Component category
Configuration PROMs for FPGAs
FPGACenter stocks 536 Configuration PROMs for FPGAs part numbers across Atmel, Xilinx, and Altera. Same-day dispatch on in-stock items.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Rochester Electronics | The XC17256ELVO8C is an FPGA manufactured by Rochester Electronics. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17256ELVO8C is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | $9.40 | 1 | OBSOLETE | ||
| Xilinx | The XC17256ELVO8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17256ELVO8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The XC17256EPC20C is an FPGA manufactured by Rochester Electronics. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17256EPC20C is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-LCC (J-Lead) | RFQ for sourcing | $13.61 | 1 | OBSOLETE | ||
| Rochester Electronics | The XC17256EPC20I is an FPGA manufactured by Rochester Electronics. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17256EPC20I is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-LCC (J-Lead) | RFQ for sourcing | $16.99 | 1 | OBSOLETE | ||
| Xilinx | The XC17256EPCG20C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17256EPCG20C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-LCC (J-Lead) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC17256EPD8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17256EPD8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | $0.0090 | 1 | OBSOLETE | ||
| Xilinx | The XC17256EPD8I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17256EPD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC17256EPDG8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17256EPDG8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC17256EVO8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17256EVO8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC17256EVO8I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17256EVO8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Rochester Electronics | The XC1736EPC20C is an FPGA manufactured by Rochester Electronics. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1736EPC20C is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-LCC (J-Lead) | RFQ for sourcing | $29.80 | 1 | OBSOLETE | ||
| Xilinx | The XC1736EPC20I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1736EPC20I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 20-LCC (J-Lead) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC1736EPD8I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1736EPD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC1736EPDG8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1736EPDG8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-DIP (0.300", 7.62mm) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC1736ESO8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1736ESO8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC1736ESO8I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1736ESO8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC1736ESOG8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1736ESOG8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC1736EVO8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1736EVO8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC1736EVO8I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1736EVO8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Xilinx | The XC1736EVOG8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1736EVOG8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-SOIC (0.154", 3.90mm Width) | RFQ for sourcing | RFQ | 1 | OBSOLETE |