Component category
Power Distribution Switches
Find Power Distribution Switches from ST, Texas Instruments, and additional brands. 6,768 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| NXP Semiconductors | The BUK108-50DL,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-3, D²Pak (2 Leads + Tab), TO-263AB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK108-50DL,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | RFQ for sourcing | $4.32 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK109-50DL,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-3, D²Pak (2 Leads + Tab), TO-263AB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK109-50DL,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | RFQ for sourcing | $3.95 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK110-50GL,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-3, D²Pak (2 Leads + Tab), TO-263AB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK110-50GL,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | RFQ for sourcing | $3.76 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK114-50L,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK114-50L,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | $5.85 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK116-50L,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK116-50L,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | $4.32 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK117-50DL,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-3 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK117-50DL,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-3 | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK118-50DL,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-3 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK118-50DL,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-3 | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK119-50DL,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-3 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK119-50DL,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-3 | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK124-50L,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK124-50L,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK125-50L,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-5 Formed Leads package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK125-50L,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-220-5 Formed Leads | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK127-50DL,115 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK127-50DL,115 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-261-4, TO-261AA | RFQ for sourcing | $2.13 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK127-50GT,115 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK127-50GT,115 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-261-4, TO-261AA | RFQ for sourcing | $2.18 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK129-50DL,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-3, D²Pak (2 Leads + Tab), TO-263AB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK129-50DL,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | RFQ for sourcing | $4.46 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK130-50DL,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-3, D²Pak (2 Leads + Tab), TO-263AB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK130-50DL,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | RFQ for sourcing | $3.74 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK135-50L,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK135-50L,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK136-50L,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-5, D²Pak (4 Leads + Tab), TO-263BB package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK136-50L,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB | RFQ for sourcing | $5.41 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK138-50DL,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-252-3, DPak (2 Leads + Tab), SC-63 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK138-50DL,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-252-3, DPak (2 Leads + Tab), SC-63 | RFQ for sourcing | $2.57 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK138-50DL/C1,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-252-3, DPak (2 Leads + Tab), SC-63 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK138-50DL/C1,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-252-3, DPak (2 Leads + Tab), SC-63 | RFQ for sourcing | $3.83 | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK139-50DL,118 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-252-3, DPak (2 Leads + Tab), SC-63 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK139-50DL,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-252-3, DPak (2 Leads + Tab), SC-63 | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| NXP Semiconductors | The BUK148-50DL,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-262-3 Long Leads, I²Pak, TO-262AA package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK148-50DL,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | TO-262-3 Long Leads, I²Pak, TO-262AA | RFQ for sourcing | RFQ | 1 | OBSOLETE |