FPGA / SoC
Xilinx 7 Series FPGA and SoC Sourcing
Source Artix-7, Kintex-7, Virtex-7, and Zynq-7000 parts for production shortages, approved alternates, and urgent replenishment.
XC7AXC7KXC7VXC7Z sourcing
Before you buy: verify the exact lot.FPGACenter confirms package, speed grade, date code, MOQ, lead time, and acceptable alternates before order commitment.
| Part Number | Manufacturer | Description | Package | Stock | Lead Time | Status | |
|---|---|---|---|---|---|---|---|
| XC7K420T-1FFG901I | Xilinx | The XC7K420T-1FFG901I is an FPGA manufactured by Xilinx. Key technical specifications include 416960 logic elements, 32575 LABs/CLBs, 0.97V ~ 1.03V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 900-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7K420T-1FFG901I is currently in active production through Xilinx's standard distribution channels. | 900-BBGA, FCBGA | 47.318 In Stock | RFQ | ACTIVE | Verify |
| XC7VX1140T-2FLG1928C | Xilinx | The XC7VX1140T-2FLG1928C is an FPGA manufactured by Xilinx. Key technical specifications include 1139200 logic elements, 89000 LABs/CLBs, 0.97V ~ 1.03V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1924-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7VX1140T-2FLG1928C is currently in active production through Xilinx's standard distribution channels. | 1924-BBGA, FCBGA | 40.026 In Stock | RFQ | ACTIVE | Verify |
| XC7VH580T-2FLG1931C | Xilinx | The XC7VH580T-2FLG1931C is an FPGA manufactured by Xilinx. Key technical specifications include 580480 logic elements, 45350 LABs/CLBs, 0.97V ~ 1.03V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1931-FCBGA (45x45) package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7VH580T-2FLG1931C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | Confirm | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC7K410T-1FFV900I | Xilinx | The XC7K410T-1FFV900I is an FPGA manufactured by Xilinx. Key technical specifications include 406720 logic elements, 31775 LABs/CLBs, 0.97V ~ 1.03V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 900-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7K410T-1FFV900I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 900-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC7A15T-3FTG256E | Xilinx | The XC7A15T-3FTG256E is an FPGA manufactured by Xilinx. Key technical specifications include 16640 logic elements, 1300 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A15T-3FTG256E is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 15.000 In Stock | RFQ | ACTIVE | Verify |
| XC7Z020-L1CLG400I | Xilinx | The XC7Z020-L1CLG400I is a system-on-chip manufactured by Xilinx. Key technical specifications include 256kB RAM, 667MHz clock speed, and CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 400-LFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XC7Z020-L1CLG400I is currently in active production through Xilinx's standard distribution channels. | 400-LFBGA, CSPBGA | 14.700 In Stock | RFQ | ACTIVE | Verify |
| XC7A15T-2FGG484C | Xilinx | The XC7A15T-2FGG484C is an FPGA manufactured by Xilinx. Key technical specifications include 16640 logic elements, 1300 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A15T-2FGG484C is currently in active production through Xilinx's standard distribution channels. | 484-BBGA | 14.100 In Stock | RFQ | ACTIVE | Verify |
| XC7A75T-1FGG484C | Xilinx | The XC7A75T-1FGG484C is an FPGA manufactured by Xilinx. Key technical specifications include 75520 logic elements, 5900 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A75T-1FGG484C is currently in active production through Xilinx's standard distribution channels. | 484-BBGA | 13.500 In Stock | RFQ | ACTIVE | Verify |
| XC7A25T-1CSG325C | Xilinx | The XC7A25T-1CSG325C is an FPGA manufactured by Xilinx. Key technical specifications include 23360 logic elements, 1825 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A25T-1CSG325C is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 13.230 In Stock | RFQ | ACTIVE | Verify |
| XC7A25T-1CSG325I | Xilinx | The XC7A25T-1CSG325I is an FPGA manufactured by Xilinx. Key technical specifications include 23360 logic elements, 1825 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and -40°C ~ 100°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A25T-1CSG325I is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 13.200 In Stock | RFQ | ACTIVE | Verify |
| XC7Z020-2CLG400E | Xilinx | The XC7Z020-2CLG400E is a system-on-chip manufactured by Xilinx. Key technical specifications include 256kB RAM, 766MHz clock speed, and CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 400-LFBGA, CSPBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XC7Z020-2CLG400E is currently in active production through Xilinx's standard distribution channels. | 400-LFBGA, CSPBGA | 12.936 In Stock | RFQ | ACTIVE | Verify |
| XC7A200T-2FBG676C | Xilinx | The XC7A200T-2FBG676C is an FPGA manufactured by Xilinx. Key technical specifications include 215360 logic elements, 16825 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A200T-2FBG676C is currently in active production through Xilinx's standard distribution channels. | 676-BBGA, FCBGA | 12.600 In Stock | RFQ | ACTIVE | Verify |
| XC7A15T-1FTG256C | Xilinx | The XC7A15T-1FTG256C is an FPGA manufactured by Xilinx. Key technical specifications include 16640 logic elements, 1300 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A15T-1FTG256C is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 12.420 In Stock | RFQ | ACTIVE | Verify |
| XC7A35T-2CSG324I | Xilinx | The XC7A35T-2CSG324I is an FPGA manufactured by Xilinx. Key technical specifications include 33280 logic elements, 2600 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A35T-2CSG324I is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 12.150 In Stock | RFQ | ACTIVE | Verify |
| XC7A75T-2FGG676I | Xilinx | The XC7A75T-2FGG676I is an FPGA manufactured by Xilinx, part of the Artix-7 series. Key technical specifications include 75520 logic elements, 5900 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A75T-2FGG676I is currently in active production through Xilinx's standard distribution channels. | 676-BGA | 12.000 In Stock | RFQ | ACTIVE | Verify |
| XC7A35T-2CSG325C | Xilinx | The XC7A35T-2CSG325C is an FPGA manufactured by Xilinx. Key technical specifications include 33280 logic elements, 2600 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A35T-2CSG325C is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 12.000 In Stock | RFQ | ACTIVE | Verify |
| XC7K325T-2FFG900C | Xilinx | The XC7K325T-2FFG900C is an FPGA manufactured by Xilinx. Key technical specifications include 326080 logic elements, 25475 LABs/CLBs, 0.97V ~ 1.03V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 900-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7K325T-2FFG900C is currently in active production through Xilinx's standard distribution channels. | 900-BBGA, FCBGA | 12.000 In Stock | RFQ | ACTIVE | Verify |
| XC7A35T-2FGG484C | Xilinx | The XC7A35T-2FGG484C is an FPGA manufactured by Xilinx. Key technical specifications include 33280 logic elements, 2600 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A35T-2FGG484C is currently in active production through Xilinx's standard distribution channels. | 484-BBGA | 11.670 In Stock | RFQ | ACTIVE | Verify |
| XC7A35T-2CSG325I | Xilinx | The XC7A35T-2CSG325I is an FPGA manufactured by Xilinx. Key technical specifications include 33280 logic elements, 2600 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A35T-2CSG325I is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 11.556 In Stock | RFQ | ACTIVE | Verify |
| XC7A100T-2FGG676I | Xilinx | The XC7A100T-2FGG676I is an FPGA manufactured by Xilinx. Key technical specifications include 101440 logic elements, 7925 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A100T-2FGG676I is currently in active production through Xilinx's standard distribution channels. | 676-BGA | 11.400 In Stock | RFQ | ACTIVE | Verify |
| XC7A35T-1FGG484C | Xilinx | The XC7A35T-1FGG484C is an FPGA manufactured by Xilinx. Key technical specifications include 33280 logic elements, 2600 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A35T-1FGG484C is currently in active production through Xilinx's standard distribution channels. | 484-BBGA | 11.385 In Stock | RFQ | ACTIVE | Verify |
| XC7A15T-2FTG256C | Xilinx | The XC7A15T-2FTG256C is an FPGA manufactured by Xilinx. Key technical specifications include 16640 logic elements, 1300 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A15T-2FTG256C is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 11.370 In Stock | RFQ | ACTIVE | Verify |
| XC7A200T-1FBG676I | Xilinx | The XC7A200T-1FBG676I is an FPGA manufactured by Xilinx. Key technical specifications include 215360 logic elements, 16825 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A200T-1FBG676I is currently in active production through Xilinx's standard distribution channels. | 676-BBGA, FCBGA | 11.310 In Stock | RFQ | ACTIVE | Verify |
| XC7A35T-2CSG324C | Xilinx | The XC7A35T-2CSG324C is an FPGA manufactured by Xilinx. Key technical specifications include 33280 logic elements, 2600 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A35T-2CSG324C is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 11.100 In Stock | RFQ | ACTIVE | Verify |
| XC7A100T-3FGG676E | Xilinx | The XC7A100T-3FGG676E is an FPGA manufactured by Xilinx. Key technical specifications include 101440 logic elements, 7925 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A100T-3FGG676E is currently in active production through Xilinx's standard distribution channels. | 676-BGA | 10.500 In Stock | RFQ | ACTIVE | Verify |
| XC7A100T-2CSG324C | Xilinx | The XC7A100T-2CSG324C is an FPGA manufactured by Xilinx. Key technical specifications include 101440 logic elements, 7925 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A100T-2CSG324C is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 10.200 In Stock | RFQ | ACTIVE | Verify |
| XC7A50T-3FGG484E | Xilinx | The XC7A50T-3FGG484E is an FPGA manufactured by Xilinx. Key technical specifications include 52160 logic elements, 4075 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A50T-3FGG484E is currently in active production through Xilinx's standard distribution channels. | 484-BBGA | 10.200 In Stock | RFQ | ACTIVE | Verify |
| XC7K70T-1FBV484C | Xilinx | The XC7K70T-1FBV484C is an FPGA manufactured by Xilinx. Key technical specifications include 65600 logic elements, 5125 LABs/CLBs, 0.97V ~ 1.03V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA, FCBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7K70T-1FBV484C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 484-BBGA, FCBGA | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC7A75T-2FG484I | Xilinx | The XC7A75T-2FG484I is an FPGA manufactured by Xilinx. Key technical specifications include 75520 logic elements, 5900 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A75T-2FG484I is currently in active production through Xilinx's standard distribution channels. | 484-BBGA | 9.900 In Stock | RFQ | ACTIVE | Verify |
| XC7K70T-2FBG676I | Xilinx | The XC7K70T-2FBG676I is an FPGA manufactured by Xilinx. Key technical specifications include 65600 logic elements, 5125 LABs/CLBs, 0.97V ~ 1.03V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7K70T-2FBG676I is currently in active production through Xilinx's standard distribution channels. | 676-BBGA, FCBGA | 9.900 In Stock | RFQ | ACTIVE | Verify |
| XC7A100T-1FGG676C | Xilinx | The XC7A100T-1FGG676C is an FPGA manufactured by Xilinx. Key technical specifications include 101440 logic elements, 7925 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A100T-1FGG676C is currently in active production through Xilinx's standard distribution channels. | 676-BGA | 9.900 In Stock | RFQ | ACTIVE | Verify |
| XC7A50T-3CSG324E | Xilinx | The XC7A50T-3CSG324E is an FPGA manufactured by Xilinx. Key technical specifications include 52160 logic elements, 4075 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A50T-3CSG324E is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 9.796 In Stock | RFQ | ACTIVE | Verify |
| XC7Z020-1CLG400I | Xilinx | The XC7Z020-1CLG400I is a system-on-chip manufactured by Xilinx. Key technical specifications include 256kB RAM, 667MHz clock speed, and CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 400-LFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XC7Z020-1CLG400I is currently in active production through Xilinx's standard distribution channels. | 400-LFBGA, CSPBGA | 9.600 In Stock | RFQ | ACTIVE | Verify |
| XC7A35T-1CSG324C | Xilinx | The XC7A35T-1CSG324C is an FPGA manufactured by Xilinx. Key technical specifications include 33280 logic elements, 2600 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-LFBGA, CSPBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A35T-1CSG324C is currently in active production through Xilinx's standard distribution channels. | 324-LFBGA, CSPBGA | 9.475 In Stock | RFQ | ACTIVE | Verify |
| XC7Z020-1CLG484I | Xilinx | The XC7Z020-1CLG484I is a system-on-chip manufactured by Xilinx. Key technical specifications include 256kB RAM, 667MHz clock speed, and CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity; design review should also confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, and Flash memory. This standard mount component is supplied in a 484-LFBGA, CSPBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for IoT endpoints, consumer electronics, and industrial automation applications, the XC7Z020-1CLG484I is currently in active production through Xilinx's standard distribution channels. | 484-LFBGA, CSPBGA | 9.316 In Stock | RFQ | ACTIVE | Verify |
| XC7A50T-1FTG256C | Xilinx | The XC7A50T-1FTG256C is an FPGA manufactured by Xilinx. Key technical specifications include 52160 logic elements, 4075 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A50T-1FTG256C is currently in active production through Xilinx's standard distribution channels. | 256-LBGA | 9.300 In Stock | RFQ | ACTIVE | Verify |
| XC7VH580T-G2FLG1155E | Xilinx | The XC7VH580T-G2FLG1155E is an FPGA manufactured by Xilinx. Key technical specifications include 580480 logic elements, 45350 LABs/CLBs, 0.97V ~ 1.03V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1155-FCBGA (35x35) package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7VH580T-G2FLG1155E is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | Confirm | RFQ for sourcing | RFQ | OBSOLETE | Verify |
| XC7K160T-1FFG676I | Xilinx | The XC7K160T-1FFG676I is an FPGA manufactured by Xilinx. Key technical specifications include 162240 logic elements, 12675 LABs/CLBs, 0.97V ~ 1.03V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7K160T-1FFG676I is currently in active production through Xilinx's standard distribution channels. | 676-BBGA, FCBGA | 9.180 In Stock | RFQ | ACTIVE | Verify |
| XC7A100T-L2FGG484E | Xilinx | The XC7A100T-L2FGG484E is an FPGA manufactured by Xilinx. Key technical specifications include 101440 logic elements, 7925 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and 0°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BBGA package and is rated for operation across 0°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A100T-L2FGG484E is currently in active production through Xilinx's standard distribution channels. | 484-BBGA | 9.060 In Stock | RFQ | ACTIVE | Verify |
| XC7A200T-2FBG676I | Xilinx | The XC7A200T-2FBG676I is an FPGA manufactured by Xilinx. Key technical specifications include 215360 logic elements, 16825 LABs/CLBs, 0.95V ~ 1.05V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BBGA, FCBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC7A200T-2FBG676I is currently in active production through Xilinx's standard distribution channels. | 676-BBGA, FCBGA | 9.000 In Stock | RFQ | ACTIVE | Verify |
How to reduce sourcing risk for 7 Series
Match the full ordering code
Package, speed grade, temperature range, and lead finish can change whether a device is usable in an existing board.
Ask for lot-level evidence
For older FPGA and CPLD parts, request date code, packaging condition, traceability notes, and inspection scope before purchase.
Check approved alternates early
When the exact part is constrained, pre-approved alternates or same-family package equivalents can protect repair and production timelines.