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Component category

Power Distribution Switches

Find Power Distribution Switches from ST, Texas Instruments, and additional brands. 6,768 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.

Part NumberManufacturerDescriptionPackageStockPriceMOQStatus
Infineon TechnologiesThe BSP76E6327HUSA1 is a power distribution IC manufactured by Infineon Technologies, part of the HITFET® series. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP76E6327HUSA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners.TO-261-4, TO-261AARFQ for sourcing$0.77441OBSOLETE
Infineon TechnologiesThe BSP76E6433HUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP76E6433HUMA1 is currently in active production through Infineon Technologies's standard distribution channels.TO-261-4, TO-261AA33.480 In Stock$1.211ACTIVE
Infineon TechnologiesThe BSP76E6433NT is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP76E6433NT is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners.TO-261-4, TO-261AARFQ for sourcingRFQ1OBSOLETE
Infineon TechnologiesThe BSP77 E6327 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP77 E6327 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners.TO-261-4, TO-261AARFQ for sourcingRFQ1OBSOLETE
Infineon TechnologiesThe BSP772TNUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP772TNUMA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners.8-SOIC (0.154", 3.90mm Width)RFQ for sourcingRFQ1OBSOLETE
Infineon TechnologiesThe BSP772TXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP772TXUMA1 is currently in active production through Infineon Technologies's standard distribution channels.8-SOIC (0.154", 3.90mm Width)32.916 In Stock$1.391ACTIVE
Infineon TechnologiesThe BSP77E6433HUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP77E6433HUMA1 is currently in active production through Infineon Technologies's standard distribution channels.TO-261-4, TO-261AA10.510 In Stock$0.82571ACTIVE
Infineon TechnologiesThe BSP78 E6327 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-261-4, TO-261AA package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP78 E6327 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners.TO-261-4, TO-261AARFQ for sourcing$1.021OBSOLETE
BSP78E6327
Rochester ElectronicsThe BSP78E6327 is a power distribution IC manufactured by Rochester Electronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BSP78E6327 is currently in active production through Rochester Electronics's standard distribution channels.Check14.088 In Stock$6.921ACTIVE
Infineon TechnologiesThe BTC300101TAAATMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-7, D²Pak (6 Leads + Tab) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTC300101TAAATMA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners.TO-263-7, D²Pak (6 Leads + Tab)RFQ for sourcing$2.711OBSOLETE
Rochester ElectronicsThe BTC50010-1TAA is a power distribution IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-7, D²Pak (6 Leads + Tab) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTC50010-1TAA is currently in active production through Rochester Electronics's standard distribution channels.TO-263-7, D²Pak (6 Leads + Tab)748 In Stock$3.851ACTIVE
Infineon TechnologiesThe BTC500101TAAATMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-263-7, D²Pak (6 Leads + Tab) package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTC500101TAAATMA1 is no longer produced by Infineon Technologies; FPGACenter maintains verified stock sourced through certified supply chain partners.TO-263-7, D²Pak (6 Leads + Tab)RFQ for sourcing$11.521OBSOLETE
Infineon TechnologiesThe BTF3035EJXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTF3035EJXUMA1 is currently in active production through Infineon Technologies's standard distribution channels.8-SOIC (0.154", 3.90mm Width) Exposed Pad9.000 In Stock$0.81631ACTIVE
Rochester ElectronicsThe BTF3050EJXUMA1 is a power distribution IC manufactured by Rochester Electronics. Design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTF3050EJXUMA1 is currently in active production through Rochester Electronics's standard distribution channels.Check14.145 In Stock$0.56791ACTIVE
Infineon TechnologiesThe BTF3050TEATMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-252-5, DPak (4 Leads + Tab), TO-252AD package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTF3050TEATMA1 is currently in active production through Infineon Technologies's standard distribution channels.TO-252-5, DPak (4 Leads + Tab), TO-252AD47.751 In Stock$0.97561ACTIVE
Infineon TechnologiesThe BTF3080EJXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTF3080EJXUMA1 is currently in active production through Infineon Technologies's standard distribution channels.8-SOIC (0.154", 3.90mm Width) Exposed Pad9.000 In Stock$0.33551ACTIVE
Infineon TechnologiesThe BTF3125EJXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTF3125EJXUMA1 is currently in active production through Infineon Technologies's standard distribution channels.8-SOIC (0.154", 3.90mm Width) Exposed Pad27.259 In Stock$1.031ACTIVE
Infineon TechnologiesThe BTF500601TEAAUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a TO-252-5, DPak (4 Leads + Tab), TO-252AD package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTF500601TEAAUMA1 is currently in active production through Infineon Technologies's standard distribution channels.TO-252-5, DPak (4 Leads + Tab), TO-252AD11.177 In Stock$4.301ACTIVE
Infineon TechnologiesThe BTF60702EKVXUMA1 is a power distribution IC manufactured by Infineon Technologies. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-SOIC (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTF60702EKVXUMA1 is in last-time-buy phase; available quantities are limited, and FPGACenter accepts lifetime-supply orders.14-SOIC (0.154", 3.90mm Width) Exposed Pad7.470 In Stock$1.751LASTBUY
Infineon TechnologiesThe BTG70501EPLXUMA1 is a power distribution IC manufactured by Infineon Technologies, part of the PROFET™ series. Technical highlights include -40°C ~ 150°C (TJ) operating temperature; design review should confirm input voltage, output voltage, load current, LDO, buck, boost, or MOSFET topology when applicable, and thermal operating temperature limits. This Surface Mount component is supplied in a 14-TSSOP (0.154", 3.90mm Width) Exposed Pad package and is rated for operation across -40°C ~ 150°C (TJ). Designed for automotive electronics, industrial automation, and telecommunications equipment applications, the BTG70501EPLXUMA1 is currently in active production through Infineon Technologies's standard distribution channels.14-TSSOP (0.154", 3.90mm Width) Exposed Pad18.000 In Stock$0.21971ACTIVE
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