Find Power Distribution Switches from ST, Texas Instruments, and additional brands. 6,768 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
The BTT60201ERAXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTT60201ERAXUMA1 is currently in active production through Infineon Technologies's standard distribution channels.
The BTT60301EKAXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTT60301EKAXUMA1 is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders.
The BTT60301ERAXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTT60301ERAXUMA1 is currently in active production through Infineon Technologies's standard distribution channels.
The BTT60302EKAXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTT60302EKAXUMA1 is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders.
The BTT60302EKBXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTT60302EKBXUMA1 is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders.
The BTT60302ERBXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTT60302ERBXUMA1 is currently in active production through Infineon Technologies's standard distribution channels.
The BTT60501EKAXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTT60501EKAXUMA1 is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders.
The BTT60501ERAXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTT60501ERAXUMA1 is currently in active production through Infineon Technologies's standard distribution channels.
The BTT60502EKAXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTT60502EKAXUMA1 is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders.
The BTT60502ERAXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTT60502ERAXUMA1 is currently in active production through Infineon Technologies's standard distribution channels.
The BTT61002EKAXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTT61002EKAXUMA1 is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders.
The BTT61002ERAXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTT61002ERAXUMA1 is currently in active production through Infineon Technologies's standard distribution channels.
The BTT62001EJAXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTT62001EJAXUMA1 is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders.
The BTT62001ENAXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTT62001ENAXUMA1 is currently in active production through Infineon Technologies's standard distribution channels.
The BTT62004EMAXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-LSSOP (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTT62004EMAXUMA1 is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders.
The BTT62004ESAXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 24-TSSOP (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTT62004ESAXUMA1 is currently in active production through Infineon Technologies's standard distribution channels.
The BUK100-50GL,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-3 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK100-50GL,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.
The BUK101-50GL,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-3 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK101-50GL,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.
The BUK101-50GS,127 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Through Hole component is supplied in a TO-220-3 package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK101-50GS,127 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.
The BUK107-50DL,115 is a power distribution IC manufactured by NXP Semiconductors. Technical highlights include 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BUK107-50DL,115 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners.