Component category
MCU, MPU & FPGA Modules
FPGACenter stocks 551 MCU, MPU & FPGA Modules part numbers across Trenz Electronic, Digi International, and Advantech. No MOQ, fast global shipping.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Digi International | The DC-ME9-01-C-50 is an FPGA manufactured by Digi International. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a standard package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the DC-ME9-01-C-50 is no longer produced by Digi International; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Digi International | The DC-ME9-01-JT is an FPGA manufactured by Digi International. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a standard package and is rated for operation across -40°C ~ 85°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the DC-ME9-01-JT is no longer produced by Digi International; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| DLP Design Inc. | The DLP-HS-FPGA is an FPGA manufactured by DLP Design Inc.. Technical highlights include 0°C ~ 70°C operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This standard mount component is supplied in a standard package and is rated for operation across 0°C ~ 70°C. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the DLP-HS-FPGA is no longer produced by DLP Design Inc.; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| DAVE Embedded Systems | The DOH5210C is an FPGA manufactured by DAVE Embedded Systems. Design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the DOH5210C is currently in active production through DAVE Embedded Systems's standard distribution channels. | Check | 2.703 In Stock | $1001.68 | 1 | ACTIVE | ||
| Rochester Electronics | The DS2250-8-8 is an FPGA manufactured by Rochester Electronics. Technical highlights include 0°C ~ 70°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Surface Mount component is supplied in a 40-SIMM package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the DS2250-8-8 is currently in active production through Rochester Electronics's standard distribution channels. | 40-SIMM | 1.641 In Stock | $454.25 | 1 | ACTIVE | ||
| Rochester Electronics | The DS5000T-8-12 is an FPGA manufactured by Rochester Electronics. Technical highlights include 0°C ~ 70°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 40-DIP Module (0.610", 15.495mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the DS5000T-8-12 is currently in active production through Rochester Electronics's standard distribution channels. | 40-DIP Module (0.610", 15.495mm) | 19.152 In Stock | $59.99 | 1 | ACTIVE | ||
| Rochester Electronics | The DS5000T-8-8 is an FPGA manufactured by Rochester Electronics. Technical highlights include 0°C ~ 70°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This Through Hole component is supplied in a 40-DIP Module (0.610", 15.495mm) package and is rated for operation across 0°C ~ 70°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the DS5000T-8-8 is currently in active production through Rochester Electronics's standard distribution channels. | 40-DIP Module (0.610", 15.495mm) | 1.799 In Stock | $9.61 | 1 | ACTIVE | ||
| Wandboard.Org | The EDM1-IMX6QP-MSD-BW is an FPGA manufactured by Wandboard.Org. Design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EDM1-IMX6QP-MSD-BW is currently in active production through Wandboard.Org's standard distribution channels. | Check | 1.081 In Stock | $307.08 | 1 | ACTIVE | ||
| Wandboard.Org | The EDM1-IMX6S-MSD is an FPGA manufactured by Wandboard.Org. Design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the EDM1-IMX6S-MSD is currently in active production through Wandboard.Org's standard distribution channels. | Check | 629 In Stock | $171.72 | 1 | ACTIVE | ||
| Espressif | The ESP32-S3-WROOM-1-N16R8 is an FPGA manufactured by Espressif. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This SMD component is supplied in a Module package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the ESP32-S3-WROOM-1-N16R8 is currently in active production through Espressif's standard distribution channels. | Module | 500 In Stock | $3.50 | 5 | ACTIVE | ||
| Espressif | The ESP32-WROOM-32E is an FPGA manufactured by Espressif. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This SMD component is supplied in a Module package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the ESP32-WROOM-32E is currently in active production through Espressif's standard distribution channels. | Module | 20.000 In Stock | $2.10 | 1 | ACTIVE | ||
| Espressif | The ESP8266EX is an FPGA manufactured by Espressif. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits. This SMD component is supplied in a QFN-32 package and is rated for operation across -40°C ~ 85°C (TA). Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the ESP8266EX is currently in active production through Espressif's standard distribution channels. | QFN-32 | 50.000 In Stock | $1.00 | 10 | ACTIVE | ||
| Numato Lab | The FPGA010A-FT is an FPGA manufactured by Numato Lab. Design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a Retail Package package suitable for both prototyping and production builds. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the FPGA010A-FT is currently in active production through Numato Lab's standard distribution channels. | Retail Package | 610 In Stock | $1297.48 | 1 | ACTIVE | ||
| Numato Lab | The FPGA010A-SS is an FPGA manufactured by Numato Lab. Design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a Retail Package package suitable for both prototyping and production builds. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the FPGA010A-SS is currently in active production through Numato Lab's standard distribution channels. | Retail Package | 2.076 In Stock | $1297.48 | 1 | ACTIVE | ||
| Digi International | The FS-3000 is an FPGA manufactured by Digi International. Design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the FS-3000 is no longer produced by Digi International; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $518.00 | 1 | OBSOLETE | ||
| Digi International | The FS-3001 is an FPGA manufactured by Digi International. Design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the FS-3001 is no longer produced by Digi International; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $378.00 | 1 | OBSOLETE | ||
| Digi International | The FS-3002 is an FPGA manufactured by Digi International. Design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the FS-3002 is no longer produced by Digi International; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | $510.00 | 1 | OBSOLETE | ||
| Digi International | The FS-3003 is an FPGA manufactured by Digi International. Design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the FS-3003 is no longer produced by Digi International; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Digi International | The FS-3004 is an FPGA manufactured by Digi International. Design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the FS-3004 is no longer produced by Digi International; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Digi International | The FS-3005 is an FPGA manufactured by Digi International. Design review should confirm logic resources, I/O planning, clock constraints, package escape routing, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This standard mount component is supplied in a standard package suitable for both prototyping and production builds. Designed for 5G infrastructure, AI accelerators, and data center fabrics applications, the FS-3005 is no longer produced by Digi International; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE |