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Product Overview
The TE0726-03-41C74-R is a mcu, mpu & fpga modules in the Embedded Modules family manufactured by Trenz Electronic. This component is currently in active production.
Is the TE0726-03-41C74-R in stock and ready to ship?
Yes, FPGACenter currently has 850 units of TE0726-03-41C74-R in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.
The ESP8266EX is an FPGA manufactured by Espressif. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This SMD component is supplied in a QFN-32 package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the ESP8266EX is currently in active production through Espressif's standard distribution channels.
The MCV-6DB is an FPGA manufactured by ARIES Embedded. Technical highlights include 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a standard package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the MCV-6DB is currently in active production through ARIES Embedded's standard distribution channels.
The MCV-2DB is an FPGA manufactured by ARIES Embedded. Technical highlights include 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a standard package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the MCV-2DB is currently in active production through ARIES Embedded's standard distribution channels.
The ESP32-WROOM-32E is an FPGA manufactured by Espressif. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This SMD component is supplied in a Module package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the ESP32-WROOM-32E is currently in active production through Espressif's standard distribution channels.
The DS5000T-8-12 is an FPGA manufactured by Rochester Electronics. Technical highlights include 0°C ~ 70°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 40-DIP Module (0.610", 15.495mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the DS5000T-8-12 is currently in active production through Rochester Electronics's standard distribution channels.
The MYC-C3354-4E512D-80-C-GW is an FPGA manufactured by MYIR Tech. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a standard package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the MYC-C3354-4E512D-80-C-GW is currently in active production through MYIR Tech's standard distribution channels.