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Component category

Sensor & Detector Interfaces

Find Sensor & Detector Interfaces from Renesas, Maxim, and additional brands. 1,335 part numbers available at FPGACenter. Volume pricing, no minimum order.

Part NumberManufacturerDescriptionPackageStockPriceMOQStatus
Infineon TechnologiesThe TCA505BGGEGXUMA1 is an interface IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 110°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 110°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TCA505BGGEGXUMA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners.16-SOIC (0.154", 3.90mm Width)RFQ for sourcingRFQ1OBSOLETE
Infineon TechnologiesThe TCA505BGXLLA1 is an interface IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 110°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 110°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TCA505BGXLLA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners.16-SOIC (0.154", 3.90mm Width)RFQ for sourcingRFQ1OBSOLETE
STMicroelectronicsThe TDA0161DP is an interface IC manufactured by STMicroelectronics. Technical highlights include 150°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 150°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDA0161DP is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners.8-DIP (0.300", 7.62mm)RFQ for sourcing$3.731OBSOLETE
STMicroelectronicsThe TDA0161FP is an interface IC manufactured by STMicroelectronics. Technical highlights include 150°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 150°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDA0161FP is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners.8-SOIC (0.154", 3.90mm Width)RFQ for sourcing$3.731OBSOLETE
STMicroelectronicsThe TDA0161FPT is an interface IC manufactured by STMicroelectronics. Technical highlights include 150°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 150°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDA0161FPT is no longer produced by STMicroelectronics; FPGACenter maintains verified stock sourced through certified supply chain partners.8-SOIC (0.154", 3.90mm Width)RFQ for sourcing$4.441OBSOLETE
ScioSenseThe TDC-GP1 is an interface IC manufactured by ScioSense. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 44-LQFP package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDC-GP1 is no longer produced by ScioSense; FPGACenter maintains verified stock sourced through certified supply chain partners.44-LQFPRFQ for sourcingRFQ1OBSOLETE
ams OSRAMThe TDC-GP2 T&R 1K is an interface IC manufactured by ams OSRAM. Technical highlights include -40°C ~ 120°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 120°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDC-GP2 T&R 1K is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners.32-VFQFN Exposed PadRFQ for sourcingRFQ1OBSOLETE
ScioSenseThe TDC-GP21 1K is an interface IC manufactured by ScioSense. Technical highlights include -40°C ~ 125°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 125°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDC-GP21 1K is currently in active production through ScioSense's standard distribution channels.32-VFQFN Exposed Pad1.574 In Stock$5.531ACTIVE
ScioSenseThe TDC-GP21 3K is an interface IC manufactured by ScioSense. Technical highlights include -40°C ~ 125°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 125°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDC-GP21 3K is currently in active production through ScioSense's standard distribution channels.32-VFQFN Exposed Pad6.801 In Stock$6.591ACTIVE
ams OSRAMThe TDC-GP21 TRA is an interface IC manufactured by ams OSRAM. Technical highlights include -40°C ~ 125°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 125°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDC-GP21 TRA is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners.32-VFQFN Exposed PadRFQ for sourcingRFQ1OBSOLETE
ScioSenseThe TDC-GP22 1K T&R is an interface IC manufactured by ScioSense. Technical highlights include -40°C ~ 125°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 125°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDC-GP22 1K T&R is currently in active production through ScioSense's standard distribution channels.32-VFQFN Exposed Pad2.491 In Stock$2.921ACTIVE
ScioSenseThe TDC-GP22 5K T&R is an interface IC manufactured by ScioSense. Technical highlights include -40°C ~ 125°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 125°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDC-GP22 5K T&R is no longer produced by ScioSense; FPGACenter maintains verified stock sourced through certified supply chain partners.32-VFQFN Exposed PadRFQ for sourcing$4.631OBSOLETE
ams OSRAMThe TDC-GP22 TRA is an interface IC manufactured by ams OSRAM. Technical highlights include -40°C ~ 125°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 125°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDC-GP22 TRA is no longer produced by ams OSRAM; FPGACenter maintains verified stock sourced through certified supply chain partners.32-VFQFN Exposed PadRFQ for sourcingRFQ1OBSOLETE
ScioSenseThe TDC-GP30YA 1K is an interface IC manufactured by ScioSense. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 40-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDC-GP30YA 1K is currently in active production through ScioSense's standard distribution channels.40-VFQFN Exposed Pad5.910 In Stock$8.871ACTIVE
ScioSenseThe TDC-GP30YA-F01 1K is an interface IC manufactured by ScioSense. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 40-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDC-GP30YA-F01 1K is currently in active production through ScioSense's standard distribution channels.40-VFQFN Exposed Pad4.320 In Stock$5.611ACTIVE
ScioSenseThe TDC-GP30YA-F01 3K is an interface IC manufactured by ScioSense. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 40-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDC-GP30YA-F01 3K is no longer produced by ScioSense; FPGACenter maintains verified stock sourced through certified supply chain partners.40-VFQFN Exposed PadRFQ for sourcing$21.561OBSOLETE
ScioSenseThe TDC-GP30YD 1K is an interface IC manufactured by ScioSense. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDC-GP30YD 1K is currently in active production through ScioSense's standard distribution channels.32-VFQFN Exposed Pad4.452 In Stock$8.611ACTIVE
ScioSenseThe TDC-GP30YD 3K is an interface IC manufactured by ScioSense. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDC-GP30YD 3K is currently in active production through ScioSense's standard distribution channels.32-VFQFN Exposed Pad1.501 In Stock$9.981ACTIVE
ams OSRAMThe TDC-GP30YD T&R is an interface IC manufactured by ams OSRAM. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDC-GP30YD T&R is currently in active production through ams OSRAM's standard distribution channels.32-VFQFN Exposed Pad2.027 In StockRFQ1ACTIVE
ScioSenseThe TDC-GP30YD-F01 3K is an interface IC manufactured by ScioSense. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the TDC-GP30YD-F01 3K is no longer produced by ScioSense; FPGACenter maintains verified stock sourced through certified supply chain partners.32-VFQFN Exposed PadRFQ for sourcing$9.621OBSOLETE
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