Component category
Power Distribution Switches
Find Power Distribution Switches from ST, Texas Instruments, and additional brands. 6,768 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| NXP Semiconductors | The BUK149-50DL,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-262-3 Long Leads, I²Pak, TO-262AA package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK149-50DL,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-262-3 Long Leads, I²Pak, TO-262AA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK150-50DL,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-262-3 Long Leads, I²Pak, TO-262AA package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK150-50DL,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-262-3 Long Leads, I²Pak, TO-262AA | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK1M200-50SDLD,11 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK1M200-50SDLD,11 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK1M200-50SDLD,51 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK1M200-50SDLD,51 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $7.31 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK1M200-50SGTD,11 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK1M200-50SGTD,11 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $7.56 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK1M200-50SGTD,51 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK1M200-50SGTD,51 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $9.75 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK202-50Y,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK202-50Y,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK204-50Y,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK204-50Y,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | $4.25 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK205-50Y,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK205-50Y,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK208-50Y,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK208-50Y,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK209-50Y,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK209-50Y,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | $0.1950 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK210-50Y,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK210-50Y,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK2114-50SYTS,118 is a power distribution IC manufactured by NXP Semiconductors. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK2114-50SYTS,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK212-50Y,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK212-50Y,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK213-50Y,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK213-50Y,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | $6.53 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK214-50Y,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK214-50Y,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK215-50Y,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK215-50Y,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | $6.32 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK217-50Y,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK217-50Y,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK217-50YT,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK217-50YT,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | $11.34 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK219-50Y,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK219-50Y,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | RFQ | 1 | OBSOLETE |