High-value FPGA
Legacy Xilinx Virtex FPGA Sourcing
Quote Virtex-II, Virtex-4, and Virtex-5 parts with sourcing checks for provenance, package, speed grade, and lot history.
XC2VXC4VXC5V Virtex sourcing
Before you buy: verify the exact lot.FPGACenter confirms package, speed grade, date code, MOQ, lead time, and acceptable alternates before order commitment.
| Part Number | Manufacturer | Description | Package | Stock | Lead Time | Status | |
|---|---|---|---|---|---|---|---|
| XC2VP7-6FF672I | Xilinx | The XC2VP7-6FF672I is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 672-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-6FF672I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 672-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V1500-4FFG896C | Xilinx | The XC2V1500-4FFG896C is an FPGA manufactured by Xilinx. Key technical specifications include 1500000 gates, 1920 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 896-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V1500-4FFG896C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 896-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2VP2-6FGG256C | Xilinx | The XC2VP2-6FGG256C is an FPGA manufactured by Xilinx. Key technical specifications include 3168 logic elements, 352 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP2-6FGG256C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V250-4FGG256I | Xilinx | The XC2V250-4FGG256I is an FPGA manufactured by Xilinx. Key technical specifications include 250000 gates, 384 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V250-4FGG256I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2VP7-6FFG672I | Xilinx | The XC2VP7-6FFG672I is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 672-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-6FFG672I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 672-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2VP30-5FF1152C | Xilinx | The XC2VP30-5FF1152C is an FPGA manufactured by Xilinx. Key technical specifications include 30816 logic elements, 3424 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1152-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP30-5FF1152C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1152-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V6000-4FF1152I | Xilinx | The XC2V6000-4FF1152I is an FPGA manufactured by Xilinx. Key technical specifications include 6000000 gates, 8448 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1152-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V6000-4FF1152I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1152-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V2000-4FG676I | Xilinx | The XC2V2000-4FG676I is an FPGA manufactured by Xilinx. Key technical specifications include 2000000 gates, 2688 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V2000-4FG676I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 676-BGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V250-4CSG144C | Xilinx | The XC2V250-4CSG144C is an FPGA manufactured by Xilinx. Key technical specifications include 250000 gates, 384 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-TFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V250-4CSG144C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-TFBGA, CSPBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2VP40-6FFG1152C | Xilinx | The XC2VP40-6FFG1152C is an FPGA manufactured by Xilinx. Key technical specifications include 43632 logic elements, 4848 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1152-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP40-6FFG1152C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1152-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2VP4-6FGG256I | Xilinx | The XC2VP4-6FGG256I is an FPGA manufactured by Xilinx. Key technical specifications include 6768 logic elements, 752 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP4-6FGG256I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V3000-6FGG676C | Xilinx | The XC2V3000-6FGG676C is an FPGA manufactured by Xilinx. Key technical specifications include 3000000 gates, 3584 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V3000-6FGG676C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 676-BGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2VP7-5FG456I | Xilinx | The XC2VP7-5FG456I is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 456-BBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-5FG456I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 456-BBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2VP2-5FF672C | Xilinx | The XC2VP2-5FF672C is an FPGA manufactured by Xilinx. Key technical specifications include 3168 logic elements, 352 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 672-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP2-5FF672C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 672-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2VP30-7FFG896C | Xilinx | The XC2VP30-7FFG896C is an FPGA manufactured by Xilinx. Key technical specifications include 30816 logic elements, 3424 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 896-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP30-7FFG896C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 896-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC4VLX15-10FFG676C | Xilinx | The XC4VLX15-10FFG676C is an FPGA manufactured by Xilinx. Key technical specifications include 13824 logic elements, 1536 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC4VLX15-10FFG676C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 676-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2VP40-5FFG1152C | Xilinx | The XC2VP40-5FFG1152C is an FPGA manufactured by Xilinx. Key technical specifications include 43632 logic elements, 4848 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1152-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP40-5FFG1152C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1152-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V500-4FGG456C | Xilinx | The XC2V500-4FGG456C is an FPGA manufactured by Xilinx. Key technical specifications include 500000 gates, 768 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 456-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V500-4FGG456C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 456-BBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V3000-5FG676I | Xilinx | The XC2V3000-5FG676I is an FPGA manufactured by Xilinx. Key technical specifications include 3000000 gates, 3584 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V3000-5FG676I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 676-BGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V4000-4FF1517I | Xilinx | The XC2V4000-4FF1517I is an FPGA manufactured by Xilinx. Key technical specifications include 4000000 gates, 5760 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1517-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V4000-4FF1517I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1517-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2VP100-5FF1704C | Xilinx | The XC2VP100-5FF1704C is an FPGA manufactured by Xilinx. Key technical specifications include 99216 logic elements, 11024 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1704-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP100-5FF1704C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1704-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2VP100-5FFG1704I | Xilinx | The XC2VP100-5FFG1704I is an FPGA manufactured by Xilinx. Key technical specifications include 99216 logic elements, 11024 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1704-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP100-5FFG1704I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1704-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V2000-6FGG676C | Xilinx | The XC2V2000-6FGG676C is an FPGA manufactured by Xilinx. Key technical specifications include 2000000 gates, 2688 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V2000-6FGG676C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 676-BGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2VP7-6FFG672C | Xilinx | The XC2VP7-6FFG672C is an FPGA manufactured by Xilinx. Key technical specifications include 11088 logic elements, 1232 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 672-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP7-6FFG672C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 672-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V3000-4BFG957I | Xilinx | The XC2V3000-4BFG957I is an FPGA manufactured by Xilinx. Key technical specifications include 3000000 gates, 3584 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 957-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V3000-4BFG957I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 957-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2VP40-6FF1148I | Xilinx | The XC2VP40-6FF1148I is an FPGA manufactured by Xilinx. Key technical specifications include 43632 logic elements, 4848 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1148-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP40-6FF1148I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1148-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2VP70-6FF1517C | Xilinx | The XC2VP70-6FF1517C is an FPGA manufactured by Xilinx. Key technical specifications include 74448 logic elements, 8272 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1517-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP70-6FF1517C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1517-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V250-6FGG256C | Xilinx | The XC2V250-6FGG256C is an FPGA manufactured by Xilinx. Key technical specifications include 250000 gates, 384 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V250-6FGG256C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2VP50-5FFG1152I | Xilinx | The XC2VP50-5FFG1152I is an FPGA manufactured by Xilinx. Key technical specifications include 53136 logic elements, 5904 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1152-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP50-5FFG1152I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1152-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V3000-4FF1152I | Xilinx | The XC2V3000-4FF1152I is an FPGA manufactured by Xilinx. Key technical specifications include 3000000 gates, 3584 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1152-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V3000-4FF1152I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1152-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V1000-5FGG456C | Xilinx | The XC2V1000-5FGG456C is an FPGA manufactured by Xilinx. Key technical specifications include 1000000 gates, 1280 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 456-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V1000-5FGG456C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 456-BBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2VP4-5FF672C | Xilinx | The XC2VP4-5FF672C is an FPGA manufactured by Xilinx. Key technical specifications include 6768 logic elements, 752 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 672-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2VP4-5FF672C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 672-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V500-5FGG256C | Xilinx | The XC2V500-5FGG256C is an FPGA manufactured by Xilinx. Key technical specifications include 500000 gates, 768 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V500-5FGG256C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC5VLX50-2FF676C | Xilinx | The XC5VLX50-2FF676C is an FPGA manufactured by Xilinx. Key technical specifications include 46080 logic elements, 3600 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC5VLX50-2FF676C is currently in active production through Xilinx's standard distribution channels. | 676-BBGA, FCBGA | 34.093 In Stock | RFQ | ACTIVE | Verify |
| XC2V2000-5FFG896C | Xilinx | The XC2V2000-5FFG896C is an FPGA manufactured by Xilinx. Key technical specifications include 2000000 gates, 2688 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 896-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V2000-5FFG896C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 896-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V1000-5FF896I | Xilinx | The XC2V1000-5FF896I is an FPGA manufactured by Xilinx. Key technical specifications include 1000000 gates, 1280 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 896-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V1000-5FF896I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 896-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V500-4FG256I | Xilinx | The XC2V500-4FG256I is an FPGA manufactured by Xilinx. Key technical specifications include 500000 gates, 768 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V500-4FG256I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V500-5FG256I | Xilinx | The XC2V500-5FG256I is an FPGA manufactured by Xilinx. Key technical specifications include 500000 gates, 768 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V500-5FG256I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V1000-4BG575I | Xilinx | The XC2V1000-4BG575I is an FPGA manufactured by Xilinx. Key technical specifications include 1000000 gates, 1280 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 575-BBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V1000-4BG575I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 575-BBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC2V4000-5FFG1152C | Xilinx | The XC2V4000-5FFG1152C is an FPGA manufactured by Xilinx. Key technical specifications include 4000000 gates, 5760 LABs/CLBs, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1152-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC2V4000-5FFG1152C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 1152-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
How to reduce sourcing risk for Virtex Legacy
Match the full ordering code
Package, speed grade, temperature range, and lead finish can change whether a device is usable in an existing board.
Ask for lot-level evidence
For older FPGA and CPLD parts, request date code, packaging condition, traceability notes, and inspection scope before purchase.
Check approved alternates early
When the exact part is constrained, pre-approved alternates or same-family package equivalents can protect repair and production timelines.