Hard-to-find, EOL, and shortage parts24h target RFQ responseInspection, traceability, and alternate sourcing
Component category

Configuration PROMs for FPGAs

FPGACenter stocks 536 Configuration PROMs for FPGAs part numbers across Atmel, Xilinx, and Altera. Same-day dispatch on in-stock items.

Part NumberManufacturerDescriptionPackageStockPriceMOQStatus
Rochester ElectronicsThe XC1704LVQ44C is an FPGA manufactured by Rochester Electronics. Design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC1704LVQ44C is currently in active production through Rochester Electronics's standard distribution channels.Check1.535 In StockRFQ1ACTIVE
XilinxThe XC17128ELPC20C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17128ELPC20C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners.20-LCC (J-Lead)RFQ for sourcingRFQ1OBSOLETE
XilinxThe XC17128ELPC20I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17128ELPC20I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners.20-LCC (J-Lead)RFQ for sourcingRFQ1OBSOLETE
XilinxThe XC17128ELPD8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17128ELPD8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners.8-DIP (0.300", 7.62mm)RFQ for sourcingRFQ1OBSOLETE
XilinxThe XC17128ELPD8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17128ELPD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners.8-DIP (0.300", 7.62mm)RFQ for sourcing$64.141OBSOLETE
Rochester ElectronicsThe XC17128ELVO8C is an FPGA manufactured by Rochester Electronics. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17128ELVO8C is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.8-SOIC (0.154", 3.90mm Width)RFQ for sourcing$6.171OBSOLETE
XilinxThe XC17128ELVO8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17128ELVO8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners.8-SOIC (0.154", 3.90mm Width)RFQ for sourcingRFQ1OBSOLETE
XilinxThe XC17128EPC20C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17128EPC20C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners.20-LCC (J-Lead)RFQ for sourcingRFQ1OBSOLETE
XilinxThe XC17128EPC20I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17128EPC20I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners.20-LCC (J-Lead)RFQ for sourcing$2.431OBSOLETE
Rochester ElectronicsThe XC17128EPCG20C is an FPGA manufactured by Rochester Electronics. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17128EPCG20C is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.20-LCC (J-Lead)RFQ for sourcing$6.931OBSOLETE
XilinxThe XC17128EPD8I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17128EPD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners.8-DIP (0.300", 7.62mm)RFQ for sourcingRFQ1OBSOLETE
XilinxThe XC17128EPDG8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17128EPDG8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners.8-DIP (0.300", 7.62mm)RFQ for sourcingRFQ1OBSOLETE
XilinxThe XC17128EVO8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17128EVO8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners.8-SOIC (0.154", 3.90mm Width)RFQ for sourcing$30.761OBSOLETE
XilinxThe XC17128EVO8I is an FPGA manufactured by Xilinx. Technical highlights include 4.5V ~ 5.5V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17128EVO8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners.8-SOIC (0.154", 3.90mm Width)RFQ for sourcingRFQ1OBSOLETE
XilinxThe XC17128EVOG8C is an FPGA manufactured by Xilinx. Technical highlights include 4.75V ~ 5.25V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 8-SOIC (0.154", 3.90mm Width) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17128EVOG8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners.8-SOIC (0.154", 3.90mm Width)RFQ for sourcingRFQ1OBSOLETE
Rochester ElectronicsThe XC17256EL-VO8C0100 is an FPGA manufactured by Rochester Electronics. Design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17256EL-VO8C0100 is currently in active production through Rochester Electronics's standard distribution channels.Check39.537 In Stock$4.501ACTIVE
Rochester ElectronicsThe XC17256ELPC20C is an FPGA manufactured by Rochester Electronics. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17256ELPC20C is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners.20-LCC (J-Lead)RFQ for sourcing$8.691OBSOLETE
XilinxThe XC17256ELPC20I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 20-LCC (J-Lead) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17256ELPC20I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners.20-LCC (J-Lead)RFQ for sourcingRFQ1OBSOLETE
XilinxThe XC17256ELPD8C is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17256ELPD8C is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners.8-DIP (0.300", 7.62mm)RFQ for sourcingRFQ1OBSOLETE
XilinxThe XC17256ELPD8I is an FPGA manufactured by Xilinx. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 8-DIP (0.300", 7.62mm) package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the XC17256ELPD8I is no longer produced by Xilinx; FPGACenter maintains verified stock sourced through certified supply chain partners.8-DIP (0.300", 7.62mm)RFQ for sourcingRFQ1OBSOLETE
Get Quote