stock	$0.5130	Active
LE25FU206AMB-TLM-H-SA	Rochester Electronics	The LE25FU206AMB-TLM-H-SA is a flash memory IC manufactured by Rochester Electronics. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for data center storage, consumer electronics, and automotive infotainment applications, the LE25FU206AMB-TLM-H-SA is currently in active production through Rochester Electronics's standard distribution channels.	57.600 In Stock	$0.4860	Active