Component category
Application Specific Processors
FPGACenter stocks 8,264 Application Specific Processors part numbers across Skyworks, Renesas, and Microchip. Volume pricing, no minimum order.
| Part Number ↑ | Manufacturer | Description | Package | Stock | Price | MOQ | Status | |
|---|---|---|---|---|---|---|---|---|
| Renesas | The BBT3821LP-JH is an application-specific processor manufactured by Renesas. Technical highlights include 1.3V ~ 2.5V supply voltage; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This Surface Mount component is supplied in a 192-EBGA package and is rated for operation across 0°C ~ 70°C. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BBT3821LP-JH is no longer produced by Renesas; FPGACenter maintains verified stock sourced through certified supply chain partners. | 192-EBGA | RFQ for sourcing | $59.67 | 1 | OBSOLETE | ||
| Broadcom Limited | The BCM55030SB01 is an application-specific processor manufactured by Broadcom Limited. Design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BCM55030SB01 is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Broadcom Limited | The BCM8322SAIFBG is an application-specific processor manufactured by Broadcom Limited. Design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BCM8322SAIFBG is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Broadcom Limited | The BCM8322SBIFBG is an application-specific processor manufactured by Broadcom Limited. Design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BCM8322SBIFBG is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Broadcom Limited | The BCM8324AIFBG is an application-specific processor manufactured by Broadcom Limited. Design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BCM8324AIFBG is no longer produced by Broadcom Limited; FPGACenter maintains verified stock sourced through certified supply chain partners. | Check | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| Broadcom Limited | The BCM8324BIFBG is an application-specific processor manufactured by Broadcom Limited. Design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BCM8324BIFBG is currently in active production through Broadcom Limited's standard distribution channels. | Check | 2.459 In Stock | $5.76 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU2285FV-E2 is an application-specific processor manufactured by ROHM Semiconductor. Technical highlights include 3V ~ 3.6V supply voltage; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This Surface Mount component is supplied in a 24-LSSOP (0.220", 5.60mm Width) package and is rated for operation across -5°C ~ 70°C. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BU2285FV-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners. | 24-LSSOP (0.220", 5.60mm Width) | RFQ for sourcing | $89.99 | 1 | OBSOLETE | ||
| ROHM Semiconductor | The BU2360FV-FE2 is an application-specific processor manufactured by ROHM Semiconductor. Design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BU2360FV-FE2 is currently in active production through ROHM Semiconductor's standard distribution channels. | Check | 1.530 In Stock | $2.48 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU2362FV-E2 is an application-specific processor manufactured by ROHM Semiconductor. Technical highlights include 2.7V ~ 3.6V supply voltage; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -25°C ~ 85°C. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BU2362FV-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 16-LSSOP (0.173", 4.40mm Width) | 1.550 In Stock | $1.30 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU2363FV-E2 is an application-specific processor manufactured by ROHM Semiconductor. Technical highlights include 3V ~ 3.6V supply voltage; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This Surface Mount component is supplied in a 16-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -10°C ~ 70°C. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BU2363FV-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners. | 16-LSSOP (0.173", 4.40mm Width) | RFQ for sourcing | $4.95 | 1 | OBSOLETE | ||
| ROHM Semiconductor | The BU2365FV-E2 is an application-specific processor manufactured by ROHM Semiconductor. Design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits, plus genuine factory-marked silicon, original packaging, and full lot/date code traceability. This - component is supplied in a standard package suitable for both prototyping and production builds. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BU2365FV-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | Check | 5.988 In Stock | $2.99 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU2373FV-E2 is an application-specific processor manufactured by ROHM Semiconductor. Technical highlights include 3V ~ 5V supply voltage; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This Surface Mount component is supplied in a 14-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -20°C ~ 75°C. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BU2373FV-E2 is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners. | 14-LSSOP (0.173", 4.40mm Width) | RFQ for sourcing | $9.31 | 1 | OBSOLETE | ||
| ROHM Semiconductor | The BU2374FV-E2 is an application-specific processor manufactured by ROHM Semiconductor. Technical highlights include 3.3V supply voltage; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This Surface Mount component is supplied in a 14-LSSOP (0.173", 4.40mm Width) package and is rated for operation across -20°C ~ 75°C. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BU2374FV-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 14-LSSOP (0.173", 4.40mm Width) | 1.973 In Stock | RFQ | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU2394KN-E2 is an application-specific processor manufactured by ROHM Semiconductor. Technical highlights include 3V ~ 3.6V supply voltage; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This Surface Mount component is supplied in a 20-VFQFN Exposed Pad package and is rated for operation across -5°C ~ 70°C. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BU2394KN-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 20-VFQFN Exposed Pad | 1.550 In Stock | $1.30 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU2396KN-E2 is an application-specific processor manufactured by ROHM Semiconductor. Technical highlights include 3V ~ 3.6V supply voltage; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This Surface Mount component is supplied in a 20-VFQFN Exposed Pad package and is rated for operation across -5°C ~ 70°C. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BU2396KN-E2 is currently in active production through ROHM Semiconductor's standard distribution channels. | 20-VFQFN Exposed Pad | 1.545 In Stock | $1.51 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU3071HFV-TR is an application-specific processor manufactured by ROHM Semiconductor. Technical highlights include 3V ~ 3.6V supply voltage; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This Surface Mount component is supplied in a 6-SMD, Flat Lead Exposed Pad package and is rated for operation across -5°C ~ 75°C. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BU3071HFV-TR is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners. | 6-SMD, Flat Lead Exposed Pad | RFQ for sourcing | RFQ | 1 | OBSOLETE | ||
| ROHM Semiconductor | The BU3072HFV-TR is an application-specific processor manufactured by ROHM Semiconductor. Technical highlights include 3V ~ 3.6V supply voltage; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This Surface Mount component is supplied in a 6-SMD, Flat Lead Exposed Pad package and is rated for operation across -5°C ~ 75°C. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BU3072HFV-TR is currently in active production through ROHM Semiconductor's standard distribution channels. | 6-SMD, Flat Lead Exposed Pad | 1.994 In Stock | $3.70 | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU3073HFV-TR is an application-specific processor manufactured by ROHM Semiconductor. Technical highlights include 3V ~ 3.6V supply voltage; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This Surface Mount component is supplied in a 6-SMD, Flat Lead Exposed Pad package and is rated for operation across -5°C ~ 75°C. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BU3073HFV-TR is no longer produced by ROHM Semiconductor; FPGACenter maintains verified stock sourced through certified supply chain partners. | 6-SMD, Flat Lead Exposed Pad | RFQ for sourcing | $0.2017 | 1 | OBSOLETE | ||
| ROHM Semiconductor | The BU3076HFV-TR is an application-specific processor manufactured by ROHM Semiconductor. Technical highlights include 2.85V ~ 3.6V supply voltage; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This Surface Mount component is supplied in a 6-SMD, Flat Lead Exposed Pad package and is rated for operation across -5°C ~ 75°C. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BU3076HFV-TR is currently in active production through ROHM Semiconductor's standard distribution channels. | 6-SMD, Flat Lead Exposed Pad | 899 In Stock | RFQ | 1 | ACTIVE | ||
| ROHM Semiconductor | The BU7322HFV-TR is an application-specific processor manufactured by ROHM Semiconductor. Technical highlights include 2.85V ~ 3.6V supply voltage; design review should confirm GPIO, SPI, I2C, UART, ADC peripherals, clock speed, Flash memory, package fit, and operating temperature limits. This Surface Mount component is supplied in a 6-SMD, Flat Lead Exposed Pad package and is rated for operation across -5°C ~ 75°C. Designed for IoT endpoints, consumer electronics, and industrial automation applications, the BU7322HFV-TR is currently in active production through ROHM Semiconductor's standard distribution channels. | 6-SMD, Flat Lead Exposed Pad | 665 In Stock | $3.50 | 1 | ACTIVE |