Orange Symbol: Safe for use during the environmental protection period
Product Overview
The B30688-D5352-X923 is a mcu, mpu & fpga modules in the Embedded Modules family manufactured by Qualcomm. This part has been marked as obsolete by Qualcomm; FPGACenter can quote verified sourcing options through qualified specialty channels.
Key specifications include Category: Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules, Product Status: Obsolete, E U Ro H S Status: RoHS Compliant, R E A C H Status: Vendor is not defined, U S E C C N: Provided as per user requirements.
Submit an RFQ for B30688-D5352-X923; FPGACenter will verify availability, provenance, lead time, and pricing before confirming supply.
Yes. FPGACenter can quote B30688-D5352-X923 through qualified specialty sourcing channels. Availability, lead time, provenance, and pricing are verified before an order is confirmed.
The B30688-D5352-X923 is marked as obsolete. Are the parts genuine?
All B30688-D5352-X923 units sourced by FPGACenter are reviewed for originality, lot condition, and documentation before shipment. We use IDEA-STD-1010-aligned inspection practices for specialty-channel supply. We specialize in obsolete part sourcing and verify availability before confirming supply.
The ESP8266EX is an FPGA manufactured by Espressif. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This SMD component is supplied in a QFN-32 package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the ESP8266EX is currently in active production through Espressif's standard distribution channels.
The MCV-6DB is an FPGA manufactured by ARIES Embedded. Technical highlights include 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a standard package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the MCV-6DB is currently in active production through ARIES Embedded's standard distribution channels.
The MCV-2DB is an FPGA manufactured by ARIES Embedded. Technical highlights include 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a standard package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the MCV-2DB is currently in active production through ARIES Embedded's standard distribution channels.
The ESP32-WROOM-32E is an FPGA manufactured by Espressif. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This SMD component is supplied in a Module package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the ESP32-WROOM-32E is currently in active production through Espressif's standard distribution channels.
The DS5000T-8-12 is an FPGA manufactured by Rochester Electronics. Technical highlights include 0°C ~ 70°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 40-DIP Module (0.610", 15.495mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the DS5000T-8-12 is currently in active production through Rochester Electronics's standard distribution channels.
The MYC-C3354-4E512D-80-C-GW is an FPGA manufactured by MYIR Tech. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a standard package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the MYC-C3354-4E512D-80-C-GW is currently in active production through MYIR Tech's standard distribution channels.