| 270087-001E | System On Chip (SoC) | The 270087-001E is a system-on-chip manufactured by Broadcom Limited. Design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the 270087-001E is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| 270087-002E | System On Chip (SoC) | The 270087-002E is a system-on-chip manufactured by Broadcom Limited. Design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the 270087-002E is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| 58302B3KFEB05G | System On Chip (SoC) | The 58302B3KFEB05G is a system-on-chip manufactured by Broadcom Limited. Design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the 58302B3KFEB05G is currently in active production through Broadcom Limited's standard distribution channels. | — | 2.322 In Stock | RFQ | ACTIVE | RFQ |
| 5962-9755701EPA | Op Amps & Instrumentation Amplifiers | The 5962-9755701EPA is an instrumentation amplifier manufactured by Broadcom Limited. Technical highlights include -55°C ~ 125°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 8-CDIP (0.300", 7.62mm) package and is rated for operation across -55°C ~ 125°C. Designed for audio systems, instrumentation, and medical devices applications, the 5962-9755701EPA is currently in active production through Broadcom Limited's standard distribution channels. | 8-CDIP (0.300", 7.62mm) | 863 In Stock | $1389.87 | ACTIVE | RFQ |
| 5962-9755701EPC | Op Amps & Instrumentation Amplifiers | The 5962-9755701EPC is an instrumentation amplifier manufactured by Broadcom Limited. Technical highlights include -55°C ~ 125°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -55°C ~ 125°C. Designed for audio systems, instrumentation, and medical devices applications, the 5962-9755701EPC is currently in active production through Broadcom Limited's standard distribution channels. | 8-DIP (0.300", 7.62mm) | 1.825 In Stock | $1389.87 | ACTIVE | RFQ |
| 5962-9755701HPA | Op Amps & Instrumentation Amplifiers | The 5962-9755701HPA is an instrumentation amplifier manufactured by Broadcom Limited. Technical highlights include -55°C ~ 125°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -55°C ~ 125°C. Designed for audio systems, instrumentation, and medical devices applications, the 5962-9755701HPA is currently in active production through Broadcom Limited's standard distribution channels. | 8-DIP (0.300", 7.62mm) | 1.923 In Stock | $372.02 | ACTIVE | RFQ |
| 5962-9755701HPC | Op Amps & Instrumentation Amplifiers | The 5962-9755701HPC is an instrumentation amplifier manufactured by Broadcom Limited. Technical highlights include -55°C ~ 125°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -55°C ~ 125°C. Designed for audio systems, instrumentation, and medical devices applications, the 5962-9755701HPC is currently in active production through Broadcom Limited's standard distribution channels. | 8-DIP (0.300", 7.62mm) | 2.536 In Stock | $345.71 | ACTIVE | RFQ |
| 5962-9755701HXA | Op Amps & Instrumentation Amplifiers | The 5962-9755701HXA is an instrumentation amplifier manufactured by Broadcom Limited. Technical highlights include -55°C ~ 125°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 8-SMD, Gull Wing package and is rated for operation across -55°C ~ 125°C. Designed for audio systems, instrumentation, and medical devices applications, the 5962-9755701HXA is currently in active production through Broadcom Limited's standard distribution channels. | 8-SMD, Gull Wing | 1.512 In Stock | $351.60 | ACTIVE | RFQ |
| 5962-9755701HYA | Op Amps & Instrumentation Amplifiers | The 5962-9755701HYA is an instrumentation amplifier manufactured by Broadcom Limited. Technical highlights include -55°C ~ 125°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 8-SMD Butt Joint package and is rated for operation across -55°C ~ 125°C. Designed for audio systems, instrumentation, and medical devices applications, the 5962-9755701HYA is currently in active production through Broadcom Limited's standard distribution channels. | 8-SMD Butt Joint | 1.210 In Stock | $376.53 | ACTIVE | RFQ |
| 5962-9755701HYC | Op Amps & Instrumentation Amplifiers | The 5962-9755701HYC is an instrumentation amplifier manufactured by Broadcom Limited. Technical highlights include -55°C ~ 125°C operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This Surface Mount component is supplied in a 8-SMD Butt Joint package and is rated for operation across -55°C ~ 125°C. Designed for audio systems, instrumentation, and medical devices applications, the 5962-9755701HYC is currently in active production through Broadcom Limited's standard distribution channels. | 8-SMD Butt Joint | 2.554 In Stock | $375.78 | ACTIVE | RFQ |
| 6N137-000E | Op Amps & Instrumentation Amplifiers | The 6N137-000E is an instrumentation amplifier manufactured by Broadcom Limited. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm amplifier gain, bandwidth, ADC or DAC signal-chain fit, supply voltage, and operating temperature limits. This THT component is supplied in a DIP-8 package and is rated for operation across -40°C ~ 85°C (TA). Designed for audio systems, instrumentation, and medical devices applications, the 6N137-000E is currently in active production through Broadcom Limited's standard distribution channels. | DIP-8 | 250 In Stock | $1.50 | ACTIVE | RFQ |
| 7019DPKFEBA01 | Specialized ICs | The 7019DPKFEBA01 is a specialized telecom IC manufactured by Broadcom Limited. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the 7019DPKFEBA01 is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| 7019DPKFEBA03 | Specialized ICs | The 7019DPKFEBA03 is a specialized telecom IC manufactured by Broadcom Limited. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the 7019DPKFEBA03 is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| 7230ZBKFEBA03G | Specialized ICs | The 7230ZBKFEBA03G is a specialized telecom IC manufactured by Broadcom Limited. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the 7230ZBKFEBA03G is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| 7231NCKFEBA01G | Specialized ICs | The 7231NCKFEBA01G is a specialized telecom IC manufactured by Broadcom Limited. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the 7231NCKFEBA01G is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| 7231TPKFEBA01G | Specialized ICs | The 7231TPKFEBA01G is a specialized telecom IC manufactured by Broadcom Limited. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the 7231TPKFEBA01G is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| 7231ZBKFEBA03G | Specialized ICs | The 7231ZBKFEBA03G is a specialized telecom IC manufactured by Broadcom Limited. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the 7231ZBKFEBA03G is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| 7231ZZKFEB01G | Specialized ICs | The 7231ZZKFEB01G is a specialized telecom IC manufactured by Broadcom Limited. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the 7231ZZKFEB01G is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| 7252APKFSBB1 | Specialized ICs | The 7252APKFSBB1 is a specialized telecom IC manufactured by Broadcom Limited. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the 7252APKFSBB1 is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | RFQ | OBSOLETE | RFQ |
| 7252LPKFSBB1 | Specialized ICs | The 7252LPKFSBB1 is a specialized telecom IC manufactured by Broadcom Limited. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the 7252LPKFSBB1 is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | — | RFQ for sourcing | RFQ | OBSOLETE | RFQ |