Yes, FPGACenter currently has 2.349 units of TS120P in stock. Orders placed before 3 PM (CST) are eligible for same-day dispatch. No minimum order quantity required.
What package type is the TS120P available in?
The TS120P by IXYS is available in a 8-ESOP (0.250", 6.35mm Width) package with surface mount mounting configuration. All parts are original and shipped in manufacturer-standard packaging.
The DS3154N is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3154N is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners.
The LMC567CN/NOPB is a specialized telecom IC manufactured by Rochester Electronics. Technical highlights include 2V ~ 9V supply voltage and -25°C ~ 100°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -25°C ~ 100°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LMC567CN/NOPB is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.
The MAX3941ETG+T is a specialized telecom IC manufactured by Maxim Integrated. Technical highlights include -5.5V ~ -4.9V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 24-WFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the MAX3941ETG+T is currently in active production through Maxim Integrated's standard distribution channels.
The LE9500DBJC is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage and Parallel interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-PLCC package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE9500DBJC is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.
The CPC7582BB is a specialized telecom IC manufactured by IXYS. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 110°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 110°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the CPC7582BB is no longer produced by IXYS; FPGACenter maintains verified stock sourced through certified supply chain partners.
The PM5326-FGI is a specialized telecom IC manufactured by Microchip. Technical highlights include 1.2V supply voltage and SFI-4 interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 1292-FCBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the PM5326-FGI is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.