Hard-to-find, EOL, and shortage parts24h target RFQ responseInspection, traceability, and alternate sourcing
Component category

SRAM

Find SRAM from Renesas, Rochester, and additional brands. 17,611 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.

Part NumberManufacturerDescriptionPackageStockPriceMOQStatus
MicrochipThe 23LCV1024-I/P is an SRAM memory device manufactured by Microchip. Key technical specifications include 1Mb (128K x 8) memory size, 2.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 23LCV1024-I/P is currently in active production through Microchip's standard distribution channels.8-DIP (0.300", 7.62mm)6.768 In Stock$1.731ACTIVE
MicrochipThe 23LCV1024-I/SN is an SRAM memory device manufactured by Microchip. Key technical specifications include 1Mb (128K x 8) memory size, 2.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 23LCV1024-I/SN is currently in active production through Microchip's standard distribution channels.8-SOIC (0.154", 3.90mm Width)14.838 In Stock$2.411ACTIVE
MicrochipThe 23LCV1024-I/ST is an SRAM memory device manufactured by Microchip. Key technical specifications include 1Mbit memory size, 2.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 23LCV1024-I/ST is currently in active production through Microchip's standard distribution channels.8-TSSOP (0.173", 4.40mm Width)7.876 In Stock$1.791ACTIVE
MicrochipThe 23LCV1024T-E/SN is an SRAM memory device manufactured by Microchip. Key technical specifications include 1Mb (128K x 8) memory size, 2.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 23LCV1024T-E/SN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.8-SOIC (0.154", 3.90mm Width)RFQ for sourcing$2.671OBSOLETE
MicrochipThe 23LCV1024T-E/ST is an SRAM memory device manufactured by Microchip. Key technical specifications include 1Mb (128K x 8) memory size, 2.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 23LCV1024T-E/ST is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.8-TSSOP (0.173", 4.40mm Width)RFQ for sourcing$2.701OBSOLETE
MicrochipThe 23LCV1024T-I/SN is an SRAM memory device manufactured by Microchip. Key technical specifications include 1Mb (128K x 8) memory size, 2.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 23LCV1024T-I/SN is currently in active production through Microchip's standard distribution channels.8-SOIC (0.154", 3.90mm Width)9.918 In Stock$2.621ACTIVE
MicrochipThe 23LCV512-E/P is an SRAM memory device manufactured by Microchip. Key technical specifications include 512Kb (64K x 8) memory size, 2.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 23LCV512-E/P is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.8-DIP (0.300", 7.62mm)RFQ for sourcing$3.361OBSOLETE
MicrochipThe 23LCV512-E/SN is an SRAM memory device manufactured by Microchip. Key technical specifications include 512Kb (64K x 8) memory size, 2.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 23LCV512-E/SN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.8-SOIC (0.154", 3.90mm Width)RFQ for sourcing$1.961OBSOLETE
MicrochipThe 23LCV512-E/ST is an SRAM memory device manufactured by Microchip. Key technical specifications include 512Kb (64K x 8) memory size, 2.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 23LCV512-E/ST is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.8-TSSOP (0.173", 4.40mm Width)RFQ for sourcing$2.011OBSOLETE
MicrochipThe 23LCV512-I/P is an SRAM memory device manufactured by Microchip. Key technical specifications include 512Kb (64K x 8) memory size, 2.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 23LCV512-I/P is currently in active production through Microchip's standard distribution channels.8-DIP (0.300", 7.62mm)6.885 In Stock$0.56251ACTIVE
MicrochipThe 23LCV512-I/SN is an SRAM memory device manufactured by Microchip. Key technical specifications include 512Kbit memory size, 2.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 23LCV512-I/SN is currently in active production through Microchip's standard distribution channels.8-SOIC (0.154", 3.90mm Width)4.401 In Stock$1.741ACTIVE
MicrochipThe 23LCV512-I/ST is an SRAM memory device manufactured by Microchip. Key technical specifications include 512Kbit memory size, 2.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 23LCV512-I/ST is currently in active production through Microchip's standard distribution channels.8-TSSOP (0.173", 4.40mm Width)16.092 In Stock$1.901ACTIVE
MicrochipThe 23LCV512T-E/SN is an SRAM memory device manufactured by Microchip. Key technical specifications include 512Kb (64K x 8) memory size, 2.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 23LCV512T-E/SN is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.8-SOIC (0.154", 3.90mm Width)RFQ for sourcing$5.871OBSOLETE
MicrochipThe 23LCV512T-E/ST is an SRAM memory device manufactured by Microchip. Key technical specifications include 512Kb (64K x 8) memory size, 2.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 125°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 23LCV512T-E/ST is no longer produced by Microchip; FPGACenter maintains verified stock sourced through certified supply chain partners.8-TSSOP (0.173", 4.40mm Width)RFQ for sourcing$1.951OBSOLETE
MicrochipThe 23LCV512T-I/SN is an SRAM memory device manufactured by Microchip. Key technical specifications include 512Kb (64K x 8) memory size, 2.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 23LCV512T-I/SN is currently in active production through Microchip's standard distribution channels.8-SOIC (0.154", 3.90mm Width)3.450 In Stock$1.861ACTIVE
MicrochipThe 23LCV512T-I/ST is an SRAM memory device manufactured by Microchip. Key technical specifications include 512Kb (64K x 8) memory size, 2.5V ~ 5.5V supply voltage, and Volatile memory type; design review should also confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, and supply voltage. This Surface Mount component is supplied in a 8-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for data center storage, consumer electronics, and automotive infotainment applications, the 23LCV512T-I/ST is currently in active production through Microchip's standard distribution channels.8-TSSOP (0.173", 4.40mm Width)4.500 In Stock$1.901ACTIVE
Rochester ElectronicsThe 24501BVA is an SRAM memory device manufactured by Rochester Electronics. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for data center storage, consumer electronics, and automotive infotainment applications, the 24501BVA is currently in active production through Rochester Electronics's standard distribution channels.Check1.635 In Stock$76.851ACTIVE
Rochester ElectronicsThe 27LS03/BEA is an SRAM memory device manufactured by Rochester Electronics. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for data center storage, consumer electronics, and automotive infotainment applications, the 27LS03/BEA is currently in active production through Rochester Electronics's standard distribution channels.Check5.802 In Stock$80.421ACTIVE
Rochester ElectronicsThe 27LS07DM/B is an SRAM memory device manufactured by Rochester Electronics. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for data center storage, consumer electronics, and automotive infotainment applications, the 27LS07DM/B is currently in active production through Rochester Electronics's standard distribution channels.Check1.929 In Stock$70.571ACTIVE
Rochester ElectronicsThe 29103BRA is an SRAM memory device manufactured by Rochester Electronics. Design review should confirm memory interface timing, SRAM, DRAM, flash, or EEPROM compatibility, supply voltage, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for data center storage, consumer electronics, and automotive infotainment applications, the 29103BRA is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.CheckRFQ for sourcing$105.741OBSOLETE
Get Quote