Component category
Telecom ICs
FPGACenter stocks 4,123 Telecom ICs part numbers across Microchip, Rochester, and Broadcom. Same-day dispatch on in-stock items.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Microchip | The LE89156PQCT is a specialized telecom IC manufactured by Microchip. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and PCM interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 48-VQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE89156PQCT is currently in active production through Microchip's standard distribution channels. | 48-VQFN Exposed Pad | 31.051 In Stock | $0.0090 | 1 | ACTIVE | ||
| Microchip | The LE89316QVC is a specialized telecom IC manufactured by Microchip. Technical highlights include 4-Wire Serial interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 48-LQFP package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE89316QVC is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $2.29 | 1 | OBSOLETE | ||
| Microchip | The LE89316QVCT is a specialized telecom IC manufactured by Microchip. Technical highlights include 4-Wire Serial interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 48-LQFP package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE89316QVCT is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Microchip | The LE89336QVC is a specialized telecom IC manufactured by Microchip. Technical highlights include PCM interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 48-LQFP package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE89336QVC is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $8.63 | 1 | OBSOLETE | ||
| Microchip | The LE89336QVCT is a specialized telecom IC manufactured by Microchip. Technical highlights include PCM interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 48-LQFP package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE89336QVCT is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $8.81 | 1 | OBSOLETE | ||
| Microchip | The LE89810BSC is a specialized telecom IC manufactured by Microchip. Technical highlights include PCM interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE89810BSC is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Microchip | The LE89810BSCT is a specialized telecom IC manufactured by Microchip. Technical highlights include PCM interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE89810BSCT is currently in active production through Microchip's standard distribution channels. | Check | 720 In Stock | RFQ | 1 | ACTIVE | ||
| Microchip | The LE89830JSC is a specialized telecom IC manufactured by Microchip. Technical highlights include PCM interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE89830JSC is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $9.90 | 1 | OBSOLETE | ||
| Microchip | The LE89830JSCT is a specialized telecom IC manufactured by Microchip. Technical highlights include PCM interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE89830JSCT is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Microchip | The LE89900AMC is a specialized telecom IC manufactured by Microchip. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 10-MSOP package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE89900AMC is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Microchip | The LE89900AMCT is a specialized telecom IC manufactured by Microchip. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 10-MSOP package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE89900AMCT is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Microchip | The LE9500ABJC is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage and Parallel interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-PLCC package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE9500ABJC is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Microchip | The LE9500ABJCT is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage and Parallel interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-PLCC package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE9500ABJCT is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $1.28 | 1 | OBSOLETE | ||
| Microchip | The LE9500BBJC is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage and Parallel interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-PLCC package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE9500BBJC is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Microchip | The LE9500BBJCT is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage and Parallel interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-PLCC package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE9500BBJCT is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Microchip | The LE9500CBJC is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage and Parallel interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-PLCC package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE9500CBJC is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Microchip | The LE9500CBJCT is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage and Parallel interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-PLCC package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE9500CBJCT is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Microchip | The LE9500DBJC is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage and Parallel interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-PLCC package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE9500DBJC is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $2.87 | 1 | OBSOLETE | ||
| Microchip | The LE9500DBJCT is a specialized telecom IC manufactured by Microchip. Technical highlights include 3.3V supply voltage and Parallel interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-PLCC package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE9500DBJCT is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $0.9000 | 1 | OBSOLETE | ||
| Microchip | The LE9502BTC is a specialized telecom IC manufactured by Microchip. Key technical specifications include 3.3V supply voltage, -40°C ~ 85°C operating temperature, and 2-Wire interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 44-TQFP Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the LE9502BTC is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners. | 44-TQFP Exposed Pad | RFQ for sourcing | $11.40 | 1 | OBSOLETE |