The FT121T-U is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V, 5V supply voltage, -40°C ~ 85°C operating temperature, and SPI interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 16-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT121T-U is no longer produced by FTDI, Future Technology Devices International Ltd; FPGACenter maintains verified stock sourced through certified supply chain partners.
The FT122Q-R is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V, 5V supply voltage, -40°C ~ 85°C operating temperature, and Parallel interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 28-WFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT122Q-R is no longer produced by FTDI, Future Technology Devices International Ltd; FPGACenter maintains verified stock sourced through certified supply chain partners.
The FT122Q-T is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V, 5V supply voltage, -40°C ~ 85°C operating temperature, and Parallel interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 28-WFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT122Q-T is no longer produced by FTDI, Future Technology Devices International Ltd; FPGACenter maintains verified stock sourced through certified supply chain partners.
The FT122T-R is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V, 5V supply voltage, -40°C ~ 85°C operating temperature, and Parallel interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 28-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT122T-R is no longer produced by FTDI, Future Technology Devices International Ltd; FPGACenter maintains verified stock sourced through certified supply chain partners.
The FT122T-U is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V, 5V supply voltage, -40°C ~ 85°C operating temperature, and Parallel interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 28-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT122T-U is no longer produced by FTDI, Future Technology Devices International Ltd; FPGACenter maintains verified stock sourced through certified supply chain partners.
The FT200XD-T is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V ~ 5V supply voltage, -40°C ~ 85°C operating temperature, and I²C interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 10-WFDFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT200XD-T is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT201XQ-T is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V ~ 5V supply voltage, -40°C ~ 85°C operating temperature, and I²C interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 16-WQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT201XQ-T is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT201XS-R is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V ~ 5V supply voltage, -40°C ~ 85°C operating temperature, and UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 16-SSOP (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT201XS-R is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT220XQ-R is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V ~ 5V supply voltage, -40°C ~ 85°C operating temperature, and FT1248 interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 16-WQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT220XQ-R is no longer produced by FTDI, Future Technology Devices International Ltd; FPGACenter maintains verified stock sourced through certified supply chain partners.
The FT221XS-R is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V ~ 5V supply voltage, -40°C ~ 85°C operating temperature, and SPI interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 20-SSOP (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT221XS-R is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT2232D-TRAY is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 4.35V ~ 5.25V supply voltage, -40°C ~ 85°C operating temperature, and UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 48-LQFP package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT2232D-TRAY is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT2232H-56Q-TRAY is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V supply voltage, -40°C ~ 85°C operating temperature, and UART, FIFO interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 56-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT2232H-56Q-TRAY is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT2232HL-REEL is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3V ~ 3.6V supply voltage, -40°C ~ 85°C operating temperature, and UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 64-LQFP package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT2232HL-REEL is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT2232HL-TRAY is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3V ~ 3.6V supply voltage, -40°C ~ 85°C operating temperature, and UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 64-LQFP package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT2232HL-TRAY is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT2232HPQ-REEL is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.62V ~ 1.98V, 2.97V ~ 3.63V supply voltage, -40°C ~ 85°C (TA) operating temperature, and I²C, FIFO, JTAG, Serial, SPI, UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 64-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FT2232HPQ-REEL is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT2232HPQ-TRAY is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.62V ~ 1.98V, 2.97V ~ 3.63V supply voltage, -40°C ~ 85°C (TA) operating temperature, and I²C, FIFO, JTAG, Serial, SPI, UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 68-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FT2232HPQ-TRAY is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT2232HQ-TRAY is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3V ~ 3.6V supply voltage, -40°C ~ 85°C operating temperature, and UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 64-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT2232HQ-TRAY is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT2233HPQ-TRAY is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 1.08V ~ 1.32V, 2.97V ~ 3.63V supply voltage, -40°C ~ 85°C (TA) operating temperature, and I²C, UART, USB interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 76-VFQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the FT2233HPQ-TRAY is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT230XQ-R is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V ~ 5V supply voltage, -40°C ~ 85°C operating temperature, and UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 16-WQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT230XQ-R is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.
The FT230XQ-T is an interface IC manufactured by FTDI, Future Technology Devices International Ltd. Key technical specifications include 3.3V ~ 5V supply voltage, -40°C ~ 85°C operating temperature, and UART interface; design review should also confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, and package fit. This standard mount component is supplied in a 16-WQFN Exposed Pad package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the FT230XQ-T is currently in active production through FTDI, Future Technology Devices International Ltd's standard distribution channels.