Component category
Power Switches & Distribution
Find Power Switches & Distribution from Texas Instruments, ST, and additional brands. 10,863 part numbers available at FPGACenter. No MOQ, fast global shipping.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Onsemi | The FPF2281BUCX-F130 is a power distribution IC manufactured by Onsemi. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 12-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2281BUCX-F130 is currently in active production through Onsemi's standard distribution channels. | 12-UFBGA, WLCSP | 43.200 In Stock | $0.3257 | 1 | ACTIVE | ||
| Onsemi | The FPF2283CUCX is a power distribution IC manufactured by Onsemi. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 20-UFBGA, WLCSP package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2283CUCX is currently in active production through Onsemi's standard distribution channels. | 20-UFBGA, WLCSP | 29.472 In Stock | $0.6234 | 1 | ACTIVE | ||
| Onsemi | The FPF2286UCX is a power distribution IC manufactured by Onsemi. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 6-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2286UCX is currently in active production through Onsemi's standard distribution channels. | 6-UFBGA, WLCSP | 43.327 In Stock | $0.1628 | 1 | ACTIVE | ||
| Onsemi | The FPF2290BUCX-F130 is a power distribution IC manufactured by Onsemi. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 12-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2290BUCX-F130 is currently in active production through Onsemi's standard distribution channels. | 12-UFBGA, WLCSP | 9.000 In Stock | $0.4874 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF2300MPX is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2300MPX is currently in active production through Rochester Electronics's standard distribution channels. | 8-WDFN Exposed Pad | 22.949 In Stock | $0.5792 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF2300MX is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2300MX is currently in active production through Rochester Electronics's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 21.434 In Stock | $0.4874 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF2302MPX is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2302MPX is currently in active production through Rochester Electronics's standard distribution channels. | 8-WDFN Exposed Pad | 10.800 In Stock | $0.4680 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF2302MX is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2302MX is currently in active production through Rochester Electronics's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 41.747 In Stock | $0.4874 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF2303MPX is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2303MPX is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-WDFN Exposed Pad | RFQ for sourcing | $0.5070 | 1 | OBSOLETE | ||
| Fairchild Semiconductor | The FPF2303MPXCT is a power distribution IC manufactured by Fairchild Semiconductor. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This standard mount component is supplied in a 8-MLP (3x3) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2303MPXCT is no longer produced by Fairchild Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $0.6657 | 1 | OBSOLETE | ||
| Rochester Electronics | The FPF2303MX is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2303MX is currently in active production through Rochester Electronics's standard distribution channels. | 8-SOIC (0.154", 3.90mm Width) | 10.040 In Stock | $0.6187 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF2310MPX is a power distribution IC manufactured by Rochester Electronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2310MPX is currently in active production through Rochester Electronics's standard distribution channels. | Check | 2.899 In Stock | RFQ | 1 | ACTIVE | ||
| Rochester Electronics | The FPF2312MPX is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2312MPX is currently in active production through Rochester Electronics's standard distribution channels. | 8-WDFN Exposed Pad | 19.732 In Stock | $0.5232 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF2313LMPX is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2313LMPX is currently in active production through Rochester Electronics's standard distribution channels. | 8-WDFN Exposed Pad | 34.776 In Stock | $0.7847 | 1 | ACTIVE | ||
| Rochester Electronics | The FPF2313MPX is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-WDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2313MPX is currently in active production through Rochester Electronics's standard distribution channels. | 8-WDFN Exposed Pad | 24.691 In Stock | $0.4290 | 1 | ACTIVE | ||
| Onsemi | The FPF2388UCX is a power distribution IC manufactured by Onsemi. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2388UCX is no longer produced by Onsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The FPF2411BUCX is a power distribution IC manufactured by Rochester Electronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2411BUCX is currently in active production through Rochester Electronics's standard distribution channels. | Check | 47.562 In Stock | $0.4485 | 1 | ACTIVE | ||
| Onsemi | The FPF2411BUCX-F130 is a power distribution IC manufactured by Onsemi. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 12-UFBGA, WLCSP package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2411BUCX-F130 is currently in active production through Onsemi's standard distribution channels. | 12-UFBGA, WLCSP | 47.957 In Stock | $0.7123 | 1 | ACTIVE | ||
| Onsemi | The FPF2495BUCX is a power distribution IC manufactured by Onsemi. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 9-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2495BUCX is no longer produced by Onsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 9-UFBGA, WLCSP | RFQ for sourcing | $0.7920 | 1 | OBSOLETE | ||
| Onsemi | The FPF2495CUCX is a power distribution IC manufactured by Onsemi. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 9-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the FPF2495CUCX is currently in active production through Onsemi's standard distribution channels. | 9-UFBGA, WLCSP | 16.493 In Stock | $0.4332 | 1 | ACTIVE |