Component category
Telecom ICs
FPGACenter stocks 4,123 Telecom ICs part numbers across Microchip, Rochester, and Broadcom. Same-day dispatch on in-stock items.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Broadcom Limited | The BCM88664A0KFSBLG is a specialized telecom IC manufactured by Broadcom Limited. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BCM88664A0KFSBLG is currently in active production through Broadcom Limited's standard distribution channels. | Check | 2.905 In Stock | RFQ | 1 | ACTIVE | ||
| Broadcom Limited | The BCM88664LA0KFSBG is a specialized telecom IC manufactured by Broadcom Limited. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BCM88664LA0KFSBG is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Broadcom Limited | The BCM88732B2KFSBLG is a specialized telecom IC manufactured by Broadcom Limited. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BCM88732B2KFSBLG is currently in active production through Broadcom Limited's standard distribution channels. | Check | 3.157 In Stock | RFQ | 1 | ACTIVE | ||
| Broadcom Limited | The BCM88750B0KFSBLG is a specialized telecom IC manufactured by Broadcom Limited. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BCM88750B0KFSBLG is currently in active production through Broadcom Limited's standard distribution channels. | Check | 2.566 In Stock | $7741.08 | 1 | ACTIVE | ||
| Broadcom Limited | The BCM88752KFSBG is a specialized telecom IC manufactured by Broadcom Limited. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BCM88752KFSBG is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Broadcom Limited | The BCM88753B0KFSBG is a specialized telecom IC manufactured by Broadcom Limited. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BCM88753B0KFSBG is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Broadcom Limited | The BCM88753B0KFSBLG is a specialized telecom IC manufactured by Broadcom Limited. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BCM88753B0KFSBLG is currently in active production through Broadcom Limited's standard distribution channels. | Check | 4.728 In Stock | RFQ | 1 | ACTIVE | ||
| Broadcom Limited | The BCM957414N4140C is a specialized telecom IC manufactured by Broadcom Limited. Technical highlights include 3.3V, 12V supply voltage and PCI interface; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BCM957414N4140C is currently in active production through Broadcom Limited's standard distribution channels. | Check | 1.605 In Stock | $1221.96 | 1 | ACTIVE | ||
| Infineon Technologies | The BGT60E6327XTSA1 is a specialized telecom IC manufactured by Infineon Technologies. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 119-WFBGA, WLBGA package suitable for both prototyping and production builds. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BGT60E6327XTSA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners. | 119-WFBGA, WLBGA | RFQ for sourcing | $49.73 | 1 | OBSOLETE | ||
| ROHM Semiconductor | The BU8307CF-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 2.5V ~ 5.5V supply voltage and -10°C ~ 60°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 24-SOIC (0.213", 5.40mm Width) package and is rated for operation across -10°C ~ 60°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BU8307CF-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 24-SOIC (0.213", 5.40mm Width) | 501 In Stock | RFQ | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU8761KV is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 2.7V ~ 3.3V supply voltage and -30°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 48-LQFP package and is rated for operation across -30°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BU8761KV is currently in active production through ROHM Semiconductor's standard distribution channels. | 48-LQFP | 2.061 In Stock | RFQ | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU8763FV-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 2.7V ~ 3.6V supply voltage and -20°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -20°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BU8763FV-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 16-LSSOP (0.173", 4.40mm Width) | 2.269 In Stock | $15.02 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU8766FV-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 2.2V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BU8766FV-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 16-LSSOP (0.173", 4.40mm Width) | 1.064 In Stock | $18.09 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU8772KN is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 2.7V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-VFQFN package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BU8772KN is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-VFQFN | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| ROHM Semiconductor | The BU8772KN-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 2.7V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-VFQFN package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BU8772KN-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-VFQFN | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| ROHM Semiconductor | The BU8788KN-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Key technical specifications include 2.2V ~ 3.6V supply voltage, -40°C ~ 85°C operating temperature, and ADPCM interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This Surface Mount component is supplied in a 36-VFQFN package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BU8788KN-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 36-VFQFN | 2.016 In Stock | $35.53 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU8793KN-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 2.7V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-VFQFN package and is rated for operation across -40°C ~ 85°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BU8793KN-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 28-VFQFN | 1.854 In Stock | $13.33 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU8871F-E2 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 4.75V ~ 5.25V supply voltage and -10°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.213", 5.40mm Width) package and is rated for operation across -10°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BU8871F-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners. | 18-SOIC (0.213", 5.40mm Width) | RFQ for sourcing | $4.05 | 1 | OBSOLETE | ||
| ROHM Semiconductor | The BU8874 is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 4.75V ~ 5.25V supply voltage and -10°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -10°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BU8874 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| ROHM Semiconductor | The BU8874F is a specialized telecom IC manufactured by ROHM Semiconductor. Technical highlights include 4.75V ~ 5.25V supply voltage and -10°C ~ 70°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 18-SOIC (0.213", 5.40mm Width) package and is rated for operation across -10°C ~ 70°C. Designed for industrial automation, consumer electronics, and telecommunications infrastructure applications, the BU8874F is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners. | 18-SOIC (0.213", 5.40mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE |