Component category
Configuration PROMs for FPGAs
FPGACenter stocks 536 Configuration PROMs for FPGAs part numbers across Atmel, Xilinx, and Altera. Same-day dispatch on in-stock items.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Xilinx | The XC17S15APD8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S15APD8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC17S15APD8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S15APD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC17S15ASO20C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S15ASO20C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC17S15ASO20I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-SOIC (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S15ASO20I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC17S15AVO8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S15AVO8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC17S15AVO8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S15AVO8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC17S15AVOG8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S15AVOG8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $0.0090 | 1 | OBSOLETE | ||
| Xilinx | The XC17S200APD8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S200APD8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC17S200APD8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S200APD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC17S200APDG8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S200APDG8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC17S200APDG8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S200APDG8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC17S200AVO8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S200AVO8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $20.18 | 1 | OBSOLETE | ||
| Xilinx | The XC17S200AVOG8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S200AVOG8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The XC17S200AVQ44C is an FPGA manufactured by Rochester Electronics. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 44-TQFP package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S200AVQ44C is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 44-TQFP | RFQ for sourcing | $2.87 | 1 | OBSOLETE | ||
| Rochester Electronics | The XC17S200AVQ44I is an FPGA manufactured by Rochester Electronics. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 44-TQFP package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S200AVQ44I is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 44-TQFP | RFQ for sourcing | $3.30 | 1 | OBSOLETE | ||
| Xilinx | The XC17S20PD8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S20PD8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $13.05 | 1 | OBSOLETE | ||
| Xilinx | The XC17S20VO8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S20VO8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $16.17 | 1 | OBSOLETE | ||
| Xilinx | The XC17S20VO8I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S20VO8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $19.15 | 1 | OBSOLETE | ||
| Xilinx | The XC17S20XLPD8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S20XLPD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $9.59 | 1 | OBSOLETE | ||
| Xilinx | The XC17S20XLVO8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17S20XLVO8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $9.85 | 1 | OBSOLETE |