Component category
Telecom ICs
FPGACenter stocks 4,123 Telecom ICs part numbers across Microchip, Rochester, and Broadcom. Same-day dispatch on in-stock items.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Rochester Electronics | The DS3152B1 is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3152B1 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $54.80 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3152N is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3152N is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $63.00 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3152N+ is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3152N+ is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $59.53 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3153 is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3153 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $74.78 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3153+ is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3153+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $80.56 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3153N is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3153N is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $492.38 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3153N# is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3153N# is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $59.83 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3153N+ is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3153N+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3154 is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3154 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $95.87 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3154+ is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3154+ is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $1001.88 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3154A2 is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3154A2 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $105.66 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3154N is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3154N is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $18.00 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3154N# is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3154N# is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $89.99 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3154NA2 is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3154NA2 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $6.27 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3154NB1 is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3154NB1 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $8.10 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3154NCA2 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3154NCA2 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $103.50 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3162 is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3162 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $208.84 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3170 is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 100-LBGA, CSBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3170 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 100-LBGA, CSBGA | RFQ for sourcing | $105.38 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3170+ is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 100-LBGA, CSBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3170+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 100-LBGA, CSBGA | RFQ for sourcing | $11.70 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3170N is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and DS3, E3 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 100-LBGA, CSBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3170N is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 100-LBGA, CSBGA | RFQ for sourcing | $751.93 | 1 | OBSOLETE |