Legacy FPGA
Xilinx Spartan-3 FPGA Sourcing
Find Spartan-3, Spartan-3E, and Spartan-3A parts for long-life industrial and embedded systems.
XC3SSpartan-3ESpartan-3A sourcing
Before you buy: verify the exact lot.FPGACenter confirms package, speed grade, date code, MOQ, lead time, and acceptable alternates before order commitment.
| Part Number | Manufacturer | Description | Package | Stock | Lead Time | Status | |
|---|---|---|---|---|---|---|---|
| XC3S50-4PQG208I | Xilinx | The XC3S50-4PQG208I is an FPGA manufactured by Xilinx. Key technical specifications include 1728 logic elements, 50000 gates, 192 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S50-4PQG208I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 208-BFQFP | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC3S50-4CPG132C0974 | Xilinx | The XC3S50-4CPG132C0974 is an FPGA manufactured by Xilinx, part of the Spartan®-3 series. Technical highlights include 0°C ~ 85°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 132-TFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S50-4CPG132C0974 is currently in active production through Xilinx's standard distribution channels. | 132-TFBGA, CSPBGA | 44.936 In Stock | RFQ | ACTIVE | Verify |
| XC3S500E-4PQ208C | Xilinx | The XC3S500E-4PQ208C is an FPGA manufactured by Xilinx. Key technical specifications include 10476 logic elements, 500000 gates, 1164 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S500E-4PQ208C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 208-BFQFP | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC3S200-4TQG144I | Xilinx | The XC3S200-4TQG144I is an FPGA manufactured by Xilinx. Key technical specifications include 4320 logic elements, 200000 gates, 480 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S200-4TQG144I is currently in active production through Xilinx's standard distribution channels. | 144-LQFP | 35.153 In Stock | RFQ | ACTIVE | Verify |
| XC3S1400AN-4FGG484C | Rochester Electronics | The XC3S1400AN-4FGG484C is an FPGA manufactured by Rochester Electronics. Key technical specifications include 25344 logic elements, 1400000 gates, 2816 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S1400AN-4FGG484C is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 484-BBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC3S100E-4VQG100C | Xilinx | The XC3S100E-4VQG100C is an FPGA manufactured by Xilinx. Key technical specifications include 2160 logic elements, 100000 gates, 240 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 100-TQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S100E-4VQG100C is currently in active production through Xilinx's standard distribution channels. | 100-TQFP | 29.963 In Stock | RFQ | ACTIVE | Verify |
| XC3S200AN-4FT256I | Xilinx | The XC3S200AN-4FT256I is an FPGA manufactured by Xilinx. Key technical specifications include 4032 logic elements, 200000 gates, 448 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S200AN-4FT256I is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 29.353 In Stock | RFQ | ACTIVE | Verify |
| XC3S200-4PQ208C | Xilinx | The XC3S200-4PQ208C is an FPGA manufactured by Xilinx. Key technical specifications include 4320 logic elements, 200000 gates, 480 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S200-4PQ208C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 208-BFQFP | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC3S50-4CP132I | Rochester Electronics | The XC3S50-4CP132I is an FPGA manufactured by Rochester Electronics. Key technical specifications include 1728 logic elements, 50000 gates, 192 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 132-TFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S50-4CP132I is currently in active production through Rochester Electronics's standard distribution channels. | 132-TFBGA, CSPBGA | 22.534 In Stock | RFQ | ACTIVE | Verify |
| XC3S100E-4TQG144C | Xilinx | The XC3S100E-4TQG144C is an FPGA manufactured by Xilinx. Key technical specifications include 2160 logic elements, 100000 gates, 240 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S100E-4TQG144C is currently in active production through Xilinx's standard distribution channels. | 144-LQFP | 18.631 In Stock | RFQ | ACTIVE | Verify |
| XC3S100E-4CPG132C | Xilinx | The XC3S100E-4CPG132C is an FPGA manufactured by Xilinx. Key technical specifications include 2160 logic elements, 100000 gates, 240 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 132-TFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S100E-4CPG132C is currently in active production through Xilinx's standard distribution channels. | 132-TFBGA, CSPBGA | 16.560 In Stock | RFQ | ACTIVE | Verify |
| XC3S1200E-4FTG256C | Xilinx | The XC3S1200E-4FTG256C is an FPGA manufactured by Xilinx. Key technical specifications include 19512 logic elements, 1200000 gates, 2168 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S1200E-4FTG256C is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 16.182 In Stock | RFQ | ACTIVE | Verify |
| XC3S50AN-4FTG256C | Rochester Electronics | The XC3S50AN-4FTG256C is an FPGA manufactured by Rochester Electronics. Key technical specifications include 1584 logic elements, 50000 gates, 176 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S50AN-4FTG256C is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-LBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC3S50AN-4FT256C | Xilinx | The XC3S50AN-4FT256C is an FPGA manufactured by Xilinx. Key technical specifications include 1584 logic elements, 50000 gates, 176 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S50AN-4FT256C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-LBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC3S50A-4VQG100I | Xilinx | The XC3S50A-4VQG100I is an FPGA manufactured by Xilinx. Key technical specifications include 1584 logic elements, 50000 gates, 176 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 100-TQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S50A-4VQG100I is currently in active production through Xilinx's standard distribution channels. | 100-TQFP | 15.563 In Stock | RFQ | ACTIVE | Verify |
| XC3S50A-4VQG100C | Xilinx | The XC3S50A-4VQG100C is an FPGA manufactured by Xilinx. Key technical specifications include 1584 logic elements, 50000 gates, 176 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 100-TQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S50A-4VQG100C is currently in active production through Xilinx's standard distribution channels. | 100-TQFP | 15.474 In Stock | RFQ | ACTIVE | Verify |
| XC3S400AN-4FGG400I | Xilinx | The XC3S400AN-4FGG400I is an FPGA manufactured by Xilinx. Key technical specifications include 8064 logic elements, 400000 gates, 896 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 400-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S400AN-4FGG400I is currently in active production through Xilinx's standard distribution channels. | 400-BGA | 15.000 In Stock | RFQ | ACTIVE | Verify |
| XC3S1000-4FTG256I | Xilinx | The XC3S1000-4FTG256I is an FPGA manufactured by Xilinx. Key technical specifications include 17280 logic elements, 1000000 gates, 1920 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S1000-4FTG256I is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 14.580 In Stock | RFQ | ACTIVE | Verify |
| XC3S400A-4FTG256I | Xilinx | The XC3S400A-4FTG256I is an FPGA manufactured by Xilinx. Key technical specifications include 8064 logic elements, 400000 gates, 896 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S400A-4FTG256I is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 14.520 In Stock | RFQ | ACTIVE | Verify |
| XC3S1200E-4FGG320I | Xilinx | The XC3S1200E-4FGG320I is an FPGA manufactured by Xilinx. Key technical specifications include 19512 logic elements, 1200000 gates, 2168 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 320-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S1200E-4FGG320I is currently in active production through Xilinx's standard distribution channels. | 320-BGA | 14.058 In Stock | RFQ | ACTIVE | Verify |
| XC3S500E-4PQG208I | Xilinx | The XC3S500E-4PQG208I is an FPGA manufactured by Xilinx. Key technical specifications include 10476 logic elements, 500000 gates, 1164 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S500E-4PQG208I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 208-BFQFP | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC3S500E-4FTG256C | Xilinx | The XC3S500E-4FTG256C is an FPGA manufactured by Xilinx. Key technical specifications include 10476 logic elements, 500000 gates, 1164 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S500E-4FTG256C is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 13.163 In Stock | 2-4 weeks | ACTIVE | Verify |
| XC3S400-4FTG256I | Xilinx | The XC3S400-4FTG256I is an FPGA manufactured by Xilinx. Key technical specifications include 8064 logic elements, 400000 gates, 896 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S400-4FTG256I is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 12.754 In Stock | RFQ | ACTIVE | Verify |
| XC3S400-4TQG144C | Xilinx | The XC3S400-4TQG144C is an FPGA manufactured by Xilinx. Key technical specifications include 8064 logic elements, 400000 gates, 896 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S400-4TQG144C is currently in active production through Xilinx's standard distribution channels. | 144-LQFP | 12.600 In Stock | RFQ | ACTIVE | Verify |
| XC3S50-4TQG144C | Xilinx | The XC3S50-4TQG144C is an FPGA manufactured by Xilinx. Key technical specifications include 1728 logic elements, 50000 gates, 192 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S50-4TQG144C is currently in active production through Xilinx's standard distribution channels. | 144-LQFP | 12.036 In Stock | RFQ | ACTIVE | Verify |
| XC3S400-4FTG256C | Xilinx | The XC3S400-4FTG256C is an FPGA manufactured by Xilinx. Key technical specifications include 8064 logic elements, 400000 gates, 896 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S400-4FTG256C is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 11.652 In Stock | RFQ | ACTIVE | Verify |
| XC3S100E-4TQG144I | Xilinx | The XC3S100E-4TQG144I is an FPGA manufactured by Xilinx. Key technical specifications include 2160 logic elements, 100000 gates, 240 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S100E-4TQG144I is currently in active production through Xilinx's standard distribution channels. | 144-LQFP | 10.913 In Stock | RFQ | ACTIVE | Verify |
| XC3S200-4VQG100C | Xilinx | The XC3S200-4VQG100C is an FPGA manufactured by Xilinx. Key technical specifications include 4320 logic elements, 200000 gates, 480 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 100-TQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S200-4VQG100C is currently in active production through Xilinx's standard distribution channels. | 100-TQFP | 10.860 In Stock | RFQ | ACTIVE | Verify |
| XC3S500E-4FGG320I | Xilinx | The XC3S500E-4FGG320I is an FPGA manufactured by Xilinx. Key technical specifications include 10476 logic elements, 500000 gates, 1164 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 320-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S500E-4FGG320I is currently in active production through Xilinx's standard distribution channels. | 320-BGA | 10.800 In Stock | RFQ | ACTIVE | Verify |
| XC3S50A-4TQG144C | Xilinx | The XC3S50A-4TQG144C is an FPGA manufactured by Xilinx. Key technical specifications include 1584 logic elements, 50000 gates, 176 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S50A-4TQG144C is currently in active production through Xilinx's standard distribution channels. | 144-LQFP | 10.800 In Stock | RFQ | ACTIVE | Verify |
| XC3S500E-4VQG100I | Xilinx | The XC3S500E-4VQG100I is an FPGA manufactured by Xilinx. Key technical specifications include 10476 logic elements, 500000 gates, 1164 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 100-TQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S500E-4VQG100I is currently in active production through Xilinx's standard distribution channels. | 100-TQFP | 10.749 In Stock | RFQ | ACTIVE | Verify |
| XC3S500E-4PQG208C | Xilinx | The XC3S500E-4PQG208C is an FPGA manufactured by Xilinx. Key technical specifications include 10476 logic elements, 500000 gates, 1164 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S500E-4PQG208C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 208-BFQFP | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC3S700AN-4FGG484I | Xilinx | The XC3S700AN-4FGG484I is an FPGA manufactured by Xilinx. Key technical specifications include 13248 logic elements, 700000 gates, 1472 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S700AN-4FGG484I is currently in active production through Xilinx's standard distribution channels. | 484-BBGA | 10.500 In Stock | RFQ | ACTIVE | Verify |
| XC3S1500-4FGG456C | Xilinx | The XC3S1500-4FGG456C is an FPGA manufactured by Xilinx. Key technical specifications include 29952 logic elements, 1500000 gates, 3328 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 456-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S1500-4FGG456C is currently in active production through Xilinx's standard distribution channels. | 456-BBGA | 10.500 In Stock | RFQ | ACTIVE | Verify |
| XC3S50AN-4TQG144C | Xilinx | The XC3S50AN-4TQG144C is an FPGA manufactured by Xilinx. Key technical specifications include 1584 logic elements, 50000 gates, 176 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S50AN-4TQG144C is currently in active production through Xilinx's standard distribution channels. | 144-LQFP | 10.440 In Stock | 2-3 weeks | ACTIVE | Verify |
| XC3S250E-4VQG100I | Xilinx | The XC3S250E-4VQG100I is an FPGA manufactured by Xilinx. Key technical specifications include 5508 logic elements, 250000 gates, 612 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 100-TQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S250E-4VQG100I is currently in active production through Xilinx's standard distribution channels. | 100-TQFP | 10.394 In Stock | RFQ | ACTIVE | Verify |
| XC3S400-4PQG208C | Xilinx | The XC3S400-4PQG208C is an FPGA manufactured by Xilinx. Key technical specifications include 8064 logic elements, 400000 gates, 896 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S400-4PQG208C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 208-BFQFP | RFQ for sourcing | 3-5 weeks | OBSOLETE | Verify |
| XC3S200AN-4FTG256C | Xilinx | The XC3S200AN-4FTG256C is an FPGA manufactured by Xilinx. Key technical specifications include 4032 logic elements, 200000 gates, 448 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S200AN-4FTG256C is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 9.480 In Stock | 3-5 weeks | ACTIVE | Verify |
| XC3S1000-4FGG456C | Xilinx | The XC3S1000-4FGG456C is an FPGA manufactured by Xilinx. Key technical specifications include 17280 logic elements, 1000000 gates, 1920 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 456-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S1000-4FGG456C is currently in active production through Xilinx's standard distribution channels. | 456-BBGA | 9.000 In Stock | 4-6 weeks | ACTIVE | Verify |
| XC3S400-5TQ144C | Xilinx | The XC3S400-5TQ144C is an FPGA manufactured by Xilinx. Key technical specifications include 8064 logic elements, 400000 gates, 896 LABs/CLBs, 1.14V ~ 1.26V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC3S400-5TQ144C is currently in active production through Xilinx's standard distribution channels. | 144-LQFP | 9.000 In Stock | RFQ | ACTIVE | Verify |
How to reduce sourcing risk for Spartan-3
Match the full ordering code
Package, speed grade, temperature range, and lead finish can change whether a device is usable in an existing board.
Ask for lot-level evidence
For older FPGA and CPLD parts, request date code, packaging condition, traceability notes, and inspection scope before purchase.
Check approved alternates early
When the exact part is constrained, pre-approved alternates or same-family package equivalents can protect repair and production timelines.