Component category
Telecom ICs
FPGACenter stocks 4,123 Telecom ICs part numbers across Microchip, Rochester, and Broadcom. Same-day dispatch on in-stock items.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Maxim Integrated | The DS26524GNA5 is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-LBGA, CSBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26524GNA5 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-LBGA, CSBGA | RFQ for sourcing | $96.30 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS26524GNA5+ is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-LBGA, CSBGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS26524GNA5+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-LBGA, CSBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Maxim Integrated | The DS2733E+ is a specialized telecom IC manufactured by Maxim Integrated. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 20-TSSOP (0.173", 4.40mm Width) package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS2733E+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-TSSOP (0.173", 4.40mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Maxim Integrated | The DS2733E+T&R is a specialized telecom IC manufactured by Maxim Integrated. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 20-TSSOP (0.173", 4.40mm Width) package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS2733E+T&R is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-TSSOP (0.173", 4.40mm Width) | RFQ for sourcing | $6.67 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3112 is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and Parallel/Serial interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3112 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3112+ is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and Parallel/Serial interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3112+ is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | $843.90 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3112+W is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and Parallel/Serial interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3112+W is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | $15.08 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3112D1 is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and Parallel/Serial interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3112D1 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | $91.95 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3112D1+ is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and Parallel/Serial interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3112D1+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | $104.96 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3112N is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and Parallel/Serial interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3112N is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | $9.00 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3112N+ is a specialized telecom IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3112N+ is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $798.97 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3112N+W is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, -40°C ~ 85°C operating temperature, and Parallel/Serial interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3112N+W is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3120 is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 2.97V ~ 3.63V supply voltage, 0°C ~ 70°C operating temperature, and Parallel/Serial interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 316-BGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3120 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 316-BGA | RFQ for sourcing | $379.97 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3120N is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 2.97V ~ 3.63V supply voltage, -40°C ~ 85°C operating temperature, and Parallel/Serial interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 316-BGA package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3120N is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 316-BGA | RFQ for sourcing | $233.43 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS31256 is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3V ~ 3.6V supply voltage, 0°C ~ 70°C operating temperature, and Serial interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS31256 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | $255.48 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS31256+ is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3V ~ 3.6V supply voltage, 0°C ~ 70°C operating temperature, and Serial interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS31256+ is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | $120.72 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS31256B is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3V ~ 3.6V supply voltage, 0°C ~ 70°C operating temperature, and Serial interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS31256B is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | $963.73 | 1 | OBSOLETE | ||
| Rochester Electronics | The DS3134 is a specialized telecom IC manufactured by Rochester Electronics. Key technical specifications include 3V ~ 3.6V supply voltage, 0°C ~ 70°C operating temperature, and Serial interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 256-BGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3134 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 256-BGA | RFQ for sourcing | $1095.65 | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3141 is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3141 is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Maxim Integrated | The DS3141+ is a specialized telecom IC manufactured by Maxim Integrated. Key technical specifications include 3.135V ~ 3.465V supply voltage, 0°C ~ 70°C operating temperature, and LIU interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 144-BGA, CSPBGA package and is rated for operation across 0°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the DS3141+ is no longer produced by Maxim Integrated; FPGACenter maintains verified stock sourced through certified supply chain partners. | 144-BGA, CSPBGA | RFQ for sourcing | $1.29 | 1 | OBSOLETE |