Component category
Bus Interface
Find Bus Interface from Texas Instruments, Rochester, and additional brands. 5,443 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| NXP Semiconductors | The GTL2012DC,125 is a bus interface IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 8-VFSOP (0.091", 2.30mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the GTL2012DC,125 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 8-VFSOP (0.091", 2.30mm Width) | RFQ for sourcing | $1.60 | 1 | OBSOLETE | ||
| Rochester Electronics | The GTL2014PW,112-NXP is a bus interface IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for networking equipment, industrial automation, and telecommunications applications, the GTL2014PW,112-NXP is currently in active production through Rochester Electronics's standard distribution channels. | Check | 46.302 In Stock | $0.3690 | 1 | ACTIVE | ||
| NXP Semiconductors | The GTL2014PW,118 is a bus interface IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 14-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the GTL2014PW,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 14-TSSOP (0.173", 4.40mm Width) | RFQ for sourcing | $0.4320 | 1 | OBSOLETE | ||
| NXP Semiconductors | The GTL2014PWZ is a bus interface IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 14-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the GTL2014PWZ is currently in active production through NXP Semiconductors's standard distribution channels. | 14-TSSOP (0.173", 4.40mm Width) | 36.007 In Stock | $0.4553 | 1 | ACTIVE | ||
| NXP Semiconductors | The GTL2018PW,112 is a bus interface IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 24-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the GTL2018PW,112 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TSSOP (0.173", 4.40mm Width) | RFQ for sourcing | $2.55 | 1 | OBSOLETE | ||
| NXP Semiconductors | The GTL2018PW,118 is a bus interface IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 24-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the GTL2018PW,118 is currently in active production through NXP Semiconductors's standard distribution channels. | 24-TSSOP (0.173", 4.40mm Width) | 7.500 In Stock | $1.07 | 1 | ACTIVE | ||
| NXP Semiconductors | The GTL2018PW/Q900,118 is a bus interface IC manufactured by NXP Semiconductors. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 24-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the GTL2018PW/Q900,118 is no longer produced by NXP Semiconductors; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-TSSOP (0.173", 4.40mm Width) | RFQ for sourcing | $0.9775 | 1 | OBSOLETE | ||
| Rochester Electronics | The GTL2107PW,112 is a bus interface IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 28-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the GTL2107PW,112 is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-TSSOP (0.173", 4.40mm Width) | RFQ for sourcing | $1.52 | 1 | OBSOLETE | ||
| Onsemi | The GTLP10B320MTD is a bus interface IC manufactured by Onsemi. Technical highlights include 3.15V ~ 3.45V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 56-TFSOP (0.240", 6.10mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the GTLP10B320MTD is no longer produced by Onsemi; FPGACenter maintains verified stock sourced through certified supply chain partners. | 56-TFSOP (0.240", 6.10mm Width) | RFQ for sourcing | $6.52 | 1 | OBSOLETE | ||
| Rochester Electronics | The GTLP10B320MTDX is a bus interface IC manufactured by Rochester Electronics. Technical highlights include 3.15V ~ 3.45V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 56-TFSOP (0.240", 6.10mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the GTLP10B320MTDX is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 56-TFSOP (0.240", 6.10mm Width) | RFQ for sourcing | $7.16 | 1 | OBSOLETE | ||
| Rochester Electronics | The GTLP16612MEA is a bus interface IC manufactured by Rochester Electronics. Technical highlights include 3.15V ~ 3.45V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 56-BSSOP (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the GTLP16612MEA is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 56-BSSOP (0.295", 7.50mm Width) | RFQ for sourcing | $4.72 | 1 | OBSOLETE | ||
| Rochester Electronics | The GTLP16612MEAX is a bus interface IC manufactured by Rochester Electronics. Technical highlights include 3.15V ~ 3.45V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 56-BSSOP (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the GTLP16612MEAX is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 56-BSSOP (0.295", 7.50mm Width) | RFQ for sourcing | $5.91 | 1 | OBSOLETE | ||
| Rochester Electronics | The GTLP16612MTD is a bus interface IC manufactured by Rochester Electronics. Technical highlights include 3.15V ~ 3.45V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 56-TFSOP (0.240", 6.10mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the GTLP16612MTD is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 56-TFSOP (0.240", 6.10mm Width) | RFQ for sourcing | $5.51 | 1 | OBSOLETE | ||
| Rochester Electronics | The GTLP16612MTDX is a bus interface IC manufactured by Rochester Electronics. Technical highlights include 3.15V ~ 3.45V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 56-TFSOP (0.240", 6.10mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the GTLP16612MTDX is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 56-TFSOP (0.240", 6.10mm Width) | RFQ for sourcing | $11.90 | 1 | OBSOLETE | ||
| Rochester Electronics | The GTLP16616MTDX is a bus interface IC manufactured by Rochester Electronics. Technical highlights include 3.15V ~ 3.45V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 56-TFSOP (0.240", 6.10mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the GTLP16616MTDX is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 56-TFSOP (0.240", 6.10mm Width) | RFQ for sourcing | $4.89 | 1 | OBSOLETE | ||
| Rochester Electronics | The GTLP16T1655MTD is a bus interface IC manufactured by Rochester Electronics. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 64-TFSOP (0.240", 6.10mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the GTLP16T1655MTD is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-TFSOP (0.240", 6.10mm Width) | RFQ for sourcing | $8.60 | 1 | OBSOLETE | ||
| Rochester Electronics | The GTLP16T1655MTDX is a bus interface IC manufactured by Rochester Electronics. Technical highlights include 3V ~ 3.6V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 64-TFSOP (0.240", 6.10mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the GTLP16T1655MTDX is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 64-TFSOP (0.240", 6.10mm Width) | RFQ for sourcing | $8.60 | 1 | OBSOLETE | ||
| Rochester Electronics | The GTLP18T612GX is a bus interface IC manufactured by Rochester Electronics. Technical highlights include 3.15V ~ 3.45V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 54-LFBGA package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the GTLP18T612GX is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 54-LFBGA | RFQ for sourcing | $8.03 | 1 | OBSOLETE | ||
| Rochester Electronics | The GTLP18T612MEA is a bus interface IC manufactured by Rochester Electronics. Technical highlights include 3.15V ~ 3.45V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 56-BSSOP (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the GTLP18T612MEA is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 56-BSSOP (0.295", 7.50mm Width) | RFQ for sourcing | $8.91 | 1 | OBSOLETE | ||
| Rochester Electronics | The GTLP18T612MEAX is a bus interface IC manufactured by Rochester Electronics. Technical highlights include 3.15V ~ 3.45V supply voltage and -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 56-BSSOP (0.295", 7.50mm Width) package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the GTLP18T612MEAX is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 56-BSSOP (0.295", 7.50mm Width) | RFQ for sourcing | $8.91 | 1 | OBSOLETE |