Component category
Bus Interface
Find Bus Interface from Texas Instruments, Rochester, and additional brands. 5,443 part numbers available at FPGACenter. No MOQ, IDEA-1010 inspected.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Analog Devices | The ADG3301BKSZ-REEL7 is a bus interface IC manufactured by Analog Devices. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 6-TSSOP, SC-88, SOT-363 package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3301BKSZ-REEL7 is currently in active production through Analog Devices's standard distribution channels. | 6-TSSOP, SC-88, SOT-363 | 21.945 In Stock | $1.20 | 1 | ACTIVE | ||
| Rochester Electronics | The ADG3304BCB-REEL7 is a bus interface IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 12-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C. Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3304BCB-REEL7 is currently in active production through Rochester Electronics's standard distribution channels. | 12-UFBGA, WLCSP | 14.142 In Stock | $1.15 | 1 | ACTIVE | ||
| Analog Devices | The ADG3304BCBZ-REEL is a bus interface IC manufactured by Analog Devices. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 12-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3304BCBZ-REEL is no longer produced by Analog Devices; FPGACenter maintains verified stock sourced through certified supply chain partners. | 12-UFBGA, WLCSP | RFQ for sourcing | $0.0090 | 1 | OBSOLETE | ||
| Analog Devices | The ADG3304BCBZ-REEL7 is a bus interface IC manufactured by Analog Devices. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 12-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3304BCBZ-REEL7 is currently in active production through Analog Devices's standard distribution channels. | 12-UFBGA, WLCSP | 20.909 In Stock | $0.6107 | 1 | ACTIVE | ||
| Analog Devices | The ADG3304BCPZ-REEL is a bus interface IC manufactured by Analog Devices. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 20-WFQFN Exposed Pad, CSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3304BCPZ-REEL is currently in active production through Analog Devices's standard distribution channels. | 20-WFQFN Exposed Pad, CSP | 14.094 In Stock | $4.08 | 1 | ACTIVE | ||
| Analog Devices | The ADG3304BCPZ-REEL7 is a bus interface IC manufactured by Analog Devices. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 20-WFQFN Exposed Pad, CSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3304BCPZ-REEL7 is currently in active production through Analog Devices's standard distribution channels. | 20-WFQFN Exposed Pad, CSP | 7.790 In Stock | $4.08 | 1 | ACTIVE | ||
| Analog Devices | The ADG3304BRUZ is a bus interface IC manufactured by Analog Devices. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 14-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3304BRUZ is currently in active production through Analog Devices's standard distribution channels. | 14-TSSOP (0.173", 4.40mm Width) | 14.916 In Stock | $4.27 | 1 | ACTIVE | ||
| Analog Devices | The ADG3304BRUZ-REEL is a bus interface IC manufactured by Analog Devices. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 14-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3304BRUZ-REEL is currently in active production through Analog Devices's standard distribution channels. | 14-TSSOP (0.173", 4.40mm Width) | 18.000 In Stock | $1.77 | 1 | ACTIVE | ||
| Analog Devices | The ADG3304BRUZ-REEL7 is a bus interface IC manufactured by Analog Devices. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 14-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3304BRUZ-REEL7 is currently in active production through Analog Devices's standard distribution channels. | 14-TSSOP (0.173", 4.40mm Width) | 9.138 In Stock | $4.27 | 1 | ACTIVE | ||
| Analog Devices | The ADG3304SRU-EP-RL7 is a bus interface IC manufactured by Analog Devices. Technical highlights include -55°C ~ 125°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 14-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -55°C ~ 125°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3304SRU-EP-RL7 is no longer produced by Analog Devices; FPGACenter maintains verified stock sourced through certified supply chain partners. | 14-TSSOP (0.173", 4.40mm Width) | RFQ for sourcing | $37.51 | 1 | OBSOLETE | ||
| Analog Devices | The ADG3304SRUZ-EP-RL7 is a bus interface IC manufactured by Analog Devices. Technical highlights include -55°C ~ 125°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 14-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -55°C ~ 125°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3304SRUZ-EP-RL7 is currently in active production through Analog Devices's standard distribution channels. | 14-TSSOP (0.173", 4.40mm Width) | 6.699 In Stock | $10.14 | 1 | ACTIVE | ||
| Analog Devices | The ADG3304WBRUZ-REEL is a bus interface IC manufactured by Analog Devices. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 14-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3304WBRUZ-REEL is currently in active production through Analog Devices's standard distribution channels. | 14-TSSOP (0.173", 4.40mm Width) | 6.476 In Stock | $1.61 | 1 | ACTIVE | ||
| Analog Devices | The ADG3308BCBZ-1-REEL is a bus interface IC manufactured by Analog Devices. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 20-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3308BCBZ-1-REEL is currently in active production through Analog Devices's standard distribution channels. | 20-UFBGA, WLCSP | 1.127 In Stock | $10.40 | 1 | ACTIVE | ||
| Analog Devices | The ADG3308BCBZ-1-RL7 is a bus interface IC manufactured by Analog Devices. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 20-UFBGA, WLCSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3308BCBZ-1-RL7 is currently in active production through Analog Devices's standard distribution channels. | 20-UFBGA, WLCSP | 46.914 In Stock | $2.47 | 1 | ACTIVE | ||
| Analog Devices | The ADG3308BCPZ-REEL is a bus interface IC manufactured by Analog Devices. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 20-WFQFN Exposed Pad, CSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3308BCPZ-REEL is currently in active production through Analog Devices's standard distribution channels. | 20-WFQFN Exposed Pad, CSP | 36.000 In Stock | $4.24 | 1 | ACTIVE | ||
| Analog Devices | The ADG3308BCPZ-REEL7 is a bus interface IC manufactured by Analog Devices. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 20-WFQFN Exposed Pad, CSP package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3308BCPZ-REEL7 is currently in active production through Analog Devices's standard distribution channels. | 20-WFQFN Exposed Pad, CSP | 18.979 In Stock | $2.47 | 1 | ACTIVE | ||
| Rochester Electronics | The ADG3308BRUZ is a bus interface IC manufactured by Rochester Electronics. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 20-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3308BRUZ is currently in active production through Rochester Electronics's standard distribution channels. | 20-TSSOP (0.173", 4.40mm Width) | 5.646 In Stock | $6.16 | 1 | ACTIVE | ||
| Analog Devices | The ADG3308BRUZ-REEL is a bus interface IC manufactured by Analog Devices. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 20-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3308BRUZ-REEL is currently in active production through Analog Devices's standard distribution channels. | 20-TSSOP (0.173", 4.40mm Width) | 6.036 In Stock | $6.16 | 1 | ACTIVE | ||
| Analog Devices | The ADG3308BRUZ-REEL7 is a bus interface IC manufactured by Analog Devices. Technical highlights include -40°C ~ 85°C (TA) operating temperature; design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits. This Surface Mount component is supplied in a 20-TSSOP (0.173", 4.40mm Width) package and is rated for operation across -40°C ~ 85°C (TA). Designed for networking equipment, industrial automation, and telecommunications applications, the ADG3308BRUZ-REEL7 is currently in active production through Analog Devices's standard distribution channels. | 20-TSSOP (0.173", 4.40mm Width) | 10.650 In Stock | $2.18 | 1 | ACTIVE | ||
| Rochester Electronics | The ADG507AKR-REEL is a bus interface IC manufactured by Rochester Electronics. Design review should confirm SPI, I2C, UART, CAN bus, USB, or Ethernet interface requirements, signal integrity, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This Surface Mount component is supplied in a 28-SOIC (0.295", 7.50mm Width) package suitable for both prototyping and production builds. Designed for networking equipment, industrial automation, and telecommunications applications, the ADG507AKR-REEL is no longer produced by Rochester Electronics; FPGACenter maintains verified stock sourced through certified supply chain partners. | 28-SOIC (0.295", 7.50mm Width) | RFQ for sourcing | $0.9000 | 1 | OBSOLETE |