The FT232HPQ-TRAY is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.62V ~ 1.98V, 2.97V ~ 3.63V supply voltage, -40°C ~ 85°C (TA) operating temperature, and I²C, FIFO, JTAG, Serial, SPI, UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 56-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FT232HPQ-TRAY is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT232HQ-REEL is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.62V ~ 1.98V, 2.97V ~ 3.63V supply voltage, -40°C ~ 85°C operating temperature, and UART, FIFO interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 48-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT232HQ-REEL is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT232HQ-TRAY is an interface IC manufactured by FTDI Chip. Key technical specifications include 1.62V ~ 1.98V, 2.97V ~ 3.63V supply voltage, -40°C ~ 85°C operating temperature, and UART, FIFO interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 48-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT232HQ-TRAY is currently in active production through FTDI Chip's standard distribution channels.
The FT232RL-TUBE is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V ~ 5.25V supply voltage, -40°C ~ 85°C operating temperature, and UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 28-SSOP (0.209", 5.30mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT232RL-TUBE is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT232RQ-TRAY is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V ~ 5.25V supply voltage, -40°C ~ 85°C operating temperature, and UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT232RQ-TRAY is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT233HPQ-REEL is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.08V ~ 1.32V, 2.97V ~ 3.63V supply voltage, -40°C ~ 85°C (TA) operating temperature, and FIFO, I²C, Serial, UART, USB interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 64-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FT233HPQ-REEL is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT233HPQ-TRAY is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.08V ~ 1.32V, 2.97V ~ 3.63V supply voltage, -40°C ~ 85°C (TA) operating temperature, and FIFO, I²C, Serial, UART, USB interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 64-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FT233HPQ-TRAY is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT234XD-R is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 2.97V ~ 5.5V supply voltage, -40°C ~ 85°C operating temperature, and UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 12-VFDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT234XD-R is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT234XD-T is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 2.97V ~ 5.5V supply voltage, -40°C ~ 85°C operating temperature, and UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 12-VFDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT234XD-T is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT240XQ-R is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V ~ 5V supply voltage, -40°C ~ 85°C operating temperature, and FIFO interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 24-WFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT240XQ-R is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT240XS-R is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V ~ 5V supply voltage, -40°C ~ 85°C operating temperature, and FIFO interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 24-SSOP (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT240XS-R is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT240XS-U is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V ~ 5V supply voltage, -40°C ~ 85°C operating temperature, and FIFO interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 24-SSOP (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT240XS-U is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT245RL-REEL is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.8V ~ 5.25V supply voltage, -40°C ~ 85°C operating temperature, and FIFO interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 28-SSOP (0.209", 5.30mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT245RL-REEL is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT245RL-TUBE is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.8V ~ 5.25V supply voltage, -40°C ~ 85°C operating temperature, and FIFO interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 28-SSOP (0.209", 5.30mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT245RL-TUBE is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT245RNQ-REEL is an interface IC manufactured by FTDI Chip. Key technical specifications include 3.3V ~ 5.25V supply voltage, -40°C ~ 85°C (TA) operating temperature, and FIFO interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FT245RNQ-REEL is currently in active production through FTDI Chip's standard distribution channels.
The FT245RNQ-TRAY is an interface IC manufactured by FTDI Chip. Key technical specifications include 3.3V ~ 5.25V supply voltage, -40°C ~ 85°C (TA) operating temperature, and FIFO interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FT245RNQ-TRAY is currently in active production through FTDI Chip's standard distribution channels.
The FT245RQ-TRAY is an interface IC manufactured by FTDI Chip. Key technical specifications include 1.8V ~ 5.25V supply voltage, -40°C ~ 85°C operating temperature, and FIFO interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 32-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT245RQ-TRAY is currently in active production through FTDI Chip's standard distribution channels.
The FT260Q-R is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.8V, 2.5V, 3.3V supply voltage, -40°C ~ 85°C operating temperature, and I²C, UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 28-WFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT260Q-R is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT260Q-T is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.8V, 2.5V, 3.3V supply voltage, -40°C ~ 85°C operating temperature, and I²C, UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 28-WFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT260Q-T is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT311D-32L1C-T is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 2.97V ~ 3.63V supply voltage, -40°C ~ 85°C operating temperature, and UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 32-LQFP package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT311D-32L1C-T is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.