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FPGA

Microchip Actel ProASIC and IGLOO Sourcing

Source Actel, ProASIC3, IGLOO, and aerospace-oriented programmable logic with quality documentation review before shipment.

A3PA3PEAGLActel FPGA sourcing
Before you buy: verify the exact lot.FPGACenter confirms package, speed grade, date code, MOQ, lead time, and acceptable alternates before order commitment.
Part NumberManufacturerDescriptionPackageStockLead TimeStatus
A3PN125-Z2VQG100MicrosemiThe A3PN125-Z2VQG100 is an FPGA manufactured by Microsemi. Key technical specifications include 125000 gates, 1.425V ~ 1.575V supply voltage, and -20°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 100-TQFP package and is rated for operation across -20°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3PN125-Z2VQG100 is currently in active production through Microsemi's standard distribution channels.100-TQFP58.954 In StockRFQACTIVEVerify
A3P250-2QNG132MicrosemiThe A3P250-2QNG132 is an FPGA manufactured by Microsemi. Key technical specifications include 250000 gates, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 132-WFQFN package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P250-2QNG132 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners.132-WFQFNRFQ for sourcingRFQOBSOLETEVerify
AGL125V5-CS196IMicrochipThe AGL125V5-CS196I is an FPGA manufactured by Microchip. Key technical specifications include 3072 logic elements, 125000 gates, 1.425V ~ 1.575V supply voltage, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 196-TFBGA, CSBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AGL125V5-CS196I is currently in active production through Microchip's standard distribution channels.196-TFBGA, CSBGA54.449 In StockRFQACTIVEVerify
APA450-FG256MicrosemiThe APA450-FG256 is an FPGA manufactured by Microsemi. Key technical specifications include 450000 gates, 2.3V ~ 2.7V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA450-FG256 is currently in active production through Microsemi's standard distribution channels.256-LBGA54.408 In StockRFQACTIVEVerify
APA750-FGG896IMicrosemiThe APA750-FGG896I is an FPGA manufactured by Microsemi. Key technical specifications include 750000 gates, 2.3V ~ 2.7V supply voltage, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 896-BGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA750-FGG896I is currently in active production through Microsemi's standard distribution channels.896-BGA53.713 In StockRFQACTIVEVerify
AGLE600V2-FG256MicrochipThe AGLE600V2-FG256 is an FPGA manufactured by Microchip. Key technical specifications include 13824 logic elements, 600000 gates, 1.14V ~ 1.575V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AGLE600V2-FG256 is currently in active production through Microchip's standard distribution channels.256-LBGA52.910 In StockRFQACTIVEVerify
A3P1000L-FG256MicrosemiThe A3P1000L-FG256 is an FPGA manufactured by Microsemi. Key technical specifications include 1000000 gates, 1.14V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P1000L-FG256 is currently in active production through Microsemi's standard distribution channels.256-LBGA52.556 In StockRFQACTIVEVerify
AGL1000V5-FGG144MicrochipThe AGL1000V5-FGG144 is an FPGA manufactured by Microchip. Key technical specifications include 24576 logic elements, 1000000 gates, 1.425V ~ 1.575V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LBGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AGL1000V5-FGG144 is currently in active production through Microchip's standard distribution channels.144-LBGA51.024 In StockRFQACTIVEVerify
AGL030V5-UCG81MicrochipThe AGL030V5-UCG81 is an FPGA manufactured by Microchip. Key technical specifications include 768 logic elements, 30000 gates, 1.425V ~ 1.575V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 81-WFBGA, CSBGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AGL030V5-UCG81 is currently in active production through Microchip's standard distribution channels.81-WFBGA, CSBGA50.311 In StockRFQACTIVEVerify
A3P060-TQG144MicrosemiThe A3P060-TQG144 is an FPGA manufactured by Microsemi. Key technical specifications include 60000 gates, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LQFP package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P060-TQG144 is currently in active production through Microsemi's standard distribution channels.144-LQFP49.819 In StockRFQACTIVEVerify
A3P600L-1FGG144IMicrosemiThe A3P600L-1FGG144I is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-1FGG144I is currently in active production through Microsemi's standard distribution channels.144-LBGA49.567 In StockRFQACTIVEVerify
AGL125V2-CS196IMicrochipThe AGL125V2-CS196I is an FPGA manufactured by Microchip. Key technical specifications include 3072 logic elements, 125000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 196-TFBGA, CSBGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AGL125V2-CS196I is currently in active production through Microchip's standard distribution channels.196-TFBGA, CSBGA49.238 In StockRFQACTIVEVerify
AGLN030V2-ZCSG81MicrochipThe AGLN030V2-ZCSG81 is an FPGA manufactured by Microchip. Key technical specifications include 768 logic elements, 30000 gates, 1.14V ~ 1.575V supply voltage, and -20°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 81-WFBGA, CSBGA package and is rated for operation across -20°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AGLN030V2-ZCSG81 is currently in active production through Microchip's standard distribution channels.81-WFBGA, CSBGA49.156 In StockRFQACTIVEVerify
A3PN010-2QNG48IMicrosemiThe A3PN010-2QNG48I is an FPGA manufactured by Microsemi. Key technical specifications include 10000 gates, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 48-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3PN010-2QNG48I is currently in active production through Microsemi's standard distribution channels.48-VFQFN Exposed Pad49.156 In StockRFQACTIVEVerify
APA075-TQ100MicrosemiThe APA075-TQ100 is an FPGA manufactured by Microsemi. Key technical specifications include 75000 gates, 2.3V ~ 2.7V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 100-LQFP package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA075-TQ100 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners.100-LQFPRFQ for sourcingRFQOBSOLETEVerify
A3P1000-1PQ208MMicrosemiThe A3P1000-1PQ208M is an FPGA manufactured by Microsemi. Key technical specifications include 1000000 gates, 1.425V ~ 1.575V supply voltage, and -55°C ~ 125°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across -55°C ~ 125°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P1000-1PQ208M is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners.208-BFQFPRFQ for sourcingRFQOBSOLETEVerify
AGLN250V5-ZVQG100MicrochipThe AGLN250V5-ZVQG100 is an FPGA manufactured by Microchip. Key technical specifications include 6144 logic elements, 250000 gates, 1.425V ~ 1.575V supply voltage, and -20°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 100-TQFP package and is rated for operation across -20°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AGLN250V5-ZVQG100 is currently in active production through Microchip's standard distribution channels.100-TQFP48.228 In StockRFQACTIVEVerify
APA075-PQ208MicrosemiThe APA075-PQ208 is an FPGA manufactured by Microsemi. Key technical specifications include 75000 gates, 2.3V ~ 2.7V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA075-PQ208 is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners.208-BFQFPRFQ for sourcingRFQOBSOLETEVerify
AGLP030V2-CS201IMicrochipThe AGLP030V2-CS201I is an FPGA manufactured by Microchip. Key technical specifications include 792 logic elements, 30000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 201-VFBGA, CSBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AGLP030V2-CS201I is currently in active production through Microchip's standard distribution channels.201-VFBGA, CSBGA47.511 In StockRFQACTIVEVerify
AGL1000V5-FG144MicrochipThe AGL1000V5-FG144 is an FPGA manufactured by Microchip. Key technical specifications include 24576 logic elements, 1000000 gates, 1.425V ~ 1.575V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LBGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AGL1000V5-FG144 is currently in active production through Microchip's standard distribution channels.144-LBGA46.894 In StockRFQACTIVEVerify
A3P125-FGG144IMicrosemiThe A3P125-FGG144I is an FPGA manufactured by Microsemi. Key technical specifications include 125000 gates, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P125-FGG144I is currently in active production through Microsemi's standard distribution channels.144-LBGA46.731 In StockRFQACTIVEVerify
APA300-PQ208MMicrosemiThe APA300-PQ208M is an FPGA manufactured by Microsemi. Key technical specifications include 300000 gates, 2.3V ~ 2.7V supply voltage, and -55°C ~ 125°C (TC) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across -55°C ~ 125°C (TC). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA300-PQ208M is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners.208-BFQFPRFQ for sourcingRFQOBSOLETEVerify
A3PN125-ZVQG100IMicrosemiThe A3PN125-ZVQG100I is an FPGA manufactured by Microsemi. Key technical specifications include 125000 gates, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 100-TQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3PN125-ZVQG100I is currently in active production through Microsemi's standard distribution channels.100-TQFP44.914 In StockRFQACTIVEVerify
APA1000-FGG1152IMicrosemiThe APA1000-FGG1152I is an FPGA manufactured by Microsemi. Key technical specifications include 1000000 gates, 2.3V ~ 2.7V supply voltage, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 1152-BGA package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA1000-FGG1152I is currently in active production through Microsemi's standard distribution channels.1152-BGA44.906 In StockRFQACTIVEVerify
AGLE600V5-FGG256MicrochipThe AGLE600V5-FGG256 is an FPGA manufactured by Microchip. Key technical specifications include 13824 logic elements, 600000 gates, 1.425V ~ 1.575V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 256-LBGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AGLE600V5-FGG256 is currently in active production through Microchip's standard distribution channels.256-LBGA44.171 In StockRFQACTIVEVerify
A3PE3000L-FGG324IMicrosemiThe A3PE3000L-FGG324I is an FPGA manufactured by Microsemi. Key technical specifications include 3000000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 324-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3PE3000L-FGG324I is currently in active production through Microsemi's standard distribution channels.324-BGA43.784 In StockRFQACTIVEVerify
A3P400-PQ208IMicrosemiThe A3P400-PQ208I is an FPGA manufactured by Microsemi. Key technical specifications include 400000 gates, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P400-PQ208I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners.208-BFQFPRFQ for sourcingRFQOBSOLETEVerify
AGL1000V2-FGG144MicrochipThe AGL1000V2-FGG144 is an FPGA manufactured by Microchip. Key technical specifications include 24576 logic elements, 1000000 gates, 1.14V ~ 1.575V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LBGA package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AGL1000V2-FGG144 is currently in active production through Microchip's standard distribution channels.144-LBGA42.898 In StockRFQACTIVEVerify
A3P400-FG144MicrosemiThe A3P400-FG144 is an FPGA manufactured by Microsemi. Key technical specifications include 400000 gates, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LBGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P400-FG144 is currently in active production through Microsemi's standard distribution channels.144-LBGA42.523 In StockRFQACTIVEVerify
AGL125V2-VQG100MicrochipThe AGL125V2-VQG100 is an FPGA manufactured by Microchip. Key technical specifications include 3072 logic elements, 125000 gates, 1.14V ~ 1.575V supply voltage, and 0°C ~ 70°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 100-TQFP package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AGL125V2-VQG100 is currently in active production through Microchip's standard distribution channels.100-TQFP42.139 In StockRFQACTIVEVerify
A3PN010-2QNG48MicrosemiThe A3PN010-2QNG48 is an FPGA manufactured by Microsemi. Key technical specifications include 10000 gates, 1.425V ~ 1.575V supply voltage, and -20°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 48-VFQFN Exposed Pad package and is rated for operation across -20°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3PN010-2QNG48 is currently in active production through Microsemi's standard distribution channels.48-VFQFN Exposed Pad41.537 In StockRFQACTIVEVerify
A3PE1500-2FG676MicrosemiThe A3PE1500-2FG676 is an FPGA manufactured by Microsemi. Key technical specifications include 1500000 gates, 1.425V ~ 1.575V supply voltage, and 0°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 676-BGA package and is rated for operation across 0°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3PE1500-2FG676 is currently in active production through Microsemi's standard distribution channels.676-BGA41.216 In StockRFQACTIVEVerify
A3P250-FGG144TMicrosemiThe A3P250-FGG144T is an FPGA manufactured by Microsemi. Key technical specifications include 250000 gates, 1.425V ~ 1.575V supply voltage, and -40°C ~ 125°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 144-LBGA package and is rated for operation across -40°C ~ 125°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P250-FGG144T is currently in active production through Microsemi's standard distribution channels.144-LBGA40.817 In StockRFQACTIVEVerify
A3PN060-ZVQG100IMicrosemiThe A3PN060-ZVQG100I is an FPGA manufactured by Microsemi. Key technical specifications include 60000 gates, 1.425V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 100-TQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3PN060-ZVQG100I is currently in active production through Microsemi's standard distribution channels.100-TQFP39.340 In StockRFQACTIVEVerify
AGLN060V2-ZVQG100MicrochipThe AGLN060V2-ZVQG100 is an FPGA manufactured by Microchip. Key technical specifications include 1536 logic elements, 60000 gates, 1.14V ~ 1.575V supply voltage, and -20°C ~ 85°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 100-TQFP package and is rated for operation across -20°C ~ 85°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AGLN060V2-ZVQG100 is currently in active production through Microchip's standard distribution channels.100-TQFP38.715 In StockRFQACTIVEVerify
AGLP030V2-CSG289IMicrochipThe AGLP030V2-CSG289I is an FPGA manufactured by Microchip. Key technical specifications include 792 logic elements, 30000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 289-TFBGA, CSBGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the AGLP030V2-CSG289I is currently in active production through Microchip's standard distribution channels.289-TFBGA, CSBGA38.444 In StockRFQACTIVEVerify
A3P600L-FG484IMicrosemiThe A3P600L-FG484I is an FPGA manufactured by Microsemi. Key technical specifications include 600000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 484-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P600L-FG484I is currently in active production through Microsemi's standard distribution channels.484-BGA37.952 In StockRFQACTIVEVerify
APA075-PQ208IMicrosemiThe APA075-PQ208I is an FPGA manufactured by Microsemi. Key technical specifications include 75000 gates, 2.3V ~ 2.7V supply voltage, and -40°C ~ 85°C (TA) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 208-BFQFP package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the APA075-PQ208I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners.208-BFQFPRFQ for sourcingRFQOBSOLETEVerify
A3P250-PQ208IMicrosemiThe A3P250-PQ208I is an FPGA manufactured by Microsemi, part of the ProASIC3 series. Technical highlights include -40°C ~ 100°C (TJ) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a 208-BFQFP package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3P250-PQ208I is no longer produced by Microsemi; FPGACenter maintains verified stock sourced through certified supply chain partners.208-BFQFPRFQ for sourcingRFQOBSOLETEVerify
A3PE3000L-FGG896IMicrosemiThe A3PE3000L-FGG896I is an FPGA manufactured by Microsemi. Key technical specifications include 3000000 gates, 1.14V ~ 1.575V supply voltage, and -40°C ~ 100°C (TJ) operating temperature; design review should also confirm logic resources, I/O planning, and clock constraints. This Surface Mount component is supplied in a 896-BGA package and is rated for operation across -40°C ~ 100°C (TJ). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the A3PE3000L-FGG896I is currently in active production through Microsemi's standard distribution channels.896-BGA37.068 In StockRFQACTIVEVerify

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